JPH03155176A - Manufacture of laminated piezoelectric element - Google Patents
Manufacture of laminated piezoelectric elementInfo
- Publication number
- JPH03155176A JPH03155176A JP1293859A JP29385989A JPH03155176A JP H03155176 A JPH03155176 A JP H03155176A JP 1293859 A JP1293859 A JP 1293859A JP 29385989 A JP29385989 A JP 29385989A JP H03155176 A JPH03155176 A JP H03155176A
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- piezoelectric
- laminate
- sheet
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000010409 thin film Substances 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 14
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000012774 insulation material Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は積層型圧電素子の製造方法に関し、特に、−層
おきに突起が同じ側に突出する金属電極の突起部以外の
部分を簡単に絶縁することができる積層型圧電素子の製
造方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing a laminated piezoelectric element, and in particular, it is possible to easily remove parts other than the protrusions of a metal electrode in which protrusions protrude on the same side in every other layer. The present invention relates to a method of manufacturing a laminated piezoelectric element that can be insulated.
積層コンデンサ構造をとる圧電素子は低電圧で大きな歪
みを発生する優れたアクチュエータである。このため、
微細加工を行う半導体等の各種電子部品の製造装置や、
微小な位置決めを必要とする光学装置等にこの圧電アク
チュエータが用いられている。また、このような圧電素
子と電極板とを交互に積層し、各層の上下に位置する電
極をそれぞれ異なった電圧源に接続して、発生させる歪
量を大きくした積層型圧電アクチュエータも実用化され
ており、近年ではドツトプリンタ用ヘッド等の制御部品
にもこの積層型圧電アクチュエータが使用されるように
なってきている。Piezoelectric elements with a multilayer capacitor structure are excellent actuators that generate large distortions at low voltages. For this reason,
Manufacturing equipment for various electronic components such as semiconductors that perform microfabrication,
This piezoelectric actuator is used in optical devices and the like that require minute positioning. In addition, a stacked piezoelectric actuator has been put into practical use, in which such piezoelectric elements and electrode plates are alternately stacked, and the electrodes located above and below each layer are connected to different voltage sources to increase the amount of strain generated. In recent years, laminated piezoelectric actuators have also come to be used as control parts for dot printer heads and the like.
ところで、積層型圧電アクチュエータは前述のように一
層おきに電極を同じ電源に接続するために、同じ電源に
接続される2つの電極板(あるいは電極層)の間に位置
する他の電源に接続される電極板(あるいは電極層)の
端部を、短絡防止のために絶縁する必要がある。By the way, in order to connect the electrodes of every other layer to the same power source as described above, the laminated piezoelectric actuator is connected to another power source located between two electrode plates (or electrode layers) connected to the same power source. It is necessary to insulate the ends of the electrode plates (or electrode layers) to prevent short circuits.
第11図は実開昭64−39665号公報に示された従
来の絶縁方法を示すものである。図において11はセラ
ミックス層、12は内部導電体層であり、交互に積層さ
れている。この例の積層型圧電体では金属電極板は使用
されていない。そして、対向する2つの側面に露出して
いる内部導電体層12は一層おきにガラス絶縁層16に
よって絶縁されており、外部電極17が絶縁された内部
導電体層12に接触しないように両面に取り付けられて
いる。19はこの外部電極17を電源に接続するリード
線、18はそのはんだ何部を示している。また、内部導
電体層(内部電極)の側面端部を一層おきに合成樹脂に
てこれと同様の絶縁処理をし、その上から外部導体層(
外部電極)を形成したものとしては特開昭59−128
683号公報に開示があり、更に、ガラスフリットで圧
電素子の側面を盛り上げ、溝部に位置する内部電極の露
出部を一層おきに絶縁剤で埋める例が特開昭61−23
4579号公報に示されている。FIG. 11 shows a conventional insulation method disclosed in Japanese Utility Model Application Publication No. 64-39665. In the figure, 11 is a ceramic layer and 12 is an internal conductor layer, which are alternately laminated. No metal electrode plate is used in the laminated piezoelectric body of this example. The internal conductive layers 12 exposed on the two opposing sides are insulated by glass insulating layers 16 every other layer, and the external electrodes 17 are coated on both sides so that they do not come into contact with the insulated internal conductive layers 12. installed. Reference numeral 19 indicates a lead wire for connecting this external electrode 17 to a power source, and 18 indicates its solder portion. In addition, the side edges of the internal conductor layers (internal electrodes) are insulated in the same manner as this with synthetic resin every other layer, and then the external conductor layers (
JP-A-59-128 discloses a device with external electrodes formed thereon.
There is a disclosure in Japanese Patent Laid-Open No. 683, and an example is further disclosed in JP-A No. 61-23, in which the sides of the piezoelectric element are raised with glass frit and the exposed parts of the internal electrodes located in the grooves are filled every other layer with an insulating material.
