JPS61161794A - Wet type multilayer ceramic substrate - Google Patents
Wet type multilayer ceramic substrateInfo
- Publication number
- JPS61161794A JPS61161794A JP204985A JP204985A JPS61161794A JP S61161794 A JPS61161794 A JP S61161794A JP 204985 A JP204985 A JP 204985A JP 204985 A JP204985 A JP 204985A JP S61161794 A JPS61161794 A JP S61161794A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- conductor
- multilayer ceramic
- hole
- weight ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
- B43K—IMPLEMENTS FOR WRITING OR DRAWING
- B43K8/00—Pens with writing-points other than nibs or balls
- B43K8/02—Pens with writing-points other than nibs or balls with writing-points comprising fibres, felt, or similar porous or capillary material
- B43K8/04—Arrangements for feeding ink to writing-points
- B43K8/06—Wick feed from within reservoir to writing-points
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
- B43K—IMPLEMENTS FOR WRITING OR DRAWING
- B43K8/00—Pens with writing-points other than nibs or balls
- B43K8/02—Pens with writing-points other than nibs or balls with writing-points comprising fibres, felt, or similar porous or capillary material
- B43K8/024—Pens with writing-points other than nibs or balls with writing-points comprising fibres, felt, or similar porous or capillary material with writing-points comprising felt
Landscapes
- Pens And Brushes (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、湿式多層セラミック基板に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a wet multilayer ceramic substrate.
例えば従来、テレビ受像機のチューナ用回路基板として
プリント基板が用いられていたが、近年はそれに代わっ
て多層セラミック基板が、小型化、高集積化などを図り
易いという利点の故に用いられるようになってきている
。For example, in the past, printed circuit boards were used as circuit boards for tuners in television receivers, but in recent years, multilayer ceramic boards have come to be used in their place due to their advantages in making them smaller and more highly integrated. It's coming.
本発明は、このような技術的意味合いをもつ湿式多層セ
ラミック基板の改良に関するものである。The present invention relates to improvements in wet multilayer ceramic substrates that have such technical implications.
（発明の背景〕
第１図は湿式多層セラミック基板の一般的な構成を示す
平面図、第２図は同側断面図、である。(Background of the Invention) FIG. 1 is a plan view showing the general structure of a wet multilayer ceramic substrate, and FIG. 2 is a sectional view of the same side.
これらの図において、■はセラミックス基体、２ａ、２
ｂ、２ｃはそれぞれ絶縁層（セラミックス基体と同じ材
料で出来ている）、３ａ、３ｂ。In these figures, ■ is a ceramic substrate, 2a, 2
b and 2c are insulating layers (made of the same material as the ceramic substrate), 3a and 3b, respectively.
３ｄはそれぞれ内部導体層、３ｃ、３ｅはそれぞれ導体
層、４はピアホール（導体が充填されている）、５はス
ルーホール（同じく導体が充填されている）、６はクラ
ック、である。3d is an internal conductor layer, 3c and 3e are conductor layers, 4 is a peer hole (filled with a conductor), 5 is a through hole (also filled with a conductor), and 6 is a crack.
第１図、第２図を参照して湿式多層セラミック基板の製
造工程を簡単に説明する。The manufacturing process of a wet multilayer ceramic substrate will be briefly described with reference to FIGS. 1 and 2.
セラミックス基体工にスルーホール５をあけた後、該ホ
ール５に導体（これをスルーホール導体という）を充填
する。その後、セラミックス基体１の下面（裏面）に第
１導体層３ａを所定のパターンとして形成した後、第１
絶縁層２ａを積層形成する。また必要に応じて該絶縁層
にピアホール４を形成し、該ホール４にも導体を充填す
る。以下同様に導体層３ｂ、絶縁層２ｂ、導体層３Ｃを
順次積層形成する。After making a through hole 5 in the ceramic substrate, the hole 5 is filled with a conductor (referred to as a through hole conductor). After that, after forming the first conductor layer 3a in a predetermined pattern on the lower surface (back surface) of the ceramic base 1,
Insulating layers 2a are laminated. Further, if necessary, a pier hole 4 is formed in the insulating layer, and the hole 4 is also filled with a conductor. Thereafter, a conductor layer 3b, an insulating layer 2b, and a conductor layer 3C are sequentially laminated in the same manner.
次にセラミックス基体１の上面（表面）にも所定パター
ンから成る導体層３ｄ、３ｅおよび絶縁層２Ｃを交互に
積層形成する。その後、全体を１゜６００℃程度の温度
で焼いて焼結させることにより多層セラミック基板が出
来上る。Next, conductive layers 3d, 3e and insulating layers 2C having a predetermined pattern are alternately laminated on the upper surface (surface) of the ceramic substrate 1. Thereafter, the whole is fired and sintered at a temperature of about 1.degree. 600.degree. C., thereby completing a multilayer ceramic substrate.
