JPH0338746B2 - - Google Patents

Info

Publication number
JPH0338746B2
JPH0338746B2 JP59071655A JP7165584A JPH0338746B2 JP H0338746 B2 JPH0338746 B2 JP H0338746B2 JP 59071655 A JP59071655 A JP 59071655A JP 7165584 A JP7165584 A JP 7165584A JP H0338746 B2 JPH0338746 B2 JP H0338746B2
Authority
JP
Japan
Prior art keywords
heat sink
groove
power element
power transistor
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59071655A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6065539A (ja
Inventor
Kikuo Isoyama
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP59071655A priority Critical patent/JPS6065539A/ja
Publication of JPS6065539A publication Critical patent/JPS6065539A/ja
Publication of JPH0338746B2 publication Critical patent/JPH0338746B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/073—
    • H10W72/07337—
    • H10W72/354—
    • H10W74/127—

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59071655A 1984-04-10 1984-04-10 ヒ−トシンクの製造方法 Granted JPS6065539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59071655A JPS6065539A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59071655A JPS6065539A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Publications (2)

Publication Number Publication Date
JPS6065539A JPS6065539A (ja) 1985-04-15
JPH0338746B2 true JPH0338746B2 (enExample) 1991-06-11

Family

ID=13466838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59071655A Granted JPS6065539A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Country Status (1)

Country Link
JP (1) JPS6065539A (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128279A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Heat sink for resin-sealed semiconductor device and its manufacture

Also Published As

Publication number Publication date
JPS6065539A (ja) 1985-04-15

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