JPH0410742B2 - - Google Patents

Info

Publication number
JPH0410742B2
JPH0410742B2 JP59071653A JP7165384A JPH0410742B2 JP H0410742 B2 JPH0410742 B2 JP H0410742B2 JP 59071653 A JP59071653 A JP 59071653A JP 7165384 A JP7165384 A JP 7165384A JP H0410742 B2 JPH0410742 B2 JP H0410742B2
Authority
JP
Japan
Prior art keywords
heat sink
power transistor
groove
resin layer
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59071653A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6065553A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59071653A priority Critical patent/JPS6065553A/ja
Publication of JPS6065553A publication Critical patent/JPS6065553A/ja
Publication of JPH0410742B2 publication Critical patent/JPH0410742B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59071653A 1984-04-10 1984-04-10 混成集積回路 Granted JPS6065553A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59071653A JPS6065553A (ja) 1984-04-10 1984-04-10 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59071653A JPS6065553A (ja) 1984-04-10 1984-04-10 混成集積回路

Publications (2)

Publication Number Publication Date
JPS6065553A JPS6065553A (ja) 1985-04-15
JPH0410742B2 true JPH0410742B2 (enExample) 1992-02-26

Family

ID=13466778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59071653A Granted JPS6065553A (ja) 1984-04-10 1984-04-10 混成集積回路

Country Status (1)

Country Link
JP (1) JPS6065553A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230256A (ja) * 1988-03-10 1989-09-13 Fuji Electric Co Ltd 半導体装置
JP4702196B2 (ja) * 2005-09-12 2011-06-15 株式会社デンソー 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643166U (enExample) * 1979-09-10 1981-04-20
JPS5840848A (ja) * 1981-09-04 1983-03-09 Hitachi Ltd 絶縁型半導体装置
JPS6233330U (enExample) * 1985-08-15 1987-02-27

Also Published As

Publication number Publication date
JPS6065553A (ja) 1985-04-15

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