JPH0195595A - Method for vertically providing pin in ceramic substrate - Google Patents

Abstract

PURPOSE:To improve the bonding intensity of pins of filling the holes of the ceramic green sheet on a ceramic substrate for vertically providing pins with a filler containing a ceramic powder or a glass powder, vertically providing the pins in the holes, and calcining the ceramic green sheet and the filler at a temperature lower than the calcination temperature of the substrate. CONSTITUTION:On a ceramic substrate 2, a ceramic green sheet 6 having a calcination temperature lower than that of the ceramic substrate 2 is provided which has throughholes 8 opened in the positions where pins 10 are to be vertically provided, then the throughholes 8 are filled with a filler containing at least either a ceramic powder or a glass powder and vertically provided with the pins 10, and under this condition, the ceramic green sheet and the filler 12 are calcinated at a temperature lower than the calcination temperature of the ceramic substrate 2. Accordingly, the pins 10 have their head buried in the ceramic green sheet 6 and bonded with the ceramic and glass in the filler 12. With this, the bonding intensity of the pins improves.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for erecting pins on a ceramic substrate used, for example, in an IC package.

[Conventional technology]

Conventionally, this type of pin installation method is as follows: 1. Forming a conductor pad on the board and soldering or brazing the head of the pin with a flat head to the pad, or 2. Baking. A method has been adopted in which a hole is made on the previous board, the hole is filled with conductive paste, and the board is fired with a bar-shaped pin inserted.

[Problem that the invention seeks to solve]

However, in method (■) above, the pad area is larger than the pin diameter, which limits the mounting density of the pins, and even if a head is provided, the bonding strength of the pin is weak because the bonding area between the pin and the pad is small. There are problems such as.

In addition, the above method (■) has problems, such as shrinkage occurring when the board is fired, resulting in poor pin positioning accuracy, and poor bonding strength of the pins due to the difference in thermal expansion between the filled conductor and the board. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for erecting pins on a ceramic substrate that solves these problems.

[Means for solving problems]

In the bottle erecting method of the present invention, a fired ceramic substrate on which pins are to be erected is prepared, and a ceramic green sheet whose sintering temperature is lower than that of the ceramic substrate is placed on the ceramic substrate. A through-hole is provided at the position where the pin is to be erected, and the through-hole of the ceramic green sheet is filled with a filler containing at least one of ceramic powder and glass powder, and the pin is erected. In this state, the ceramic green sheet and the filler are sintered at a temperature lower than the firing temperature of the ceramic substrate.

〔Example〕

FIG. 1 is a sectional view for explaining the pin erecting method according to the present invention.

First, a fired ceramic substrate 2 on which the pins 10 are to be erected is prepared. This ceramic substrate 2 is a multilayer ceramic substrate in the illustrated example, and has a conductor 4 for wiring inside, and a part of the conductor 4 has pins 1 on the surface.
0 is exposed at the position where it should be installed. However, this ceramic substrate 2 does not necessarily have to be a multilayer substrate.

As this ceramic substrate 2, for example, BBaO31n
A1□03 Use a BxOs-based material that can be oxidized. Further, as the conductor 4, for example, Ag-Pd, Cu, or the like is used.

Next, on the ceramic substrate 2, a ceramic green sheet 6 whose sintering temperature is lower than that of the ceramic substrate 2 is penetrated at the position where the pin 10 is to be erected, that is, at the position of the exposed conductor 4 of the ceramic substrate 2. A hole 8 is provided in each case.

The ceramic green sheet 6 may be made of BaO and/or B, for example, rather than the material of the ceramic substrate 2.
A composition rich in 2O3 is used.

Next, in each through hole 8 of the ceramic green sheet 6,
A filler 12 containing at least one of ceramic powder and glass powder is filled by, for example, screen printing.

As this ceramic powder, for example, the same material as the ceramic green sheet 6 is used. As the glass powder, for example, ZnOStow 8gOs type powder is used.

Next, one end of the rod-shaped pin 10 is inserted into each through-hole 8 filled with the filler 12 to stand upright, and is pressed against the conductor 4 on the ceramic substrate 2 .

However, the filler material 12 may be filled after the pins 10 are erected, and the electrical connection by pressure contact between the pins 10 and the conductor 4 may be more reliable in some cases. In this case, for example, a jig 14 for regulating the position of the pin 10 and a weight 16 for pressing the pin 10 are used as shown in the illustrated example. If the next sintering step is carried out using such a material, the positional accuracy of the pin 10 can be further improved since the positional displacement of the pin 10 can be prevented.

Then, with pin 10 erected as described above,
Ceramic green sheets 6 and filler 12 are sintered at a temperature lower than the firing temperature of ceramic substrate 2. Therefore, the ceramic substrate 2 is not adversely affected by remelting, peeling, etc.

As a result, the ceramic green sheet 6 becomes a ceramic sheet and comes into close contact with the ceramic substrate 2, and the pin 10 is connected to the filler material while the pin 10 and the conductor 4 on the surface of the ceramic substrate 2 are electrically connected by pressure contact. 1
2, it is bonded to a ceramic sheet or the like and mechanically fixed.

〔Effect of the invention〕

As described above, according to the present invention, there is no need to provide the pin with a flat head, and the size of the through hole in the ceramic green sheet may be slightly larger than the diameter of the pin.
Pin mounting density can be increased.

In addition, the head of the pin is embedded in the ceramic sheet and bonded with the ceramic or glass in the filler, and the ceramic sheet and the filler are similar in material and there is a large thermal expansion difference between them. Since there is no adhesive, the adhesive strength of the pin is also increased.

Also, since the ceramic substrate itself is not fired,
Shrinkage of the ceramic substrate during sintering of ceramic green sheets and the like hardly occurs, and therefore pin position accuracy is improved.

[Brief explanation of the drawing]

FIG. 1 is a sectional view for explaining the pin erecting method according to the present invention. 2... Ceramic substrate, 4... Conductor, 6... Ceramic green sheet, 8... Through hole, 10... Pin, 12... Filler.

Claims (1)

[Claims] (1) Prepare a fired ceramic substrate on which pins are to be erected, and erect pins on a ceramic green sheet whose sintering temperature is lower than that of the ceramic substrate. A ceramic green sheet with through-holes drilled at the desired positions is filled with a filler containing at least one of ceramic powder and glass powder, and pins are erected into the through-holes of the ceramic green sheet. A method for erecting pins on a ceramic substrate, characterized by sintering a ceramic green sheet and a filler at a temperature lower than the firing temperature of the substrate.