さて、かかる湿式多層セラミック基板においては、例え
ば特開昭５９−３６９４８号公報にも示されているよう
に、スルーホール導体ならびに導体層の形成材料として
は、タングステンまたはモリブデンから成る単一の純金
属が用いられていた。Now, in such a wet multilayer ceramic substrate, as shown in Japanese Patent Laid-Open No. 59-36948, a single pure metal such as tungsten or molybdenum is used as the material for forming the through-hole conductors and the conductor layer. was used.
このため焼結時において、絶縁層２ａ〜２ｃ（セラミッ
クス基体と同じ材料から成り、その主成分はアルミナ）
の収縮率とスルーホール導体（５）や導体層３ａ〜３ｅ
の収縮率とが相違し、クラック６が絶縁層において発生
することがあった。Therefore, during sintering, the insulating layers 2a to 2c (made of the same material as the ceramic substrate, the main component of which is alumina)
The shrinkage rate of through-hole conductor (5) and conductor layers 3a to 3e
The shrinkage rate was different, and cracks 6 sometimes occurred in the insulating layer.
かかるクラックの発生した多層セラミック基板は一種の
欠陥品であることは云うまでもない。Needless to say, a multilayer ceramic substrate with such cracks is a kind of defective product.
本発明の目的は、製造時において上述のようなりラック
の発生することのない信輔性に富んだ湿式多層セラミッ
ク基板を提供することにある。An object of the present invention is to provide a highly reliable wet-type multilayer ceramic substrate that does not generate racks as described above during manufacturing.
本発明においては、多層セラミック基板における導体材
料（スルーホール導体や導体層を形成する材料）が焼結
するときには、ガラス成分を必要とすることから予め導
体材料にガラス成分を添加しておき、また導体材料と絶
縁層（純度９０〜９６％のアルミナから成り、かつ４〜
１０％の範囲でガラス成分を含む）とが、焼結時におい
て同じ比率で収縮するように、導体材料に更にアルミナ
を添加し、これによって絶縁層における焼結時のクラッ
ク発生を防止したものである。In the present invention, since a glass component is required when the conductor material (material forming the through-hole conductor and conductor layer) in the multilayer ceramic substrate is sintered, a glass component is added to the conductor material in advance, and Conductive material and insulating layer (consisting of alumina with a purity of 90-96%, and
Alumina is further added to the conductor material so that the conductor material (containing a glass component in the range of 10%) shrinks at the same rate during sintering, and this prevents cracks from occurring in the insulating layer during sintering. be.
次に、第１図、第２図を再び参照して本発明の詳細な説
明する。Next, the present invention will be described in detail with reference to FIGS. 1 and 2 again.
本発明では、スルーホール５に充填されたスルーホール
導体や導体層３ａ〜３ｅを形成する導体材料（タングス
テンやモリブデンが用いられる）中に、アルミナを５〜
３０％（重量比）添加している。またこれら導体材料の
焼結を促進させるのに必要なガラス成分（例えば、Ｍｇ
Ｏ、ＣａＯなど）も、予め該導体材料中に０．２〜５％
（重量比）添加しておく。In the present invention, alumina is added to the conductor material (tungsten or molybdenum is used) forming the through-hole conductor filled in the through-hole 5 and the conductor layers 3a to 3e.
30% (weight ratio) is added. Additionally, glass components necessary to promote sintering of these conductive materials (for example, Mg
0.2 to 5% of O, CaO, etc.) are also included in the conductor material in advance.
(weight ratio) Add.
このようにしておくことにより、焼結時に、セラミック
ス基体１や絶縁層２ａ〜２Ｃから導体材料へのガラス成
分の浸透流入もなくなり、かかるガラス成分の浸透流入
が発生した場合に生じるセラミックス基体や絶縁層の物
理的強度の著しい低下を防ぐことができる。またセラミ
ックス基体や絶縁層におけるクラックの発生を防ぐこと
ができる。By doing this, during sintering, the glass component will not penetrate into the conductor material from the ceramic substrate 1 or the insulating layers 2a to 2C, and the ceramic substrate and the insulation that would otherwise occur if such glass component penetrates and flows into the conductor material are also prevented. A significant decrease in the physical strength of the layer can be prevented. Furthermore, it is possible to prevent cracks from occurring in the ceramic substrate or the insulating layer.
