JPH0241917B2 - - Google Patents
Info
- Publication number
- JPH0241917B2 JPH0241917B2 JP58239506A JP23950683A JPH0241917B2 JP H0241917 B2 JPH0241917 B2 JP H0241917B2 JP 58239506 A JP58239506 A JP 58239506A JP 23950683 A JP23950683 A JP 23950683A JP H0241917 B2 JPH0241917 B2 JP H0241917B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- green sheet
- ceramic green
- paste
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000010292 electrical insulation Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、配線間のピツチ寸法が小さく、配線
が高密度である、ICパツケージや多層配線基板
の製造法に関する。
［従来の技術］
従来より、ICパツケージまたは多層配線基板
はつぎのようにして製造されている。
ＷまたはＷ−Mo系のペーストにてセラミツク
グリーンシート上に配線を印刷したものを所望枚
数製造し、各単シートを加温するか、または接着
剤を塗布した後積み重ねて加圧、加温して積層体
を作り、樹脂抜き後、還元雰囲気で焼成する。
［発明が解決しようとする課題］
最近、ICパツケージや多層配線基板は、小型
化または集積密度が向上し、配線の線幅寸法、配
線間のピツチ寸法が小さくなつてきている。従来
の技術を用いると積層体成形工程で配線が変形、
破壊、溶解により拡がる。このため、焼成後の
ICパツケージや多層配線基板において、隣接配
線がシヨートしたり、電気絶縁性が劣化したり、
電気抵抗値がばらついたりする電気的欠陥を起こ
す。
本発明の目的は、配線間の電気絶縁性に優れ、
耐久性の向上が図れる多層配線基板、ICパツケ
ージの製造法の提供にある。
［課題を解決するための手段］
上記目的達成のため、本発明は、ＷまたはＷ−
Mo系のペーストで配線を印刷したセラミツクグ
リーンシート上に、該シートと同材質のセラミツ
クグリーンシートを積層し、還元雰囲気中で焼成
一体化してなる電気絶縁性を有する多層配線基板
の製造法において、前記下側セラミツクグリーン
シートの配線印刷部と上側セラミツクグリーンシ
ートとの重なり部分に、これらグリーンシートと
同材料のペースト層を介在させて多層配線基板の
製造を行う構成を採用した。
［作用および発明の効果］
本発明はつぎの作用および効果を奏する。
配線印刷部と上側セラミツクグリーンシートと
の重なり部分にペースト層を介在させ、積層時に
配線印刷部が上側セラミツクグリーンシートに直
接当らないようにしているので、積層する際、前
記ペースト層により配線印刷部を確実に保護で
き、配線の変形、破壊、または溶解分散が阻止で
きる。
よつて、本発明の製造法で製造した多層配線基
板やICパツケージは、電気絶縁低下や電気短絡、
電気抵抗値の変動等の欠陥が解決でき、配線印刷
部をもつ面の凹凸状の減少で気密性が向上し耐リ
ーク性を大幅改善でき、併せて合格歩留も大きく
向上できる。
［実施例］
本発明の一実施例を第１図〜第３図に基づき説
明する。
図に示すICパツケージ（発明品）において、
６はセラミツクグリーンシート、８は配線部、９
は額縁形状のペースト、１０はグリーンシート打
抜き額縁である。
つぎに製造方法を述べる。
(1) グリーンシート６上に、IC素子搭載部７と
配線部８とをＷ粉末を調製してなるペーストで
同時に印刷する（第１図参照）。なお配線部８
の配線間ピツチは0.60mm、線幅寸法は0.3mmで
ある。
(2) 第２図に示すように、グリーンシート打抜き
額縁１０（第２図）の幅寸法より0.3mm大きい
寸法にてグリーンシート６と同一材質のペース
トを20μｍの厚さにてペースト９を印刷する
（第２図参照）。
(3) ペースト９（第１図に示す）の上面に、接着
剤を塗布した額縁１０を載置する。
(4) 温度を80℃に設定したプレス機にこれをセツ
トして、圧力10Kg／cm2にて20秒間加圧する。な
お、このとき接着剤塗布面は配線部８に全く接
触しない。
(5) 第３図に示す積層体を170℃で樹脂抜きをす
る。
(6) 1550℃の水素と窒素との混合ガス中で焼成さ
せる。