This is shown in Japanese Patent No. 4579.
一方、これらとは別の方法として、圧電素子より受圧面
積の少ない金属板を圧電素子間に挟み込み、金属板が外
部引き出し用の突起を除いて圧電素子の側面に露出しな
いようにして絶縁を図るものもある(例えば実開昭60
−42791号公報参照)。On the other hand, as an alternative method, a metal plate with a smaller pressure-receiving area than the piezoelectric element is sandwiched between the piezoelectric elements, and insulation is achieved by preventing the metal plate from being exposed on the side of the piezoelectric element except for the protrusion for external extraction. There are also some (for example, 1986)
-42791)).
ところが、従来の積層型圧電素子の側面の内部電極の露
出部分を一層おきにガラス等の絶縁体でシールする方法
は、内部電極が上述のように印刷タイプであるにせよ、
金属板を挟み込むタイプであるにせよ、複雑で高精度の
絶縁行程が必要であり、生産性が悪くなってコストが上
昇するという問題がある。また、圧電素子よりも受圧面
積の小さい金属板を圧電素子間に挟む方法は、金属板の
外周部付近の圧電素子に応力が集中し、圧電素子に細か
いひび割れが生じるという問題がある。However, the conventional method of sealing the exposed parts of the internal electrodes on the side surfaces of a multilayer piezoelectric element with an insulating material such as glass every other layer does not work, even if the internal electrodes are of the printed type as described above.
Even if it is a type in which metal plates are sandwiched, a complicated and highly accurate insulation process is required, which results in poor productivity and increased costs. Furthermore, the method of sandwiching a metal plate with a smaller pressure-receiving area than the piezoelectric element between the piezoelectric elements has the problem that stress is concentrated on the piezoelectric element near the outer periphery of the metal plate, causing fine cracks in the piezoelectric element.
本発明は前記従来の積層型圧電素子における複雑で高精
度の絶縁処理行程の課題を解消し、内部電極として圧電
素子と同形状の金属板を使用し、外部電極との接続はこ
の金属板に設けられた突起を介して行うタイプの積層型
圧電体において、圧電体の側面に一層おきに露出する内
部電極の端面を容易にかつ精度を必要とすることなく絶
縁することができ、生産性を向上させてコストを下げる
ことができる積層型圧電素子の製造方法を提供すること
を目的としている。The present invention solves the problem of the complicated and high-precision insulation process in the conventional laminated piezoelectric element, uses a metal plate with the same shape as the piezoelectric element as the internal electrode, and connects the external electrode to this metal plate. In a laminated piezoelectric body of the type that uses the protrusions provided, the end faces of internal electrodes exposed every other layer on the sides of the piezoelectric body can be insulated easily and without requiring precision, increasing productivity. It is an object of the present invention to provide a method for manufacturing a laminated piezoelectric element that can improve the manufacturing process and reduce costs.
前記目的を達成する本発明の積層型圧電素子の製造方法
は、圧電材料からなる圧電板と、これと同形状でかつ外
部引き出し用の突起を備える金属電極とを、前記突起が
一層おきに反対側に突出するように複数枚積層して積層
体を作る段階と、この積層体の両側に突出する前記突起
の外側を(絶縁材料製の薄膜シートで包んで積層体の側
面全体を覆う段階と、前記シートを軟化点近くまで加熱
し、前記シートを積層体の側表面に付着させる段階と、
前記積層体の同じ側にある前記突起の外側に、それぞれ
導電性の外部電極を掛け渡し、この外部電極で各突起を
外側から挟んで外部電極と各突起とを電気的に接合する
段階とからなることを特徴としている。A method for manufacturing a laminated piezoelectric element of the present invention that achieves the above object includes a piezoelectric plate made of a piezoelectric material and a metal electrode having the same shape as the piezoelectric plate and having protrusions for external extraction, such that the protrusions are opposite to each other every other layer. a step of laminating a plurality of sheets so as to protrude to the side to form a laminate; and a step of wrapping the outside of the projections protruding on both sides of the laminate with a thin film sheet made of an insulating material to cover the entire side surface of the laminate. , heating the sheet to near its softening point to adhere the sheet to the side surface of the laminate;
a step of extending a conductive external electrode to the outside of each of the protrusions on the same side of the laminate, and sandwiching each protrusion from the outside with the external electrode to electrically connect the external electrode and each protrusion; It is characterized by becoming.
