JPH0442836B2 - - Google Patents

Info

Publication number
JPH0442836B2
JPH0442836B2 JP60001670A JP167085A JPH0442836B2 JP H0442836 B2 JPH0442836 B2 JP H0442836B2 JP 60001670 A JP60001670 A JP 60001670A JP 167085 A JP167085 A JP 167085A JP H0442836 B2 JPH0442836 B2 JP H0442836B2
Authority
JP
Japan
Prior art keywords
resin
light emitting
group
emitting device
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60001670A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61160981A (ja
Inventor
Atsushi Kurita
Hiroshi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Japan LLC
Original Assignee
Toshiba Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Silicone Co Ltd filed Critical Toshiba Silicone Co Ltd
Priority to JP60001670A priority Critical patent/JPS61160981A/ja
Publication of JPS61160981A publication Critical patent/JPS61160981A/ja
Publication of JPH0442836B2 publication Critical patent/JPH0442836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP60001670A 1985-01-08 1985-01-08 樹脂封止型発光装置及びその製造方法 Granted JPS61160981A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60001670A JPS61160981A (ja) 1985-01-08 1985-01-08 樹脂封止型発光装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60001670A JPS61160981A (ja) 1985-01-08 1985-01-08 樹脂封止型発光装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS61160981A JPS61160981A (ja) 1986-07-21
JPH0442836B2 true JPH0442836B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-07-14

Family

ID=11507951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60001670A Granted JPS61160981A (ja) 1985-01-08 1985-01-08 樹脂封止型発光装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPS61160981A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3936151B2 (ja) * 2000-05-08 2007-06-27 双葉電子工業株式会社 有機ｅｌ素子
JP4023655B2 (ja) 2001-11-07 2007-12-19 双葉電子工業株式会社 透明膜状乾燥剤及び透明液状乾燥剤
JP2013140848A (ja) * 2011-12-28 2013-07-18 Nitto Denko Corp 封止用シートおよび光半導体素子装置
US9349927B2 (en) 2011-10-18 2016-05-24 Nitto Denko Corporation Encapsulating sheet and optical semiconductor element device
JP2014039006A (ja) * 2012-02-27 2014-02-27 Mitsubishi Chemicals Corp 波長変換部材及びこれを用いた半導体発光装置

Also Published As

Publication number Publication date
JPS61160981A (ja) 1986-07-21

Similar Documents

Publication Publication Date Title
EP0195846B1 (en) Photo-curable epoxy resin type composition and curing process
EP0091131B1 (en) Photo-curable epoxy resin composition
TW581776B (en) Energy-ray curing resin composition
US4406764A (en) Photo-curable epoxy resin composition with organic aluminum and α-ketosilyl compounds
JPS6067531A (ja) 樹脂組成物
EP0123842B1 (en) Photo-curable epoxy resin type composition
JPH02196812A (ja) カチオン重合性組成物、重合触媒および重合方法
JPH0442836B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN102432840A (zh) 聚丙二醇二缩水甘油醚二丙烯酸酯作为预聚物制备的立体光刻快速成型光敏树脂及制备方法
JP2001527590A (ja) ステレオリソグラフィのための耐熱性ポリマー
JPH0761964A (ja) 新規オニウム塩、光重合開始剤、これを含有するエネルギー線硬化性組成物及びその硬化物
JPH0549695B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS61159753A (ja) 樹脂封止型発光装置及びその製造方法
CN112480329A (zh) 基于dlp型3d打印光固化树脂模型材料及其制备方法
JPH08337708A (ja) エポキシ樹脂系組成物
US5811497A (en) Aromatic curing catalyst for epoxy resins
JPS61159461A (ja) コ−テイング剤組成物
JPS59172519A (ja) 樹脂封止型発光装置及びその製造方法
JP3884094B2 (ja) エポキシ樹脂用硬化触媒および該触媒を含有するエポキシ樹脂組成物
JP4261536B2 (ja) エポキシ樹脂用硬化触媒および該触媒を含有するエポキシ樹脂組成物
JPS60252621A (ja) エネルギ−線硬化性エポキシ樹脂組成物
JPS6151066A (ja) コ−テイング材用エポキシ樹脂組成物
JPS60190455A (ja) 硬化性シリコ−ン組成物
JPS60190456A (ja) シリコ−ン組成物
JPH0460134B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)