JPH10215074A - Ceramic multilayer substrate and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for providing a resin sheet separately and to facilitate a manufacturing process by selecting the material of a ceramic green sheet and that of conductor ink and forming a conductor electrode that protrudes on the surface of a ceramic multilayer substrate. SOLUTION: The amount of shrinkage in a thickness direction after baking a ceramic green sheet 10, for example, with a printed circuit wiring, a printed circuit part 13, and a through hole 11 is set larger than the amount of shrinkage in the thickness direction after baking a conductor ink 15 being filled into the ceramic green sheet 10. Then, the material of the ceramic green sheet 10 and that of the conductor ink 15 are selected and a conductor electrode 18 that protrudes on the surface of a multilayer substrate 19 is formed, thus obtaining the conductor electrode 18 with a desired protruding shape without adding any new additional process on a manufacturing process surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic multilayer wiring board as an electronic component, and more particularly to a ceramic-on-metal circuit board having a multi-layer, co-fired ceramic formed on a metal base and a method of manufacturing the same. .

[0002]

2. Description of the Related Art Japanese Patent Application Laid-Open No. 5-27093 discloses a method of manufacturing a conventional multilayer, co-fired ceramic circuit board.
No. 4, name of invention: ceramic-on-metal circuit board and its manufacturing method, applicant: General Electric Company, which is shown in FIG.

In FIG. 4, a ceramic-on-metal circuit board 50 has a multilayer ceramic 5 on a metal base 51.
2 are bonded by co-firing of a glass bonding layer 53, and a heat sink 54 is attached to the other surface of the metal base 51 with an adhesive 55. The multilayer ceramic 52 is provided with a slot 56 in which an integrated circuit chip (or other component element) 57 is mounted. 58 is an encapsulant for protecting and covering the integrated circuit chip 57, and 59 is an electrical connection such as wire bonding. Reference numeral 60 denotes a support structure for attaching the ceramic-on-metal circuit board 50 to an electronic device.
By co-firing with the metal base 51, the ceramic-on-metal circuit board 50 can reduce the heat shrinkage in the plane direction of the ceramic substrate due to firing or the like to several percent or less.

Next, Japanese Patent Application Laid-Open No. H08-8-8 discloses a conventional method of forming bumps on a multilayer ceramic substrate.
No. 8470, Title of invention: Ceramic multilayer substrate for mounting electronic components and its manufacturing method, applicant: Taiyo Yuden Co., Ltd., which is shown in FIG. 5A and 5B are diagrams for explaining a procedure for manufacturing a bump of a ceramic multilayer substrate, and FIG.
It is manufactured in the order of (b), (c) and (d).

In FIG. 5A, a 30 μm thick resin sheet 6 kneaded with an ethyl cellulose solvent is formed.
1 is irradiated with a laser beam to make a hole having a diameter of 50 μm penetrating the resin sheet 61. The hole is filled with an Ag-Pd electrode paste to form an electrode 62.

Next, as shown in FIG. 5B, a ceramic green sheet 65 in which a through hole 63 and an internal conductor pattern 64 are formed is laminated together with a resin sheet 61, and then pressed to form a laminate. .

Next, as shown in FIG. 5C, by firing this laminate, the insulating ceramics of the ceramic green sheet 65 and the paste of the through holes 63, the internal conductor patterns 64, and the electrodes 62 are fired. At the same time, the resin sheet 61 is burned off, so that a ceramic multilayer substrate 67 having the protruding electrodes 66 integrally formed on the surface is completed.

Next, as shown in FIG. 5D, when the semiconductor integrated circuit 68 is mounted on the ceramic multilayer substrate 67, a thermosetting conductive adhesive is applied to the protruding electrodes 66 of the ceramic multilayer substrate 67. Is pin-transferred, the projection electrode 66 and the terminal electrode 70 of the semiconductor integrated circuit 68 are aligned, and then the semiconductor integrated circuit 68 is mounted on the ceramic multilayer substrate 67 and baked at a temperature of 150 ° C. The terminal electrode 70 of the circuit 68 and the protruding electrode 66 are conductively connected.

