JPS6059798A - Ceramic circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in ceramic wiring boards for forming electrical, electronic, etc. circuits (hereinafter referred to as circuits).

As the kth ceramic substrate that forms the 5th circuit,
On the left side of A403 with axiality of 90% or more, a VC donor wiring layer is provided, and a Q'z multi-layered circuit is formed. :)) VC41st line '8! = Apply and insulate the insulators and 1 piece together and sinter the circuit board.

A403 board is generally d um I/, 1A4(J+
VJ is used as a component, and Si is added as a sintering aid.
Ox, CaO + lvigo, etc., composition 10
7 inches to 0 ri weight hμ and 5 to 20 doto's 1 bow ゛ + χ deficiency 9 course (result 814, mouth ■ hit guori ζ'j') 'a: Excluding Calo, mixed green sheet 4 popularity It is manufactured by sintering at around 1600°C. And the circuit is interconnected, insulated, resistive, fat electric body number trough pace I-τ sintered 'rc A110
For example, if you screen print the three pieces, and then print them on a C'print, you can create a shape.

To explain in more detail, the donor has A u + P t+
9 to 15 for wage imitation powder and loquats such as A g rPd.
Karasu powder with a dielectric constant of 10~
Karasu powder Δ〈, with a dielectric constant of several 100 to J9V (
I used Ru2Or carbon powder τ, and mixed these powders with Rin-Tsukichi and Bon and sintered the Xun7 base.
= 1'' printing 1 brim For example, a pigeon with no pigeons, an insulating layer, a resistor layer, a type 7 Jg, at +000 degrees Celsius 9, and humidity, there are no birds, and there are no mature bamboos. For example, a blackcurrant trade binding piece 1”-C yii
L i Repeat this process until the circuit is shaped like J Intake fL ゐ〇 Meanwhile, bulk b1L binding method V (Yo Ceramic Self! Gland 4 is AjL03 Powder N90.mxlife and above, Sioz
, CaO, MgO investigation τ70MLIii section below Il
, W, Mo on the green sheet where the old man of the brutality 9 says,
, Mn Blue's first contact point is Kinjo Powder Sword, which consists of a 4J, a 4J, a green sheet, and an insulating paste with the same composition as the green sheet or a green sheet. By forming these layers alternately, the glandular layers are multi-layered, and the circuit is formed into a shape of J in the shape of a circuit in a weakly reducing atmosphere at around 1.600°C.

However, in these conventional ceramics, once the circuit on the surface of the outermost layer is installed on the gland plate, the number of ceramic wiring becomes unusable when the circuit design is changed later.
Since it is necessary to equip ceramic self-sustaining glands for each kiln circuit, mass production is lacking, and the inventiveness that was the cause of cost anomalies can be easily dealt with by the construction history of the circuit on the surface of the layer. The purpose of this invention is to provide a ceramic plate tray with multi-layered power and stability. Built-in 4 non-gable layers] <Ear holes or σ through holes are formed on almost the entire surface of the outermost layer of the distribution plate on one or both sides of the surface, and one is connected to the surface layer. 1 Concerning glands.

The invention is to form a surface exclusive layer on almost the entire surface of one side of the bent piece of the most IA layer as described above, and to create an unstable insertion layer with 9 circuits r+f by means such as etsonization. There is a 'C' that allows the form JfA.

In the present invention, the conductor paste used for the conductive layer 1 and the wire layer r-type 1 & 2) includes W, No, Mn.
IAu, Ag, Pd, and Cu blue are used, and the sintering conditions and manufacturing process Ic are +2.

There is no particular restriction on the film thickness.

As the material of the layer surface V (form 4),
'JJ2♂ Show to yourself 21! 71 paste τ coating IliL
, 7 and 2 x fired, or may be formed by steaming metal or gold metal, and there is no restriction.

In the invention, it is preferable that a part of the via hole or through hole is small (it is preferable to expose two or more points between the surfaces of the board). It is good that the through hole is formed parallel to the thorns, in:g+ position.
/) As shown in Figure 1, remove the cylindrical hole.
l5 Easy to read. Note that there is no limit to the diameter, shape, and thickness of the via hole or through hole (11':f). If it is unnecessary for the role of WJ, it is easy to insulate it by using a loquat with a loquat.

In addition, the tanned ceramic gate plate of the present invention may be formed into a hole-shaped part with a ceramic degree # 椴の溺其 1- (1) as required.

The following is an illustration of an embodiment of the present invention: Dobiki J1-j 0 Embodiment 1 Figure 1 shows the state of production of ceramic wiring according to an embodiment of the present invention. This is the opposite figure. 1 is a green sheet cut into a 1.1bJ-shape with 6 sheets of II7, then formed by pinching the nVc through hole 2t, and (1) W conductor paste in the through hole 2. 57 light horizontal. Then, on the surface of two of these green sheets 1, insert a conductor so as to surround one of the protruding through holes 2. Form the own maximum 41 so 6, and then connect this through hole 2 and 4 to the 6 and t father by placing the child's hand. Grill details 7
．． - The conductor distribution layer 6 formed on the plate 1 is inserted into the through hole 2 through the through hole 2 so that the W conductor paste 5 and the connecting portion and the unconnected portion are alternately 3-6.
0 After VC, the second place green sheet was 1tML, and on top of it was a W pass) 1 ton of green sheet with only 5 layers and 7 yuan filled. 'C's M'1j must be on the legs, and the drinking clothes 1
Almost all of the river's ufl [Ni τ together with the sky and attacked six times 4q 1 book j so 4τ formed n and the body order C victory layer 6
And τj Ankaku dead 7 and Cerami) ri llj self TI multi-made 11M', r: '+Committ Iko.