以上説明したように、本発明によれば、湿式多層セラミ
ック基板において、焼結時に絶縁層にクラックが発生す
ることがな（なるので、製品としての焼結歩留りの高い
信頼性に冨んだかかるセラミック基板を提供できるとい
う利点がある。As explained above, according to the present invention, cracks do not occur in the insulating layer during sintering in a wet multilayer ceramic substrate. It has the advantage of being able to provide a ceramic substrate.
第１図は湿式多層セラミック基板の一般的な構成を示す
平面図、第２図は同側断面図、である。
符号説明
■・・・セラミックス基体、２ａ、 ２ｂ、２Ｃ・・
・絶縁層、３ ａ、 ３ ｂ、 ３ ｄ・−・内部
導体層、３Ｃ２３ｅ・・・導体層、４・・・ピアホール
、５・・・スルーホール、６・・・クラック
代理人 弁理士 並 木 昭 夫
第 ｔｉｌ！！
１０丁１丁１−１しFIG. 1 is a plan view showing the general structure of a wet multilayer ceramic substrate, and FIG. 2 is a sectional view of the same side. Code explanation■... Ceramic base, 2a, 2b, 2C...
・Insulating layer, 3 a, 3 b, 3 d --- Internal conductor layer, 3C23e... Conductor layer, 4... Pier hole, 5... Through hole, 6... Crack agent Patent attorney Namiki Akio Dai til! ! 10 cho 1 cho 1-1
Claims (1)
１０％（重量比）の範囲でガラス成分を含むセラミック
ス基体の表面と裏面の間にスルーホールを設けて導体（
以下、スルーホール導体と云う）を充填した後、前記基
体の表面と裏面の何れか一方または双方に、導体層と絶
縁層（前記セラミックス基体と同一材料から成る）を交
互に積層形成し、次いでその全体を焼結して成る湿式多
層セラミック基板において、 前記スルーホール導体および導体層の形成材料として、 （イ）タングステンにアルミナを５〜３０％（重量比）
及び、ガラス成分（例、ＭｇＯ、ＣａＯ）を０．２〜５
％（重量比）含有させて成る材料か、或いは、 （ロ）モリブデンにアルミナを５〜３０％（重量比）及
び、ガラス成分（例、ＭｇＯ、ＣａＯ）を０．２〜５％
（重量比）含有させて成る材料、 を用いたことを特徴とする湿式多層セラミック基板。[Scope of Claims] 1) Consists of alumina with a purity of 90 to 96%, and
A conductor (
After filling the through-hole conductor (hereinafter referred to as a through-hole conductor), conductor layers and insulating layers (made of the same material as the ceramic base) are alternately laminated on either or both of the front and back surfaces of the base. In a wet multilayer ceramic substrate formed by sintering the whole, the through-hole conductor and the conductor layer are formed using: (a) tungsten and alumina in an amount of 5 to 30% (weight ratio);
and glass components (e.g. MgO, CaO) from 0.2 to 5
% (weight ratio), or (b) molybdenum containing 5 to 30% alumina (weight ratio) and glass components (e.g. MgO, CaO) 0.2 to 5%.
A wet multilayer ceramic substrate characterized by using a material containing (weight ratio).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP204985A JPS61161794A (en) | 1985-01-11 | 1985-01-11 | Wet type multilayer ceramic substrate |
| DE19853538285 DE3538285A1 (en) | 1985-01-11 | 1985-10-28 | Mechanical pen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP204985A JPS61161794A (en) | 1985-01-11 | 1985-01-11 | Wet type multilayer ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61161794A true JPS61161794A (en) | 1986-07-22 |
Family
ID=11518473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP204985A Pending JPS61161794A (en) | 1985-01-11 | 1985-01-11 | Wet type multilayer ceramic substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS61161794A (en) |
| DE (1) | DE3538285A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000606A (en) * | 1988-05-07 | 1991-03-19 | Koh-I-Noor Rapidograph, Inc. | Drop-weight and tubular writing instrument |
| DE68927342T2 (en) * | 1988-07-30 | 1997-05-15 | Pentel Kk | INTERMEDIATE INK TANK AND WRITING INSTRUMENT USING IT |
| DE3921005A1 (en) * | 1989-06-27 | 1991-01-10 | Rotring Werke Riepe Kg | TUBE RECORDER TIP |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2392840A (en) * | 1944-03-29 | 1946-01-15 | Sanford Ink Company | Marking pen |
| DE1944701U (en) * | 1966-02-04 | 1966-08-18 | Filler & Fiebig G M B H | INK DRAWER WITH FIBER TIP. |
-
1985
- 1985-01-11 JP JP204985A patent/JPS61161794A/en active Pending
- 1985-10-28 DE DE19853538285 patent/DE3538285A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| DE3538285A1 (en) | 1986-07-17 |
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