[0009]

However, the above-mentioned prior art has the following problems. A resin sheet is used to form the protruding electrodes on the ceramic multilayer substrate,
When the ceramic multilayer substrate is fired, a large amount of organic ash is generated from the resin sheet, which may adversely affect the ceramic multilayer substrate electrically, and requires a separate resin sheet, which complicates the manufacturing process. And high cost.

[0010]

According to a first aspect of the present invention, there is provided a ceramic multi-layer substrate comprising a ceramic green sheet having printed circuit wiring and printed circuit components, and a ceramic green sheet having through holes and the like, and a pressed laminate fired. The ceramic green sheet, which is a multi-layer substrate, wherein the amount of shrinkage in the thickness direction of the ceramic green sheet after firing is set to be greater than the amount of shrinkage in the thickness direction of the conductive ink filled in the ceramic green sheet after firing. A material of the sheet and a material of the conductive ink are selected, and a protruding conductor electrode is formed on the surface of the ceramic multilayer substrate.

A ceramic multilayer substrate according to a second aspect of the present invention is characterized in that the ceramic green sheets are laminated on a metal base, and the laminate is pressed together and co-fired.

Further, the ceramic multilayer substrate according to a third aspect of the present invention is characterized in that a material of the conductive ink (1) is as follows.

A1: 60 to 70% by weight of silver powder; B1: 5 to 15% by weight of lead glass for sintering; C1: 1 to 5% by weight of foresterite; D1: 1 to 5% by weight of cordierite; And a mixture of solvents and 100% by weight.

However, the materials of the lead glass for sintering used here are: a1: 40 to 60% by weight of lead oxide, b1: 30 to 50% by weight of silicon oxide, c1: 1 to 20% by weight of alumina.

According to a fourth aspect of the present invention, in the ceramic multi-layer substrate, the material of the conductive ink (2) for the printed circuit wiring and printed circuit components of the ceramic green sheet is as follows, and the conductive ink ( In addition to 1), conductive inks (2) having different material compositions are used in different regions of the same ceramic green sheet to form conductive electrodes having different heights protruding on the surface of the ceramic multilayer substrate. .

A2: 45 to 65% by weight of silver powder; B2: 10 to 30% by weight of lead glass for sintering; However, the lead glass for sintering used here has the following composition.

A1: 40 to 60% by weight of lead oxide, b1: 30 to 50% by weight of silicon oxide, c1: 1 to 20% by weight of alumina.

According to a fifth aspect of the present invention, in the ceramic multilayer substrate, the shape of the conductor electrode protruding from the surface of the ceramic multilayer substrate is a columnar shape, a trapezoidal shape, a hemispherical shape, or a shape similar thereto. It is characterized by the following.

Further, the method for manufacturing a ceramic multi-layer substrate according to claim 6 of the present invention comprises: (1) a step of manufacturing a ceramic green sheet of a glass-ceramic system; and (2) perforation of the ceramic green sheet by punching or the like. (Via hole) and a step of embedding ink for via conductor in the perforation; (3) drying and laminating the ceramic green sheet having the ink for via conductor and predetermined printed circuit wiring and printed circuit components; Crimping to form a laminate, (4) attaching a metal base to the laminate, and (5) firing a ceramic green sheet laminate with the metal base. Things.

[0020]

1 to 3 are views showing a ceramic multilayer substrate and a method of manufacturing the same according to an embodiment of the present invention.

FIG. 2 shows a structure of a bumped ceramic multilayer substrate according to an embodiment of the present invention and a method of manufacturing the same.
This will be described with reference to FIG.

The substrate material is a low temperature firing type (the firing temperature range is
For example, it is a glass / ceramic multilayer wiring board of about 800 ° C. to 950 ° C.) and shows an example in which the present invention is applied to a material composition multilayer wiring board.

