JPS606227U - semiconductor integrated circuit element - Google Patents
semiconductor integrated circuit elementInfo
- Publication number
- JPS606227U JPS606227U JP9856383U JP9856383U JPS606227U JP S606227 U JPS606227 U JP S606227U JP 9856383 U JP9856383 U JP 9856383U JP 9856383 U JP9856383 U JP 9856383U JP S606227 U JPS606227 U JP S606227U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- semiconductor integrated
- semiconductor wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のＩＣ素子を有する半導体ウェーハの平面
図、第２図は本考案によるＩＣ素子の実施例を示す半導
体ウェーハの部分拡大図を含む平面図、第３図は第２図
のＩＣ素子の部分概略断面図、第４図は第２図のＩＣ素
子におけるトランジスタのｈＦＥとピンチ抵抗のＶ−Ｉ
関係図である。
４・・・・・・半導体ウェーハ、５・・・・・・半導体
集積回路素子（ＩＣ素子）、６’、６’・・・・・・ピ
ンチ抵抗値測定用パッド、Ｒ・・・・・・ピンチ抵抗。FIG. 1 is a plan view of a semiconductor wafer having a conventional IC device, FIG. 2 is a plan view including a partially enlarged view of the semiconductor wafer showing an embodiment of an IC device according to the present invention, and FIG. 3 is a plan view of a semiconductor wafer having a conventional IC device. A partial schematic sectional view of the device, FIG. 4 shows the hFE of the transistor and the V-I of the pinch resistance in the IC device of FIG.
It is a relationship diagram. 4... Semiconductor wafer, 5... Semiconductor integrated circuit element (IC element), 6', 6'... Pad for pinch resistance value measurement, R...・Pinch resistance.
Claims (1)
であって、その表面に内部に形成したピンチ抵抗の抵抗
値を外部より測定できるパッドを形成したことを特徴と
する半導体集積回路素子。1. A semiconductor integrated circuit element formed in plurality on a semiconductor wafer, characterized in that a pad is formed on the surface of the semiconductor integrated circuit element so that the resistance value of a pinch resistor formed inside can be measured from the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9856383U JPS606227U (en) | 1983-06-24 | 1983-06-24 | semiconductor integrated circuit element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9856383U JPS606227U (en) | 1983-06-24 | 1983-06-24 | semiconductor integrated circuit element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS606227U true JPS606227U (en) | 1985-01-17 |
Family
ID=30233952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9856383U Pending JPS606227U (en) | 1983-06-24 | 1983-06-24 | semiconductor integrated circuit element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS606227U (en) |
-
1983
- 1983-06-24 JP JP9856383U patent/JPS606227U/en active Pending
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