JPS62167Y2 - - Google Patents
Info
- Publication number
- JPS62167Y2 JPS62167Y2 JP12070181U JP12070181U JPS62167Y2 JP S62167 Y2 JPS62167 Y2 JP S62167Y2 JP 12070181 U JP12070181 U JP 12070181U JP 12070181 U JP12070181 U JP 12070181U JP S62167 Y2 JPS62167 Y2 JP S62167Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- holes
- variable resistor
- micro
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002140 antimony alloy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Description
【考案の詳細な説明】
本考案は可変抵抗器に関し、とくに基板のビア
ホールを用いた基板端子の接続構造に関する。[Detailed Description of the Invention] The present invention relates to a variable resistor, and more particularly to a connection structure for substrate terminals using via holes in a substrate.
従来、可変抵抗器用抵抗基板に用いられる端子
の外部接続構造にはいろいろあるが、最も広く採
用されているものを第１図に示す。これは絶縁基
板１に直径0.6〜0.8mmの孔２をあけ、その孔２の
内壁面に銀ペーストなどの導電性物質３を被着
し、そこにリード端子４を半田５の半田付けによ
り接続する。この後、気密性を保持するために樹
脂６を被覆する。この端子の接続構造にはいくつ
かの欠点があり、その１つは半田付するために片
面に鉛−アンチモン合金などの軟塊を半田付けに
耐える金属の封口体７として嵌合しなければなら
ない。その２は底面側の気密を確保するための樹
脂６を厚くリード端子４の半田付け面５ａに被覆
しなければならない欠点がある。 Conventionally, there are various external connection structures for terminals used in resistance boards for variable resistors, but the most widely used structure is shown in FIG. This involves drilling a hole 2 with a diameter of 0.6 to 0.8 mm in an insulating substrate 1, coating the inner wall of the hole 2 with a conductive substance 3 such as silver paste, and connecting a lead terminal 4 to it by soldering 5. do. Thereafter, a resin 6 is applied to maintain airtightness. This terminal connection structure has several drawbacks, one of which is that in order to solder it, a soft lump of lead-antimony alloy or the like must be fitted on one side as a metal sealing body 7 that is resistant to soldering. . The second problem is that the soldering surface 5a of the lead terminal 4 must be covered with a thick layer of resin 6 to ensure airtightness on the bottom side.
本考案の目的はかかる従来欠点を除去した構造
の高信頼性の可変抵抗器用抵抗基板を提供するこ
とにある。 An object of the present invention is to provide a highly reliable resistance substrate for a variable resistor, which has a structure that eliminates such conventional drawbacks.
本考案によれば導電性物質が充填された微小貫
通孔およびその微小貫通孔に導電性物質を介して
接続された抵抗体を有する表層絶縁体と、この表
層絶縁体と同一外形寸法を有し、かつ導電性物質
が充填された微小貫通孔を有する１個以上の内層
絶縁体と、導電性物質が充填された微小貫通孔お
よびその微小貫通孔に導電性物質を介して接続さ
れた電極を有する下層絶縁体とが、それぞれ微小
貫通孔を介して導通接続された積層基板からなる
ことを特徴とする可変抵抗器用基板が得られる。 According to the present invention, there is provided a surface insulator having a minute through-hole filled with a conductive substance and a resistor connected to the minute through-hole through a conductive substance, and a surface insulator having the same external dimensions as the surface insulator. , and one or more inner layer insulators having micro through holes filled with a conductive material, micro through holes filled with a conductive material, and electrodes connected to the micro through holes via the conductive material. There is obtained a variable resistor substrate characterized in that the substrate is made of a laminated substrate in which the lower layer insulator and the lower layer insulator are electrically connected through minute through holes.
さらに本考案によれば表層絶縁体、内層絶縁体
及び下層絶縁体に設けられた微小貫通孔の軸が隣
接不一致状態で接続されることを特徴とする可変
抵抗器用基板をも得られる。 Furthermore, according to the present invention, there is also obtained a substrate for a variable resistor characterized in that the axes of minute through holes provided in the surface insulator, inner layer insulator, and lower layer insulator are connected in a manner that the axes are not adjacent to each other.