In FIG. 2A, the material of the glass-ceramic multilayer substrate is a main glass (hereinafter, the unit of% of the material composition is all weight%), and ZnO (zinc oxide) 20 to 55% ( preferably 25-30 percent is), MgO (magnesium oxide) 10-30% (preferably _{20~28%), B 2 O 3} ( boron oxide) 10% to 35% (preferably 15 to 20%), SiO ₂ ( Silicon oxide) 10 to 40% (preferably 20 to 30%), and other small amounts (0.1 to 1.
0%) of a crystallized glass material mainly composed of a metal oxide, and 30 to 80% of PbO (lead oxide), 15 to 50% of SiO ₂ (silicon oxide) as a sub-glass, A powder of a sub-glass material mainly composed of Al ₂ O ₃ (alumina) 1 to 10%, B ₂ O ₃ (boron oxide) 0 to 15%, and ZnO (zinc oxide) 1 to 10% Are mixed in the following ratios to form green tapes (sheets).

Main glass: 40 to 75%, secondary glass: 1.2 to 22.5%, low expansion coefficient filler: (cordelite, etc.) 0 to 35% (preferably 1 to 12%) High expansion coefficient filler: (Foresterite etc.) 0 to 25% (preferably 1 to 10%). In addition, with organic binder,
Resin and solvents are added and kneaded, and the thickness of the ceramic green sheet material having the above composition is formed into a sheet.
A green tape (sheet) formed from 0.05 mm to 0.3 mm is placed at a desired position in a hole for a via conductor (0.1 m).
A hole or a rectangular hole having a diameter of mφ to 0.3 mmφ) 11 is formed by punching or the like.

The low expansion coefficient filler (cordelite or the like) is, for example, an oxide fiber made of Mg ₂ Al ₂ Si ₅ O ₁₈ or the like, and has a thermal expansion coefficient of 4.0 × 1.
It is about 0 ^-7 / ° C. The high expansion coefficient filler (foresterite or the like) is, for example, an oxide fiber made of Mg ₂ SiO ₄ or the like, and has a thermal expansion coefficient of 10.
The coefficient of thermal expansion is about 5 × 10 ⁻⁶ / ° C., and the high expansion coefficient filler has a coefficient of thermal expansion about one digit (about 26 times) larger than the low expansion coefficient filler.

As described above, by firing the green sheet appropriately mixed with the low expansion coefficient filler and the high expansion coefficient filler which are solids having different properties, the organic binder is burned, removed from the green sheet and left. The burned glass is burned and solidified, but at this time, the contained fillers remain on the ceramic (multi-layer) substrate after sintering, giving inherent physical and electrical properties. The amount of the low-expansion filler and the high-expansion filler, which are solids having different properties, can suppress or adjust the shrinkage of the ceramic multilayer substrate after firing.

Next, as shown in FIG. 2B, during this drilling, the ink (via conductor ink) 1 for via (hole) conductor is used.
2 is embedded by a printing method using a metal mask.

As materials for the silver-based conductive ink for the via (conductive ink (1)), A1: silver powder 60 to 70%, B1: sintering lead glass 5 to 15%, C1: foresterite 1 to 1 5%, D1: 1-5% cordierite, and the remainder is 100% by weight of resin and solvents.

However, the materials of the lead glass for sintering used here are: a1: 40 to 60% of lead oxide, b1: 30 to 50% of silicon oxide, c1: 1 to 20% of alumina.

FIG. 2 (c) shows an ink 5 for via (hole) conductor 5 and necessary printed circuit wiring and printed circuit components 5.
The ceramic green sheets 10 are dried.
This is laminated and pressed at 100 ° C. under a pressure of 1 to 1.2 kg / mm ² to form a laminate 14. Figure 2
(D). 13 on ceramic green sheet 10
Reference numeral 15 denotes a printed circuit wiring and a printed circuit component. Reference numeral 15 denotes a conductive ink stick which has been brought into contact with each other by lamination.

Next, as shown in FIG. 2E, a metal base is attached. The metal base 16 is made of Kovar, Cu /
A metal sheet (plate) of Mo / Cu, Mo, Ni / Mo / Ni, etc. is used, the thickness is about 400 to 1000 μm, and the shrinkage in the plane direction during firing is 0.1 to 2.
It acts to suppress it to about 0%. The metal base 16 is bonded to the unfired ceramic laminate 14 by the bonding glass 17.

The material of the adhesive glass 17 is ZnO (zinc oxide) 40 to 60%, B ₂ O ₃ (boron oxide) 30 to 50%, Al ₂ O ₃ (alumina) 1 to 15%, CaO (calcium oxide) 1 to 15%.

