JPH0210578B2 - - Google Patents

Info

Publication number
JPH0210578B2
JPH0210578B2 JP59072425A JP7242584A JPH0210578B2 JP H0210578 B2 JPH0210578 B2 JP H0210578B2 JP 59072425 A JP59072425 A JP 59072425A JP 7242584 A JP7242584 A JP 7242584A JP H0210578 B2 JPH0210578 B2 JP H0210578B2
Authority
JP
Japan
Prior art keywords
heat sink
protrusion
power transistor
groove
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59072425A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60216572A (ja
Inventor
Kikuo Isoyama
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP59072425A priority Critical patent/JPS60216572A/ja
Publication of JPS60216572A publication Critical patent/JPS60216572A/ja
Publication of JPH0210578B2 publication Critical patent/JPH0210578B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion

Landscapes

  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59072425A 1984-04-11 1984-04-11 ヒ−トシンクの製造方法 Granted JPS60216572A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59072425A JPS60216572A (ja) 1984-04-11 1984-04-11 ヒ−トシンクの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59072425A JPS60216572A (ja) 1984-04-11 1984-04-11 ヒ−トシンクの製造方法

Publications (2)

Publication Number Publication Date
JPS60216572A JPS60216572A (ja) 1985-10-30
JPH0210578B2 true JPH0210578B2 (enExample) 1990-03-08

Family

ID=13488922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59072425A Granted JPS60216572A (ja) 1984-04-11 1984-04-11 ヒ−トシンクの製造方法

Country Status (1)

Country Link
JP (1) JPS60216572A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62238026A (ja) * 1986-04-08 1987-10-19 Sanyo Electric Co Ltd ヒ−トシンクの製造方法
DE10333329B4 (de) * 2003-07-23 2011-07-21 SEMIKRON Elektronik GmbH & Co. KG, 90431 Leistungshalbleitermodul mit biegesteifer Grundplatte

Also Published As

Publication number Publication date
JPS60216572A (ja) 1985-10-30

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