以下、本考案を第２図および第３図を参照して
説明する。第２図は本考案一実施例の積層前の基
板各層の分解構造を示す。可変抵抗器用の絶縁基
板の表層用、内装用および下層用の絶縁体として
は、アルミナ粉末を用いたスラリーをドクターブ
レード法を採用して形成した絶縁グリーンシート
８を用いる。この絶縁グリーンシート７を金型を
用いて外枠形状とビアホール９を打抜き加工す
る。この場合、ビアホール９の打抜き加工の位置
は外部端子の接続に要求される位置に孔あけされ
るのであるが、本考案では第２図に示すように一
層毎に位置をずらしてジグザグ状に上下で接続で
きるように、ビアホール９を加工してあるのは積
層化した時に上，下面間での通気性を極力押える
最良状態の構造である。なお、ビアホールの軸が
まつたく一致している構造を採用しても本考案の
目的を達成することはできる。 Hereinafter, the present invention will be explained with reference to FIGS. 2 and 3. FIG. 2 shows an exploded structure of each layer of a substrate before lamination according to an embodiment of the present invention. As insulators for the surface layer, interior layer, and lower layer of the insulating substrate for the variable resistor, an insulating green sheet 8 formed by using a doctor blade method from slurry using alumina powder is used. This insulating green sheet 7 is punched out to form an outer frame shape and a via hole 9 using a mold. In this case, the via hole 9 is punched at the position required for connection of the external terminal, but in the present invention, the position is shifted layer by layer in a zigzag pattern up and down, as shown in Figure 2. The structure in which the via hole 9 is processed so that the connection can be made is the best structure that suppresses the air permeability between the upper and lower surfaces as much as possible when stacked. Note that the object of the present invention can be achieved even if a structure in which the axes of the via holes are closely aligned is adopted.
次にビアホール９の真上にペースト状の銀−パ
ラジウム導体１０をスクリーン印刷で塗布する。
銀−パラジウム導体１０はペースト状であるから
ビアホール９中に流れ込んで、ビアホール９内を
充填させて埋めることが出来る。同時に表層用お
よび下層用の絶縁グリーンシート８ａ，８ｃにそ
れぞれ抵抗体１１と外部接続端子に接続する電極
１０としてペースト状の銀−パラジウム導体１０
をスクリーン印刷により被着して形成する。次に
銀−パラジウム導体１０中の溶媒を蒸発させるた
めに温度150℃の恒温槽で10分間乾燥した。この
ように形成した絶縁グリーンシート８を最上層に
表層用の絶縁グリーンシート８ａ、最下層に下層
用の絶縁グリーンシート８ｃを各１枚と内装用の
絶縁グリーンシート８ｂの数枚（通常は５〜８
枚）を積層し、温度115℃、圧力250Kg／cm2、時間
20分間の熱圧着をホツトプレス機で実施した。 Next, a paste-like silver-palladium conductor 10 is applied directly above the via hole 9 by screen printing.
Since the silver-palladium conductor 10 is in the form of a paste, it can flow into the via hole 9 and fill the inside of the via hole 9. At the same time, paste-like silver-palladium conductors 10 are applied to the surface layer and lower layer insulating green sheets 8a and 8c as electrodes 10 connected to resistors 11 and external connection terminals, respectively.
is formed by applying it by screen printing. Next, in order to evaporate the solvent in the silver-palladium conductor 10, it was dried for 10 minutes in a constant temperature bath at a temperature of 150°C. The insulating green sheet 8 formed in this way is made up of an insulating green sheet 8a for the surface layer as the top layer, one insulating green sheet 8c for the lower layer as the bottom layer, and several insulating green sheets 8b for the interior (usually 5 ~8
) were stacked at a temperature of 115℃, a pressure of 250Kg/cm 2 , and a time of
Thermocompression bonding was performed for 20 minutes using a hot press machine.
次に抵抗体１１は表層用の絶縁グノーンシート
８ａ上に二酸化ルテニウムを主成分とする抵抗ペ
ーストをスクリーン印刷で被着形成した。この抵
抗体１１の形成された積層体を温度850℃で10分
間のピーク領域を有し、かつ入口から出口までの
時間が60分間で通過する中性雰囲気の焼成炉中で
焼成して可変抵抗器用基板を製作した。 Next, the resistor 11 was formed by screen printing a resistor paste containing ruthenium dioxide as a main component on the insulating gnome sheet 8a for the surface layer. The laminate in which the resistor 11 was formed was fired in a firing furnace with a neutral atmosphere that had a peak area of 10 minutes at a temperature of 850°C and passed from the inlet to the outlet in 60 minutes to create a variable resistor. I made a dexterity board.