Next, the ceramic green sheet laminate 14 with the metal base shown in FIG. 2 (f) was fired at a peak temperature of around 850 ° C., and this is shown in FIG. 2 (g). By this firing, the ceramic green sheet laminate 14 is formed.
All the organic substances such as binders contained in the substrate burn, and the volume of the substrate is reduced. The shrinkage in the direction is as small as about 0.1 to 2.0%. On the other hand, in the thickness direction of the fired ceramic multilayer substrate 14a, about 2
The shrinkage is about 0% to 50%.

Conductive ink stick 1 made of conductive ink
In No. 5, filler components (foresterite and cordierite) added to the conductive ink acted, and the volume reduction rate became smaller than that of the substrate material, so that the protrusion 5 protruded from the fired ceramic multilayer substrate by about 100 to 150 μm. The conductor electrode 18 is formed. The shape of the conductor electrode 18 depends on the shape of the via (hole) drilled first, and in this case, 0.05 m
It has a diameter of about mφ to 0.2 mmφ. Initially, the thickness of the five unfired ceramic green sheets was 1.0 mm, but after firing, it was about 0.8 mm. The size of each unfired ceramic green sheet is about 80 mm × 80 mm × 0.2 mmt, and the size of the fired ceramic multilayer substrate is about 80 mm × about 80 mm × about 0.8 mmt. It is.

FIG. 2 (g) is a view of mounting the fired conductor electrodes 18 of the ceramic multilayer substrate 19 via the electrode terminals 21 (bumps) of the semiconductor integrated circuit 20. FIG.
In (g), 19 is a fired ceramic multilayer substrate with a metal base, 13 is a printed circuit wiring and printed circuit component, 14a is a fired ceramic multilayer substrate, 16 is a metal base, 17 is an adhesive glass, and 18 is an adhesive glass. Protruding electrodes,
Reference numeral 20 denotes a semiconductor integrated circuit, and 21 denotes an electrode terminal of the semiconductor integrated circuit.

The shape of the conductor electrode 18 protruding from the surface of the ceramic multilayer substrate is selected from a columnar shape, a trapezoidal shape, a hemispherical shape or a shape similar thereto, depending on the purpose.

Further, another example according to an embodiment of the present invention will be described. In the formation of the conductor pattern of the ceramic multilayer substrate described with reference to FIG. 2, the material of the conductive ink (2) of the printed circuit wiring and the printed circuit component of the ceramic green sheet is as shown in FIG.
Shown in

The material of the conductive ink (2) is A2: 45 to 65% of silver powder, B2: 10 to 30% of lead glass for sintering, and the rest is 100% by weight including resin and solvents. Use what was done. However, the lead glass for sintering used here has the following composition.

A1: 40 to 60% of lead oxide, b1: 30 to 50% of silicon oxide, c1: 1 to 20% of alumina.

FIG. 3A shows a conductor pattern 22 formed by using the conductor ink (2). The conductor pillar 15 uses the conductor ink (1). Also, 13
Denotes printed circuit wiring and printed circuit components; 14 denotes an unfired ceramic laminate; 15 denotes a conductive ink rod which has been brought into contact by lamination to form a continuous body; 16 denotes a metal base;
7 is an adhesive glass.

FIG. 3 (b) shows a laminate 14 of the ceramic green sheet with a metal base shown in FIG. 3 (a), which was fired at a peak temperature of about 800 to 950 ° C.
Reference numeral 4a denotes a fired ceramic multilayer substrate. FIG. 3 (b)
In the figure, 19 is a fired ceramic multilayer substrate with a metal base, 13 is a printed circuit wiring and printed circuit components, 14a is a fired ceramic multilayer substrate, 16 is a metal base, 17 is an adhesive glass, and 18 is a protruding electrode. , 22
Is a conductor pattern on the ceramic substrate.