(7) この焼成体のメタライズ面にNi鍍金を施し、
コバールリードの電極取り出しを銀ろう材を使
用して750℃中の水素と窒素の混合ガス中にて
接合した。
(8) これに金鍍金を施し、IC素子を装着し、ガ
ラスキヤツプを溶着して完成する。
つぎに、第６図に示す比較品の構成について述
べる。
比較品は、上記(2)の工程を行わずに、配線部３
（Ｗペースト）を印刷したセラミツクグリーンシ
ート１（第４図品）上に、接着剤を塗布した第５
図に示す額縁形状４（第２図の１０と同じ物）を
載置して製造したものである。
つぎに、上記発明品の作用効果、および発明品
と比較品との電気絶縁性の比較結果を第１表とと
もに述べる。
(1) 発明品の配線間の電気絶縁性は、全て（合計
200個）1010Ω以上であつた。
比較品では、絶縁性の低下変動は31％〜36％
が該当し、その内1.5％が短絡不良であつた。
これは、額縁形状４を積層する際、密着を確実
にするため50Kg／cm2以上の高圧を必要とする
が、額縁形状は変形し易く、または破壊が起き
やすい。したがつて、10Kg／cm2以下の低い圧力
で加圧せざるを得ない。そのために接着剤を多
量に塗布して接着する必要があり、その結果と
して隣接配線がシヨートしたり、電気絶縁性が
劣化したり、電気抵抗値がばらつく。
(2) 発明品、比較品を実機に組付け、電気的総合
耐久性をテストしたところ、発明品は3000時間
経過後において100％合格であつたが、従来品
は96％合格であつた。
つぎに変形例を述べる。
ａ 以上の実施例では、ICパツケージの配線ピ
ツチが割合大きいものについて述べたが、配線
ピツチが0.25mm〜0.50mmの微細配線をもつICパ
ツケージや多層配線基板の製造法にも適し、こ
れにより電気的特性に優れたものが製造でき
る。
ｂ 上側セラミツクグリーンシートの上表面に、
ＷまたはＷ−Mo系のペーストで配線が印刷さ
れていてもよい。
ｃ 上側セラミツクグリーンシートと下側セラミ
ツクグリーンシートの材質は完全同一である必
要はない。また、ペースト層の材料もこれらシ
ートの材料と完全同一である必要はない。
【表】DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing IC packages and multilayer wiring boards in which the pitch between wirings is small and the wiring density is high. [Prior Art] Conventionally, IC packages or multilayer wiring boards have been manufactured in the following manner. A desired number of ceramic green sheets are printed with wiring using W or W-Mo based paste, and each sheet is heated, or an adhesive is applied and then stacked and pressed and heated. A laminate is made, and after removing the resin, it is fired in a reducing atmosphere. [Problems to be Solved by the Invention] Recently, IC packages and multilayer wiring boards have become smaller and their integration density has improved, and the line width dimensions of wiring and the pitch dimensions between wirings have become smaller. If conventional technology is used, the wiring will be deformed during the laminate forming process.
Spreads by destruction and dissolution. For this reason, after firing
In IC packages and multilayer wiring boards, adjacent wiring may be shorted or electrical insulation may deteriorate.