Shirizoku 1 Series 2 Figure 2 shows a part of the ceramic r, which is a mockery of other uninvented works. Sintered A/ll, Os mounting plate 7 as base material
Insulation group (not shown) on the top
g-Pd 4 body paston mark Ai sushi, then the above mentioned air "T: bottom at a temperature of 900℃) must be 4th 141st touch 8
to form. Next, after mixing the glass powder bed and the vehicle, two through-holes were provided above the printing method anchor with a pitch width of 2 through holes (insulated) to form a plate 9. Ag-Pd donor-strike 10 in through hole 2
As in Example 1, i4i'< vacuum evaporation was performed on the entire surface of the locomotive pigeon 9 with the through-hole 2 in the upper direction. Ceramic arrangement with string connection with surface bound 1 Fu Xiang 4 t 7 Biwa Shiko n and circle J lying R 碍 1 Small wiring layer 8 and string connection τ 1 J Ro〇 Example 6 Figure 6 is the uninvented 1 A perspective view of a fractured cross section of a ceramic wiring board is shown in the same way as in Example 2, and Ag-Pd paste is printed on the top surface of the sintered A403 base material 7. The layer 11, 11''7 is fired in air at 1900°C at -11ifk.Next, the conductor wiring layer 11.44' is mixed with caras powder, also known as vehicle, and the width of the T-tail is 11.44'. By printing method on the top surface of!l12
Two trays of through-holes are provided in each row, and the insulating layer 9 is shaped like a tray.The through-holes 2 are formed at positions that are flat and perpendicular to the through-holes 2. The Ag-Pdn body paste was exposed to 10 nm of light on Sorisaka and Ruhole 2, and fired at a temperature of 900°C in air as described in Section 1.
Two points τ of the through hole 2' located at one end of the ceramic wiring board are left;
Mr. 1 [Ni';c vacuum vaporized, the end face of the two through-holes was exposed to the surface VCC, and the six-fold layer 4 had a rough shape and was internally connected to the 7ζ-layer confession Id layer 11 and the layer 11. Ceramic flaw root 12 Brahma heart.

Loss of practice vIJ4 The fourth evil is another example of the present invention/A! For example, if a ceramic wiring board is broken, there are four points (1 pin and 1 center through hole 2') on the inner surface of one end of the ceramic wiring board in the length direction. 2 points) LrJ, Shoryu Leri 1 and ioJ process, except for the exposed hair 4) Table 1
The 47-year-old payout layer 5 and the 47-year-old who are intimately related to the nJ Me body layer.
Ceramic distribution similar to 12 hairs 1 biru○ An uninvented ceramic wiring board with one layer or six or more conductor wiring layers [built-in, and this internal conductor wiring J Zengsun via hole or through hole valve to the substrate. The circuit formed on one or both sides of the surface of the removable layer is connected to the four body layers, so the circuit formed on the outermost layer surface Ua+ can be formed by means such as etching! Since it is possible to easily form the circuit π even if the circuit design is changed, Tojima is also made of a ceramic self-contained ceramic plate dedicated to Germany for the Ig path formed on the outermost surface. It has excellent operculum properties and can be made into a safe f[iI].

1. The via holes or through holes are one foot pitch wide and are parallel to and perpendicular to the IJ contacting via holes or through holes. Or, the position of the through hole is missing and it can be easily removed.

[Brief explanation of drawings]

Figure 1 shows the state of production of a ceramic wiring board as an example of the present invention. lr Congratulations on intaglio printing, Fig. 2 is another embodiment of the invention (Vc smooth ceramic layer), a partially cutaway 1m perspective view showing the working state of the laminated plate, Figs. 6 and 4
The figure is a perspective view of a fragmented cross section of a ceramic wiring board according to another embodiment of the present invention. Explanation of symbols 1, green sheet 212' through hole 6, conductor wiring layer 43 surface body layer 5, W conductor paste 6. Absolutely 7, Sintered A40: + Substrate 8. Conductor wiring layer 9・
Zetsukama layer 10・Ag-Pd thick paste 11.
11 Conductor wiring layer 12 Ceramic wiring layer 1
Figure 2 (2) Figure 3 Figure 4, Procedural amendment (spontaneous) Showa 581- ρ Month 26 1 case indication 2, name of the invention Ceramic wiring board 3, relationship with the person making the amendment f1 Patent applicant name (445) Hitachi Chemical Co., Ltd. 4, Agent
Person 5, Detailed explanation of the invention in the specification subject to amendment 6, Contents of amendment

Claims (1)

[Claims] 1. A via hole or through hole having one or more layers of binding body layers, and having this rounded conductor distribution layer.
The outermost layer surface of the wiring board □ One side or both sides... Ceramic wiring 7 发 is formed by cutting out almost all of J and connecting it to the special layer. 2. The ceramic wiring machine according to claim 1, in which at least two or more points (rHvc) are exposed between the ends of the via hole or through hole.