As described above, the material of the conductive ink (2) of the printed circuit wiring and printed circuit parts of the ceramic green sheet is different from that of the conductive ink (1) in material composition, and different regions of the same ceramic green sheet are used. Thickness per one (per layer) 0.2
When five layers of ceramic green sheets each having a thickness of 5 mm are used, the height protruding from the surface of the ceramic multilayer substrate 14 is about 80 to 160 μm for the conductive ink (1) and about 10 to 10 μm for the conductive ink (2). ７０70 μm. The thickness of the ceramic green sheet per sheet is about 0.1 to 0.3 mm.
The multilayer ceramic substrate 14 is formed by laminating the layers 10 to 10.

The outer shape of the protruding electrode 18 formed by the conductive ink (1) is selected according to the purpose of use, such as a column, a trapezoid, a hemisphere or a shape similar thereto.

As described with reference to FIGS. 2A to 2G, the method for manufacturing a ceramic multilayer substrate according to the present invention includes the following steps:
Ceramic ceramic green sheet (thickness 0.0
(5 mm to 0.3 mm), (2) punching a ceramic green sheet using punching or the like,
During the perforation, a step of embedding a via (hole) conductor ink (via conductor ink) (1) 12 by a printing method using a metal mask, (3) a via (hole) conductor ink 12 and a predetermined printing 5 ceramic green sheets 10 having circuit wiring and printed circuit parts are dried, laminated, and 100 °
C, laminate 1 by pressure bonding at a pressure of 1 to 1.2 kg / mm ²
(4) attaching a metal base to the laminate 14; (5) applying a ceramic green sheet laminate 14 with a metal base to a peak temperature of 800-9.
Firing at around 50 ° C.

Further, in addition to the above-described method for manufacturing a ceramic multilayer substrate, the material of the conductive ink (2) for the printed circuit wiring and printed circuit components of the ceramic green sheet is different from that of the conductive ink (1) in material composition. By using the same in different regions of the same ceramic green sheet, a step of forming conductor electrodes and bump electrodes having different heights protruding from the surface of the ceramic multilayer substrate 14 can be included.

FIG. 1 is a schematic sectional view of a ceramic multilayer substrate according to an embodiment of the present invention, which is manufactured by the above-described FIGS. In FIG. 1, reference numeral 19 denotes a fired ceramic multilayer substrate with a metal base, 13 denotes printed circuit wiring and printed circuit components on a ceramic green sheet 10, and 14a denotes a ceramic obtained by laminating ceramic green sheets, pressing and laminating the laminated body. A multilayer substrate, 16 is a metal base, 17 is an adhesive glass, 18 is a conductor pattern protruding from the surface of the fired ceramic multilayer substrate, and 22 are conductor patterns formed by using a conductive ink (2).

In summary, the present invention relates to a ceramic multi-layer substrate formed by laminating ceramic green sheets having printed circuit wiring and printed circuit components, through holes (via holes) and the like, and sintering the laminate to obtain a ceramic green sheet. The material of the ceramic green sheet and the conductive ink, wherein the shrinkage in the thickness direction after firing of the sheet is set to be larger than the shrinkage in the thickness direction after firing of the conductive ink filled in the ceramic green sheet. The material is selected to form a protruding conductor electrode on the surface of the ceramic multilayer substrate.

[0048]

As described above, according to the ceramic multilayer substrate of the first aspect of the present invention, a ceramic green sheet having printed circuit wiring and printed circuit components, a through hole, and the like is laminated and pressed, and the laminated body is fired. Wherein the shrinkage of the ceramic green sheet in the thickness direction after firing is set to be greater than the shrinkage of the conductive ink filled in the ceramic green sheet in the thickness direction after firing. It is characterized in that the material of the ceramic green sheet and the material of the conductive ink are selected, and a protruding conductor electrode is formed on the surface of the ceramic multilayer substrate. A conductor electrode having a desired protruding shape can be obtained without adding a conductor.

According to a second aspect of the present invention, there is provided the ceramic multi-layer substrate, wherein the ceramic green sheets are laminated on a metal base, and a laminated body obtained by pressing the green sheets is co-fired. The amount of contraction in the plane direction due to the above can be almost eliminated, and the accuracy of the shape and circuit constant of the element formed on the ceramic multilayer substrate can be improved.

