JPS63260122A - Manufacture of laminated ceramic element - Google Patents
Manufacture of laminated ceramic elementInfo
- Publication number
- JPS63260122A JPS63260122A JP62094613A JP9461387A JPS63260122A JP S63260122 A JPS63260122 A JP S63260122A JP 62094613 A JP62094613 A JP 62094613A JP 9461387 A JP9461387 A JP 9461387A JP S63260122 A JPS63260122 A JP S63260122A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- ceramic
- sheet
- raw
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は積層型セラミック電歪素子あるいは積層型セラ
ミックコンデンサ素子を作る際に適用して有効な積層型
セフミック素子の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a method of manufacturing a laminated cefmic element that is effective when applied to the production of a laminated ceramic electrostrictive element or a laminated ceramic capacitor element.
「従来技術」
例えば積層型電歪素子の製造方法は、第4図A、Bに示
すように表面に内部電極となる導電層2を所定パターン
に塗着したチタン酸ジルコン酸鉛等のセラミックよりな
る生シート1と導電層を有しない同質の保饅用生シート
1′とを用意し、これらを第5図のように積層した後、
加圧加熱して圧着し、第8図のように積層型電歪素子の
単品Sに切断し、950〜1100℃で焼成している。``Prior art'' For example, a method for manufacturing a laminated electrostrictive element is to use a ceramic material such as lead zirconate titanate with a conductive layer 2 applied to the surface in a predetermined pattern to serve as an internal electrode, as shown in FIGS. 4A and 4B. After preparing a raw sheet 1 and a raw sheet 1' for preservation of the same quality without a conductive layer, and stacking them as shown in FIG.
It is pressurized and heated to be crimped, cut into single pieces S of laminated electrostrictive elements as shown in FIG. 8, and fired at 950 to 1100°C.
「従来の問題点」
上記従来によれば、各セラミック生シートの積層面は単
に当接しているだけであるから圧着時の加圧によって位
置ズレを生じたまま焼成することとなり、不良品の多発
が避けられなかった。更に層間剥離(デラミネーシlン
)ヲ起こし易い欠点もあった。``Conventional Problems'' According to the above-mentioned conventional method, since the laminated surfaces of each raw ceramic sheet are simply in contact with each other, the pressure applied during crimping causes the firing to occur with misalignment, resulting in a high number of defective products. was unavoidable. Furthermore, it also had the disadvantage of easily causing delamination.
「問題を解決するための手段」
各セフミック生シートを積層する際に、前記生シートに
使用したものと同じセラミック粉末を含有した樹脂粘着
層を介して積層、接層したものである。"Means for Solving the Problem" When laminating Cefmic raw sheets, they are laminated and bonded via a resin adhesive layer containing the same ceramic powder as that used for the raw sheets.
「作用」
各セラミック生シートの積層面は樹脂粘着層によって接
着されているので圧着時の加圧によって位置ズVを生じ
るようなことはない。また樹脂粘着層にはセラミック生
シートと同材料のセラミック粉末が含有されているので
、セラミック生シートと導電層との熱膨張差を緩和し焼
成時の剥離(デラミネーシヨン)を防止する。"Function" Since the laminated surfaces of each raw ceramic sheet are adhered by the resin adhesive layer, no positional deviation V occurs due to pressure during crimping. Furthermore, since the resin adhesive layer contains ceramic powder made of the same material as the raw ceramic sheet, the difference in thermal expansion between the raw ceramic sheet and the conductive layer is alleviated and peeling (delamination) during firing is prevented.