This causes electrical defects such as variations in electrical resistance. The purpose of the present invention is to provide excellent electrical insulation between wirings,
Our objective is to provide a manufacturing method for multilayer wiring boards and IC packages that can improve durability. [Means for Solving the Problems] In order to achieve the above object, the present invention provides W or W-
In a method for manufacturing a multilayer wiring board having electrical insulation properties, a ceramic green sheet made of the same material as the ceramic green sheet with wiring printed with Mo-based paste is laminated on top of the ceramic green sheet, and the ceramic green sheets are baked and integrated in a reducing atmosphere. A configuration was adopted in which a paste layer made of the same material as those of these green sheets was interposed in the overlapping portion of the wiring printed portion of the lower ceramic green sheet and the upper ceramic green sheet to manufacture a multilayer wiring board. [Actions and Effects of the Invention] The present invention has the following actions and effects. A paste layer is interposed between the printed wiring part and the upper ceramic green sheet to prevent the printed wiring part from directly touching the upper ceramic green sheet during lamination. It can reliably protect the wiring and prevent wiring from being deformed, destroyed, or dissolved or dispersed. Therefore, multilayer wiring boards and IC packages manufactured using the manufacturing method of the present invention are free from deterioration in electrical insulation, electrical short circuits,
Defects such as fluctuations in electrical resistance can be resolved, airtightness can be improved by reducing the unevenness of the surface with printed wiring, and leak resistance can be greatly improved, and the yield of successful products can also be greatly improved. [Example] An example of the present invention will be described based on FIGS. 1 to 3. In the IC package (invention product) shown in the figure,
6 is a ceramic green sheet, 8 is a wiring part, 9
1 is a frame-shaped paste, and 10 is a green sheet punched frame. Next, the manufacturing method will be described. (1) On the green sheet 6, simultaneously print the IC element mounting part 7 and the wiring part 8 with a paste prepared from W powder (see Fig. 1). Note that the wiring section 8
The pitch between the lines is 0.60mm, and the line width is 0.3mm. (2) As shown in Figure 2, print paste 9 of the same material as the green sheet 6 with a thickness of 20 μm in a size 0.3 mm larger than the width of the green sheet punched picture frame 10 (Figure 2). (See Figure 2). (3) Place the picture frame 10 coated with adhesive on the top surface of the paste 9 (shown in FIG. 1). (4) Set this in a press machine set at a temperature of 80°C, and pressurize for 20 seconds at a pressure of 10 kg/cm 2 . Note that at this time, the adhesive-applied surface does not come into contact with the wiring portion 8 at all. (5) Remove the resin from the laminate shown in Figure 3 at 170°C. (6) Calcinate in a mixed gas of hydrogen and nitrogen at 1550°C. (7) Ni plating is applied to the metallized surface of this fired body,
The electrodes of the Kovar lead were joined using silver brazing material in a mixed gas of hydrogen and nitrogen at 750°C. (8) Gold plating is applied to this, an IC element is attached, and a glass cap is welded to complete the process. Next, the structure of the comparative product shown in FIG. 6 will be described. The comparative product does not perform the process (2) above, and the wiring part 3
Ceramic green sheet 1 (Fig. 4) printed with (W paste) is coated with adhesive.
It is manufactured by mounting a picture frame shape 4 shown in the figure (same as 10 in FIG. 2). Next, the effects of the invention and the comparison results of the electrical insulation properties of the invention and comparative products will be described with reference to Table 1. (1) The electrical insulation between the wires of the invention is
200 pieces) 10 10 Ω or more. For comparison products, the variation in insulation properties is 31% to 36%.
Of these, 1.5% were short-circuit defects.