According to a third aspect of the present invention, the material of the conductive ink (1) is as follows, and the material of the conductive ink is specified. Then, a conductor electrode having a desired protruding shape can be obtained only by selecting.

A1: 60 to 70% by weight of silver powder, B1: 5 to 15% by weight of lead glass for sintering, C1: 1 to 5% by weight of foresterite, D1: 1 to 5% by weight of cordierite,
The remainder is made up of 100% by weight of resin and solvents. However, the materials of the lead glass for sintering used here are: a1: 40 to 60% by weight of lead oxide, b1: 30 to 50% by weight of silicon oxide, c1: 1 to 20% by weight of alumina.

According to a fourth aspect of the present invention, the material of the conductive ink (2) for the printed circuit wiring and printed circuit components of the ceramic green sheet is as follows, and The invention is characterized in that conductive inks (2) having different material compositions are used in different regions of the same ceramic green sheet together with the ink (1), and conductive electrodes having different heights projecting from the surface of the ceramic multilayer substrate are formed. In addition, only the electrode portions that need to be protruded can be arbitrarily protruded, and a secondary problem (for example, short-circuiting of the electrodes) due to unnecessary electrode protruding can be prevented. Also, the protruding conductor electrodes for bumps and the conductor patterns such as circuit wiring can be arbitrarily arranged on the same ceramic multilayer substrate according to the purpose.

A2: 45 to 65% by weight of silver powder; B2: 10 to 30% by weight of lead glass for sintering; However, the lead glass for sintering used here has the following composition.

A1: 40 to 60% by weight of lead oxide, b1: 30 to 50% by weight of silicon oxide, c1: 1 to 20% by weight of alumina.

According to the ceramic multilayer substrate of the present invention, the shape of the conductor electrode protruding from the surface of the ceramic multilayer substrate is a column, a trapezoid, a hemisphere or a shape similar thereto. And an ideal shape similar to a conventional bump can be used.

Further, according to the method of manufacturing a ceramic multilayer substrate according to the sixth aspect of the present invention, (1) a step of manufacturing a glass-ceramic ceramic green sheet;
(2) a step of perforating (via holes) in a ceramic green sheet using punching or the like, and embedding ink for via conductors in the perforations; (3) ink for via conductors and predetermined printed circuit wiring and printed circuit Drying the ceramic green sheets having parts, laminating and pressing to form a laminate, (4) attaching a metal base to the laminate, and (5) forming a ceramic green sheet with the metal base. The method includes a step of firing the laminated body, and is a method of manufacturing a ceramic multilayer substrate without adding any additional step to a conventional manufacturing process, and is economical.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a ceramic multilayer substrate according to an embodiment of the present invention.

2A and 2B are diagrams illustrating a structure of a ceramic multilayer wiring board with bumps according to an embodiment of the present invention and a method of manufacturing the same, and FIG. 2A is a diagram illustrating a process of manufacturing a ceramic green sheet; FIG. 3B is a diagram illustrating a step of embedding a via (hole) conductor ink (via conductor ink) during perforation of the ceramic green sheet, and FIG. 4C is a diagram illustrating the via conductor ink and necessary printed circuit wiring and It is a figure explaining the composition which dries and laminates the ceramic green sheet which has a printed circuit part, and (d) is a figure explaining the process of pressing a ceramic green sheet and manufacturing a layered product, and (e). FIG. 4F is a diagram illustrating a process of manufacturing a process of attaching a metal base to the laminate, and FIG.
FIG. 3 is a view for explaining a process of manufacturing a ceramic multilayer substrate by firing a laminate of ceramic green sheets with a metal base, and (g) firing the fired ceramic via electrode terminals (bumps) of the semiconductor integrated circuit 20. It is a figure explaining a process of mounting a conductor electrode of a multilayer board.

3A and 3B are schematic cross-sectional views for explaining another example of manufacturing a ceramic multilayer substrate according to an embodiment of the present invention. FIG. 3A is an illustration of ink for via conductors and necessary printed circuit wiring and printing. It is a figure explaining the composition which dries and laminates the ceramic green sheet which has a circuit component, and (b) is a figure explaining the process of baking the laminated body of the ceramic green sheet with a metal base, and manufacturing a ceramic multilayer substrate. It is.