「実施例」
チタン酸ジルコン酸鉛よりなるセラミックベー、7’=
トよりドクターブレード法によ、り0.25m厚のシー
ト状に成形し、その表面にAg −Pd系のメタライズ
インクをスクリーンにより所定のパターンの導電層(内
部電極)2を印刷したセラミック生シート1(第1図A
)20枚と、導′胤層2全印刷しない同質のセラミック
生シートよシなる保護シート1′(第1図B)1枚とを
準備する。次に前記セラミックペーストに用いた同じチ
タン酸ジルコン酸鉛の粉末を樹カ旨粘着剤に混合せしめ
たものを粘着層3として前記各セラミック生シート1の
表面に10μm厚さに形成し、この粘着層8を介して順
次生シート1を積r−接着し、最上部に保護シート1′
を槓層接屑する(第2図)。続いてこの接着した積1m
体を温度80’C1圧力81に/dの条件下で熱圧着す
る。更にこの圧着体を第3図に示すような単体Sに切断
し、950〜1100°Cにて焼成する。"Example" Ceramic base made of lead zirconate titanate, 7'=
A raw ceramic sheet is formed into a sheet with a thickness of 0.25 m using the doctor blade method, and a conductive layer (internal electrode) 2 of a predetermined pattern is printed on the surface of the sheet with Ag-Pd metallizing ink using a screen. 1 (Figure 1A
) and one protective sheet 1' (FIG. 1B) made of a homogeneous ceramic green sheet in which the conductive layer 2 is not entirely printed. Next, the same lead zirconate titanate powder used in the ceramic paste was mixed with a resinous adhesive to form an adhesive layer 3 on the surface of each green ceramic sheet 1 to a thickness of 10 μm. The raw sheets 1 are sequentially laminated and glued through the layer 8, and the protective sheet 1' is placed on top.
(Fig. 2). Next, this glued area of 1m
The body is thermocompression bonded at a temperature of 80'C and a pressure of 81/d. Furthermore, this crimped body is cut into single pieces S as shown in FIG. 3, and fired at 950 to 1100°C.
焼成後は両側面に銀等の導電塗料(図示しない)を塗着
して電気的並列になるよう配線することによって積層型
電歪素子が完成される。After firing, a laminated electrostrictive element is completed by applying conductive paint (not shown) such as silver to both sides and wiring them so that they are electrically parallel.
次に上記本発明方法によって得られた積層型電歪素子と
、粘着層を使用しない従来方法によりて得られた電歪素
子とについて、デラミネーシヨン及び電圧−変位特性を
測定し九結果を次表に示す通り、本発明方法による積層
型電歪素子は、従来方法に比し不良発生率が小さく、か
つ電圧−変位特性も優れることが認められた。Next, the delamination and voltage-displacement characteristics of the laminated electrostrictive element obtained by the method of the present invention and the electrostrictive element obtained by the conventional method without using an adhesive layer were measured, and the results are as follows. As shown in the table, the laminated electrostrictive element produced by the method of the present invention was found to have a lower failure rate and better voltage-displacement characteristics than those produced by the conventional method.
なお、上例において粘着層3の厚みは、積7mするセラ
ミック生シートの厚みの半分以下が望ましく、これより
厚いと逆に焼成後にデラミネーシヨンを生じ易くなり、
また樹脂積層剤に対するセラミック粉末の充填量は20
〜60重量%の範囲が望ましく20重量以下では6生シ
ートの積層面間の熱膨張による歪みを充分緩和すること
ができず、60重量%を越えると接着力が著しく低下す
ることも実験により確認した。In the above example, the thickness of the adhesive layer 3 is desirably less than half the thickness of the 7 m raw ceramic sheet; if it is thicker than this, delamination is likely to occur after firing.
In addition, the amount of ceramic powder packed into the resin laminating agent is 20
A range of ~60% by weight is desirable; if it is less than 20% by weight, it will not be possible to sufficiently alleviate the distortion caused by thermal expansion between the laminated surfaces of the 6 green sheets, and it has been confirmed through experiments that if it exceeds 60% by weight, the adhesive strength will drop significantly. did.
更に上例は電圧印加により長手方向(積層方向)に変位
する積層型電歪素子を対称としたが高容i素子として利
用される積層型コンデンサ素子にも本発明を適用できる
こと勿論である。Furthermore, although the above example deals with a laminated electrostrictive element that is displaced in the longitudinal direction (laminated direction) by voltage application, it goes without saying that the present invention can also be applied to a laminated capacitor element used as a high-capacity i-element.
「効果」
本発明方法によれば、各セラミック生シートを接着させ
て積層できるので従来方法に比し積層作業が容易でしか
も圧着時の加圧により位置ズレが起こらず、更には焼成
時のダラミネーシ鵞ンの発生を抑制し得るので歩留まり
を向上し引いては信頼性の優れたこの植積層型セヲミッ
ク素子を安価に供し得る利点がある。``Effects'' According to the method of the present invention, each raw ceramic sheet can be bonded and laminated, so the lamination work is easier than in the conventional method, and there is no misalignment due to the pressure applied during crimping, and there is no dull lamination during firing. This has the advantage of being able to suppress the occurrence of porosity, thereby improving the yield and, in turn, making it possible to provide the planted laminated type sewomic element with excellent reliability at a low cost.
