JPS6065538A - ヒ−トシンクの製造方法 - Google Patents

ヒ−トシンクの製造方法

Info

Publication number
JPS6065538A
JPS6065538A JP59071654A JP7165484A JPS6065538A JP S6065538 A JPS6065538 A JP S6065538A JP 59071654 A JP59071654 A JP 59071654A JP 7165484 A JP7165484 A JP 7165484A JP S6065538 A JPS6065538 A JP S6065538A
Authority
JP
Japan
Prior art keywords
heat sink
groove
power transistor
tapered surface
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59071654A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0338745B2 (enExample
Inventor
Kikuo Isoyama
磯山　貴久雄
Akira Kazami
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP59071654A priority Critical patent/JPS6065538A/ja
Publication of JPS6065538A publication Critical patent/JPS6065538A/ja
Publication of JPH0338745B2 publication Critical patent/JPH0338745B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/073—
    • H10W72/07337—
    • H10W72/354—
    • H10W74/127—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP59071654A 1984-04-10 1984-04-10 ヒ−トシンクの製造方法 Granted JPS6065538A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59071654A JPS6065538A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59071654A JPS6065538A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Publications (2)

Publication Number Publication Date
JPS6065538A true JPS6065538A (ja) 1985-04-15
JPH0338745B2 JPH0338745B2 (enExample) 1991-06-11

Family

ID=13466807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59071654A Granted JPS6065538A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Country Status (1)

Country Link
JP (1) JPS6065538A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128279A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Heat sink for resin-sealed semiconductor device and its manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128279A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Heat sink for resin-sealed semiconductor device and its manufacture

Also Published As

Publication number Publication date
JPH0338745B2 (enExample) 1991-06-11

Similar Documents

Publication Publication Date Title
US4410927A (en) Casing for an electrical component having improved strength and heat transfer characteristics
CA2160829A1 (en) Electronic Component and Method for Fabricating the Same
GB1426539A (en) Multiple chip integrated circuits and method of manufacturing the same
US3486083A (en) Car alternator semiconductor diode and rectifying circuit assembly
JPS6065538A (ja) ヒ−トシンクの製造方法
JP2950468B2 (ja) 半導体装置
JP2698259B2 (ja) ヒートシンクの製造方法
JPS6233330Y2 (enExample)
JPH0410742B2 (enExample)
JPH0338746B2 (enExample)
JPH025539Y2 (enExample)
JP3142011B2 (ja) 固体電解コンデンサ
JPS63108662A (ja) 薄型電池
JPS6311735Y2 (enExample)
JP3171330B2 (ja) 半導体装置
JPS56122148A (en) Semiconductor device
JP2575836Y2 (ja) 半導体装置
JPH0256855A (ja) 平板型電池
JPH0210578B2 (enExample)
US6135817A (en) Electric contact sealing arrangement
JP3098244B2 (ja) 固体電解コンデンサおよびその製造方法
JPS6076179A (ja) 熱電変換装置
JP2865196B2 (ja) 半導体装置
JP2680766B2 (ja) ヒートシンク、ヒートシンクの製造方法及び混成集積回路
JPS593552Y2 (ja) 複合コンデンサ