FIG. 4 is a schematic cross-sectional view of a conventional ceramic-on-metal circuit board ceramic obtained by multi-layer and co-firing.

5A and 5B are schematic cross-sectional views of a conventional ceramic multilayer substrate for mounting electronic components and a method for manufacturing the same; FIG. 5A is a schematic cross-sectional view illustrating a multilayer ceramic substrate and mounting; FIG. FIG. 7B is a view for explaining a step of forming an electrode 62, and FIG. 10B is a step of laminating a ceramic green sheet on which a through hole and an internal conductor pattern are formed together with a resin sheet, followed by pressing to form a laminate. (C) is a view for explaining a process of producing a ceramic multilayer substrate integrally formed by firing the laminate, and (d) is a diagram for mounting the ceramic multilayer substrate on a semiconductor integrated circuit. FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Ceramic green sheet 11 Hole for via conductor 12 Ink for via (hole) conductor (via conductor ink) 13 Printed circuit wiring and printed circuit parts 14 Unfired ceramic laminate 14a Ceramic multilayer substrate after fired 15 Conductive ink Conductor ink rod (conducting column) 16 Metal base 17 Adhesive glass 18 Protruding electrode 19 Ceramic multilayer substrate with fired metal base 20 Semiconductor integrated circuit 21 Electrode terminal 22 Conductor pattern

Claims (6)

[Claims] 1. A ceramic multi-layer substrate formed by laminating ceramic green sheets having printed circuit wiring and printed circuit components, through holes (via holes), etc., and pressing the laminated body, and firing the laminated ceramic green sheets. The material of the ceramic green sheet and the material of the conductive ink are set so that the contraction amount in the vertical direction is set to be larger than the contraction amount in the thickness direction after firing of the conductive ink filled in the ceramic green sheet. A ceramic multilayer substrate, wherein a protruding conductor electrode is formed on a surface of the ceramic multilayer substrate. 2. The ceramic multilayer substrate according to claim 1, wherein said ceramic green sheets are laminated on a metal base, and a laminated body obtained by pressure bonding is co-fired. 3. The ceramic multilayer substrate according to claim 2, wherein the material of the conductive ink (1) is as follows. A1: 60 to 70% by weight of silver powder, B1: 5 to 15% by weight of lead glass for sintering, C1: 1 to 5% by weight of foresterite, D1: 1 to 5% by weight of cordierite, the balance being resin and solvents And 100% by weight. However, the materials of the lead glass for sintering used here are: a1: 40 to 60% by weight of lead oxide, b1: 30 to 50% by weight of silicon oxide, c1: 1 to 20% by weight of alumina. 4. The ceramic multi-layer substrate according to claim 3, wherein a material of a conductive ink (2) for printed circuit wiring and printed circuit components of said ceramic green sheet is as follows, and said conductive ink (1): A ceramic multilayer substrate, wherein conductive inks having different material compositions are used for different regions of the same ceramic green sheet, and conductive electrodes having different heights are formed on the surface of the ceramic multilayer substrate. A2: 45 to 65% by weight of silver powder, B2: 10 to 30% by weight of lead glass for sintering,
The remainder is made up of a resin and solvents combined to make up to 100% by weight. However, the lead glass for sintering used here has the following composition. a1: 40 to 60% by weight of lead oxide, b1: 30 to 50% by weight of silicon oxide, c1: 1 to 20% by weight of alumina. 5. The ceramic multilayer substrate according to claim 2, wherein the shape of the conductor electrode protruding from the surface of the ceramic multilayer substrate is cylindrical, trapezoidal, hemispherical, or similar. Ceramic multilayer substrate. 6. A step of manufacturing (1) a glass / ceramic ceramic green sheet, and (2) a perforation (via hole) in the ceramic green sheet by punching or the like, and an ink for a via conductor is formed in the perforation. (3) a step of drying, laminating and pressing the ceramic green sheet having via conductor ink and predetermined printed circuit wiring and printed circuit components to form a laminate,
(4) attaching a metal base to the laminate;
And (5) firing the laminate of ceramic green sheets with the metal base.