第1図A、Bは本発明例に用いる上面に粘着層を被着し
たセラミック生シートと保護シートとを示す説明図、第
2図は第1図A、Hに示す複数枚の生シートと保護シー
トとの積層状態を示す説明図、第8図は第2図に示す積
層物より切断して得た積層型セラミック素子の斜視図を
示す。@4図A、B及び第5図はそれぞれ従来例に係り
、前記第1図A、B汲び第2図と同様に示した説明図で
ある。なお、図中同一番号は同一部品を示す。
1・・・セフミック生シート、1′・・・保護用セフミ
ック生シート、2・・・内部電極となる導電層、8・・
・樹脂粘着層
第 l 図A 第1図B
第2図
第4図A 第4図B
第5図
第 3 図1A and 1B are explanatory diagrams showing a green ceramic sheet with an adhesive layer on the upper surface and a protective sheet used in an example of the present invention, and FIG. 2 is an explanatory diagram showing a plurality of green sheets shown in FIGS. FIG. 8 is an explanatory diagram showing the state of lamination with a protective sheet, and FIG. 8 is a perspective view of a laminated ceramic element obtained by cutting the laminate shown in FIG. 2. @4 Figures A and B and Figure 5 respectively relate to conventional examples and are explanatory diagrams shown similarly to Figures 1A and B and Figure 2 above. Note that the same numbers in the figures indicate the same parts. DESCRIPTION OF SYMBOLS 1... Cefmic raw sheet, 1'... Cefmic raw sheet for protection, 2... Conductive layer serving as an internal electrode, 8...
・Resin adhesive layer Figure A Figure 1 B Figure 2 Figure 4 A Figure 4 B Figure 5 Figure 3
Claims (1)
、該シートに使用したものと同じセラミック粉末を適量
含有した樹脂粘着層を介して積層接着し加圧することを
特徴とする積層型セラミック素子の製造方法。A laminated ceramic element characterized in that a plurality of raw ceramic sheets each having a conductive layer applied to the surface thereof are laminated and bonded through a resin adhesive layer containing an appropriate amount of the same ceramic powder as that used for the sheets and pressed together. Production method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62094613A JPH0787158B2 (en) | 1987-04-17 | 1987-04-17 | Method for manufacturing laminated ceramic element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62094613A JPH0787158B2 (en) | 1987-04-17 | 1987-04-17 | Method for manufacturing laminated ceramic element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63260122A true JPS63260122A (en) | 1988-10-27 |
JPH0787158B2 JPH0787158B2 (en) | 1995-09-20 |
Family
ID=14115099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62094613A Expired - Lifetime JPH0787158B2 (en) | 1987-04-17 | 1987-04-17 | Method for manufacturing laminated ceramic element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0787158B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0352214A (en) * | 1989-07-20 | 1991-03-06 | Matsushita Electric Ind Co Ltd | Manufacture of laminated ceramic capacitor |
JPH0379007A (en) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | Green sheet for laminated ceramic capacitor and manufacture of laminated ceramic capacitor |
JPH03253014A (en) * | 1990-03-02 | 1991-11-12 | Hitachi Ltd | Film capacitor and manufacture thereof |
WO2003036667A1 (en) * | 2001-10-25 | 2003-05-01 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic electronic component manufacturing method |
-
1987
- 1987-04-17 JP JP62094613A patent/JPH0787158B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0352214A (en) * | 1989-07-20 | 1991-03-06 | Matsushita Electric Ind Co Ltd | Manufacture of laminated ceramic capacitor |
JPH0379007A (en) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | Green sheet for laminated ceramic capacitor and manufacture of laminated ceramic capacitor |
JPH03253014A (en) * | 1990-03-02 | 1991-11-12 | Hitachi Ltd | Film capacitor and manufacture thereof |
WO2003036667A1 (en) * | 2001-10-25 | 2003-05-01 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic electronic component manufacturing method |
US7014725B2 (en) | 2001-10-25 | 2006-03-21 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder |
CN1317722C (en) * | 2001-10-25 | 2007-05-23 | 松下电器产业株式会社 | Multilayer ceramic electronic component manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JPH0787158B2 (en) | 1995-09-20 |
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