This requires a high pressure of 50 Kg/cm 2 or more to ensure adhesion when stacking the frame shapes 4, but the frame shapes are easily deformed or destroyed. Therefore, it is necessary to apply pressure at a low pressure of 10 kg/cm 2 or less. For this reason, it is necessary to apply a large amount of adhesive for bonding, and as a result, adjacent wiring may be shorted, electrical insulation may deteriorate, and electrical resistance may vary. (2) When the invented product and the comparative product were assembled into an actual machine and tested for overall electrical durability, the invented product passed 100% after 3000 hours, while the conventional product passed 96%. Next, a modified example will be described. a In the above embodiments, the wiring pitch of the IC package is relatively large, but it is also suitable for manufacturing IC packages and multilayer wiring boards that have fine wiring with a wiring pitch of 0.25 mm to 0.50 mm. It is possible to manufacture products with excellent physical properties. b On the upper surface of the upper ceramic green sheet,
The wiring may be printed with W or W-Mo based paste. c. The materials of the upper ceramic green sheet and the lower ceramic green sheet do not need to be completely the same. Further, the material of the paste layer does not need to be completely the same as the material of these sheets. 【table】
第１図〜第３図は本発明の一実施例を示す。第
１図はグリーンシート上に額縁形状のペーストを
塗布したところを示す上面図、第２図はそのペー
スト上に載置接着するグリーンシート打抜き額縁
の上面図、第３図は載置完了後のＢ−Ｂ線断面図
である。第４図〜第６図は比較品を示す。第４図
は配線部を印刷したグリーンシートの上面図、第
５図はそのシート上に載置接着する額縁形状の上
面図、第６図は載置完了後のＡ−Ａ線断面図であ
る。
図中、６……セラミツクグリーンシート（下側
セラミツクグリーンシート）、８……配線部（配
線印刷部）、９……額縁形状のペースト（ペース
ト層）、１０……グリーンシート打抜き額縁（上
側セラミツクグリーンシート）。
1 to 3 show an embodiment of the present invention. Figure 1 is a top view showing a picture frame-shaped paste applied onto a green sheet, Figure 2 is a top view of a green sheet punched frame to be placed and adhered onto the paste, and Figure 3 is a top view after the installation is complete. It is a sectional view taken along the line B-B. 4 to 6 show comparative products. Figure 4 is a top view of a green sheet with wiring printed on it, Figure 5 is a top view of the frame shape to be placed and glued onto the sheet, and Figure 6 is a cross-sectional view taken along line A-A after placement is complete. . In the figure, 6... Ceramic green sheet (lower ceramic green sheet), 8... Wiring part (wiring printing part), 9... Frame-shaped paste (paste layer), 10... Green sheet punched picture frame (upper ceramic green sheet). green sheet).
Claims (1)
したセラミツクグリーンシート上に、該シートと
同材質のセラミツクグリーンシートを積層し、 還元雰囲気中で焼成一体化してなる電気絶縁性
を有する多層配線基板の製造法において、 前記下側セラミツクグリーンシートの配線印刷
部と上側セラミツクグリーンシートとの重なり部
分に、これらグリーンシートと同材料のペースト
層を介在させたことを特徴とする多層配線基板の
製造法。[Scope of Claims] 1. Electrical insulation made by laminating ceramic green sheets made of the same material as the ceramic green sheets on which wiring is printed with W or W-Mo based paste, and baking them in a reducing atmosphere to integrate them. A method for manufacturing a multilayer wiring board having the following properties, characterized in that a paste layer made of the same material as the green sheets is interposed in the overlapped portion of the wiring printed portion of the lower ceramic green sheet and the upper ceramic green sheet. A method for manufacturing multilayer wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23950683A JPS60130888A (en) | 1983-12-19 | 1983-12-19 | Method of producing multilayer laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23950683A JPS60130888A (en) | 1983-12-19 | 1983-12-19 | Method of producing multilayer laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60130888A JPS60130888A (en) | 1985-07-12 |
| JPH0241917B2 true JPH0241917B2 (en) | 1990-09-19 |
Family
ID=17045798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23950683A Granted JPS60130888A (en) | 1983-12-19 | 1983-12-19 | Method of producing multilayer laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130888A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558835A (en) * | 1978-07-04 | 1980-01-22 | Shinryo Air Conditioning Co Ltd | Treatment of surplus sludge |
| JPS6059798A (en) * | 1983-09-13 | 1985-04-06 | 日立化成工業株式会社 | Ceramic circuit board |
-
1983
- 1983-12-19 JP JP23950683A patent/JPS60130888A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558835A (en) * | 1978-07-04 | 1980-01-22 | Shinryo Air Conditioning Co Ltd | Treatment of surplus sludge |
| JPS6059798A (en) * | 1983-09-13 | 1985-04-06 | 日立化成工業株式会社 | Ceramic circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60130888A (en) | 1985-07-12 |
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