このようにした形成された可変抵抗器用基板１
３に第４図に示すように０リング１５、回転板１
６、摺動子１７を入れた金属ケース１４をかぶせ
て内部への気密性をプレツシヤクツクテスト法に
より調べると、従来例のように下層絶縁体に樹脂
をぬらなくとも十分保証できた。 Variable resistor substrate 1 thus formed
3, as shown in FIG.
6. When the metal case 14 containing the slider 17 was placed over the metal case 14 and the airtightness to the inside was examined by a pressure test method, it was found that it was sufficiently ensured without wetting the lower layer insulator with resin as in the conventional example.
以上、本考案基板は(i)ビアホールに間隙部のな
い接続材が充填されるので気密性に優れた一体構
造の接続ができる。(ii)可変抵抗器の組立工程のう
ち樹脂塗布による間隙部充填補強の工程を省略で
きる等の効果がある。 As described above, in the substrate of the present invention, (i) the via holes are filled with the connecting material without any gaps, so that connections can be made in an integral structure with excellent airtightness. (ii) Among the assembling steps of the variable resistor, the step of filling and reinforcing the gap by applying resin can be omitted.
第１図は従来の可変抵抗器のリード端子取り出
し部の断面図。第２図は本考案の一実施例の可変
抵抗器用基板の分離状態を示した断面図。第３図
は本考案の一実施例の可変抵抗器用基板に金属ケ
ースをかぶせた組立図。
１……絶縁基板、２……孔、３……導電性物
質、４……リード端子、５……半田、６……樹
脂、７……金属、８……絶縁グリーンシート、９
……ビアホール、１０……銀−パラジウム導体、
１１……電極、１２……抵抗体、１３……可変抵
抗器用基板、１４……金属ケース、１５……０リ
ング、１６……回転板、１７……摺動子。
FIG. 1 is a sectional view of a lead terminal extraction portion of a conventional variable resistor. FIG. 2 is a sectional view showing a separated state of a variable resistor substrate according to an embodiment of the present invention. FIG. 3 is an assembly diagram of a variable resistor substrate according to an embodiment of the present invention covered with a metal case. 1... Insulating substrate, 2... Hole, 3... Conductive material, 4... Lead terminal, 5... Solder, 6... Resin, 7... Metal, 8... Insulating green sheet, 9
... Via hole, 10 ... Silver-palladium conductor,
11... Electrode, 12... Resistor, 13... Variable resistor substrate, 14... Metal case, 15... O ring, 16... Rotating plate, 17... Slider.
Claims (1)
記微小貫通孔に導電性物質を介して接続された
抵抗体を有する表層絶縁体と、前記表層絶縁体
と同一外形寸法を有し、かつ導電性物質が充填
された微小貫通孔を有する１個以上の内層絶縁
体と、導電性物質が充填された微小貫通孔およ
び前記微小貫通孔に導電性物質を介して接続さ
れた電極を有する下層絶縁体とが、それぞれ微
小貫通孔を介して導通接続された積層基板を有
することを特徴とする可変抵抗器。 (2) 前記表層絶縁体、内層絶縁体及び下層絶縁体
に設けられた微小貫通孔の軸が隣接不一致状態
で接続されることを特徴とする実用新案登録請
求の範囲第１項記載の可変抵抗器。[Claims for Utility Model Registration] (1) A surface insulator having a minute through-hole filled with a conductive substance and a resistor connected to the minute through-hole via a conductive substance; one or more inner layer insulators having the same external dimensions and having micro through holes filled with a conductive material, a micro through hole filled with a conductive material, and a conductive material inserted into the micro through holes; 1. A variable resistor comprising a laminated substrate in which a lower layer insulator having electrodes connected to each other is electrically connected through micro through holes. (2) The variable resistor according to claim 1 of the utility model registration, characterized in that the axes of the minute through holes provided in the surface insulator, inner layer insulator, and lower layer insulator are connected in a state where they are not adjacent to each other. vessel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12070181U JPS5827901U (en) | 1981-08-14 | 1981-08-14 | variable resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12070181U JPS5827901U (en) | 1981-08-14 | 1981-08-14 | variable resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5827901U JPS5827901U (en) | 1983-02-23 |
| JPS62167Y2 true JPS62167Y2 (en) | 1987-01-07 |
Family
ID=29914683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12070181U Granted JPS5827901U (en) | 1981-08-14 | 1981-08-14 | variable resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5827901U (en) |
-
1981
- 1981-08-14 JP JP12070181U patent/JPS5827901U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5827901U (en) | 1983-02-23 |
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