本発明の積層型圧電素子の製造方法では、まず、圧電材
料と電極板とが、電極板の突起が一層おきに反対向きに
なるように交互に積層されて圧電積層体が作られる。そ
して、この圧電積層体全体が絶縁材料製の薄膜シートで
覆われ、このシートは軟化点近くまで加熱されて積層体
の側表面に付着する。この時、電極板の突起には極小厚
の薄膜シートが付着しているか、或いは突起は薄膜シー
トを突き破って露出した状態にある。この後、同じ側に
ある前記突起が導電性の外部電極で挟まれて電気的に接
合される。In the method for manufacturing a laminated piezoelectric element of the present invention, first, a piezoelectric laminate is produced by alternately laminating piezoelectric materials and electrode plates such that the protrusions of the electrode plates are oriented in opposite directions on every other layer. The entire piezoelectric laminate is then covered with a thin sheet of insulating material, which is heated to near its softening point and adheres to the side surfaces of the laminate. At this time, a thin film sheet with a very small thickness is attached to the protrusion of the electrode plate, or the protrusion is exposed by breaking through the thin film sheet. Thereafter, the protrusions on the same side are sandwiched between conductive external electrodes and electrically connected.
以下添付図面を用いて本発明の積層型圧電素子の製造方
法の一実施例を詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for manufacturing a laminated piezoelectric element of the present invention will be described in detail below with reference to the accompanying drawings.
圧電積層体を製造する時は、チタン酸ジルコン酸鉛P
b(TixZr+−++ )Oz (X =0.4〜
0.6でモル比を示す〕を主成分とする圧電材料仮焼粉
末に、微量の有機バインダを添加し、これを有機溶媒中
に分散させたスラリーをまず準備する。そして、通常の
積層セラミックコンデンサの製造に使用されるキャステ
ィング製膜装置により、このスラリーをマイラフィルム
上に600 ミクロンの厚さに塗布して乾燥させる。続
いてこれをフィルムから剥離し、圧電材料グリーンシー
トを製造する。When manufacturing piezoelectric laminates, lead zirconate titanate P
b(TixZr+-++)Oz (X = 0.4~
First, a slurry is prepared by adding a small amount of an organic binder to a piezoelectric material calcined powder whose main component is 0.6 (molar ratio is 0.6) and dispersing this in an organic solvent. This slurry is then applied onto a Mylar film to a thickness of 600 microns using a casting film forming apparatus used in the manufacture of ordinary multilayer ceramic capacitors and dried. Subsequently, this is peeled off from the film to produce a piezoelectric material green sheet.
このグリーンシートを所定の大きさ、例えば、直径30
mmの円形に切って第1図に示すような均一寸法の圧電
板1を作る。更に、この圧電板1と同形状の内部電極2
を金属板を用いて形成する。この内部電極2には外部引
き出し用の突起2aを設けておく。そして、これら圧電
板1と内部電極2とを交互に、内部電極2の突起2aが
互い違いに反対側に突出するように所定枚数、例えば4
0枚積層し、一番上と下には圧電体からなるシム3を積
層する。積層した圧電板1および内部電極2は熱プレス
により圧着一体化し、その後に500°Cでバインダを
飛散させて第2図に示すような内部電極間距離500
ミクロンの圧電積層体4を作る。This green sheet is cut into a predetermined size, for example, 30 mm in diameter.
A piezoelectric plate 1 of uniform dimensions as shown in FIG. 1 is made by cutting into a circular shape of mm. Furthermore, an internal electrode 2 having the same shape as this piezoelectric plate 1 is provided.
is formed using a metal plate. This internal electrode 2 is provided with a protrusion 2a for external extraction. Then, these piezoelectric plates 1 and internal electrodes 2 are alternately arranged in a predetermined number, for example, 4 so that the protrusions 2a of the internal electrodes 2 alternately protrude to the opposite side.
0 sheets are laminated, and shims 3 made of piezoelectric material are laminated on the top and bottom. The laminated piezoelectric plates 1 and internal electrodes 2 are integrated by heat pressing, and then the binder is scattered at 500°C to obtain a distance of 500 between the internal electrodes as shown in Fig. 2.
A micron piezoelectric laminate 4 is made.
次に圧電積層体4を横向きに置き、内部電極2の突起2
aの一方を上向きにする。この状態で絶縁材料、例えば
合成樹脂からなる薄膜シート5を上方から近づける。薄
膜シート5は第3図に示すように、把持部材6により薄
膜シート5が圧電積層体4の突起2aに触れるまでは軽
く薄膜シート5を拘束する。その後、薄膜シート5を把
持部材6から放し、内部電極2の突起2aに過大な力を
加えることなく薄膜シート5を圧電積層体4に被せる。Next, the piezoelectric laminate 4 is placed horizontally, and the protrusion 2 of the internal electrode 2 is
Turn one side of a upward. In this state, a thin film sheet 5 made of an insulating material, for example a synthetic resin, is approached from above. As shown in FIG. 3, the thin film sheet 5 is lightly restrained by the gripping member 6 until the thin film sheet 5 touches the protrusion 2a of the piezoelectric laminate 4. Thereafter, the thin film sheet 5 is released from the gripping member 6, and the piezoelectric laminate 4 is covered with the thin film sheet 5 without applying excessive force to the projections 2a of the internal electrodes 2.
薄膜シート5の最終端は接着剤により圧電積層体4の側
面に仮止めする。The final end of the thin film sheet 5 is temporarily fixed to the side surface of the piezoelectric laminate 4 with an adhesive.
この後、圧電積層体4をひっくり返し、反対側の突起2
aを上向きにする。そして、この状態で同じ薄膜シート
5を上方から近づける。薄膜シート5は第4図に示すよ
うに、把持部材6により薄膜シート5が圧電積層体4の
突起2aに触れるまでは軽く薄膜シート5を拘束する。After this, the piezoelectric laminate 4 is turned over and the protrusion 2 on the opposite side is
Turn a upward. Then, in this state, the same thin film sheet 5 is approached from above. As shown in FIG. 4, the thin film sheet 5 is lightly restrained by the gripping member 6 until the thin film sheet 5 touches the protrusion 2a of the piezoelectric laminate 4.
その後、薄膜シート5を把持部材6から放し、内部電極
2の突起2aに過大な力を加えることなく薄膜シート5
を圧電積層体4に被せる。薄膜シート5の最終端で、先
に圧電積層体4の側面に仮止めされている薄膜シート5
に重なる部分は、高周波シーム溶接等で接着する。Thereafter, the thin film sheet 5 is released from the gripping member 6, and the thin film sheet 5 is
is placed on the piezoelectric laminate 4. At the final end of the thin film sheet 5, the thin film sheet 5 is temporarily attached to the side surface of the piezoelectric laminate 4.
The overlapping parts are bonded using high-frequency seam welding, etc.
第5図は以上のような行程で作られた圧電積層体4の断
面を示すものである。なお、第5図における圧電板1の
積層枚数は説明のため実際の積層枚数よりも遥かに少な
く描いである。薄膜シート5は内部電極2の突起2aに
より圧電積層体4の側面にテントのように張られた状態
となる。FIG. 5 shows a cross section of the piezoelectric laminate 4 produced by the process described above. It should be noted that the number of stacked piezoelectric plates 1 in FIG. 5 is much smaller than the actual number of stacked plates for illustrative purposes. The thin film sheet 5 is stretched over the side surface of the piezoelectric laminate 4 like a tent by the protrusions 2a of the internal electrodes 2.
この状態において、薄膜シート5に加わる力が殆ど0で
済むように薄膜シート5を軟化点近くまで加熱する。こ
の加熱温度は一般に百数十°C程度である。なお、この
時、圧電積層体4側を加熱しても良い。更に、高周波加
熱で金属部分、即ち、内部電極2および突起2aを集中
的に加熱すると効果が顕著に出る。In this state, the thin film sheet 5 is heated to near its softening point so that the force applied to the thin film sheet 5 is almost zero. This heating temperature is generally about 100-odd degrees Celsius. Note that at this time, the piezoelectric laminate 4 side may be heated. Furthermore, if the metal parts, that is, the internal electrodes 2 and the protrusions 2a, are heated intensively by high-frequency heating, the effect will be noticeable.
加熱によって軟化した薄膜シート5は、次第に圧電積層
体4の表面に付着する。この時、内部電極2の突起2a
によって保持されていた薄膜シート5は、軟化により延
ばされ、第6図に示すように極めて薄くなって(数ミク
ロン以下)突起2aに付着するか、或いは、第7図に示
すように部分的に敗れて突起2aが薄膜シート5の外部
に露出するようになる。The thin film sheet 5 softened by heating gradually adheres to the surface of the piezoelectric laminate 4. At this time, the protrusion 2a of the internal electrode 2
The thin film sheet 5, which was held by the The projections 2a are exposed to the outside of the thin film sheet 5.
この後、ステンレス系の材料で作られた細い板状の外部
電極7を、突起2aの外方にそれぞれ置き、この外部電
極7の突起2aの両側を強い力で押圧し、外部電極7で
突起2aを第9図に示すように挟み込む。この時、突起
2aを覆う薄い薄膜シート5は外部電極7により押し退
けられるので、外部電極7と突起2aとは接触するが、
外部電極7で突起2aを挟む時に高周波で加熱しながら
挾み込んだ突起2aの近傍の薄膜シート5を熔かしつつ
行えば、突起2aと外部電極7との接合はより確実なも
のとなる。また、外部電極7を強度の大きい材料で作り
、その内側に第8図に示すような尖った突起7aを設け
ておけば、この突起7aが突起2aに食い込むので外部
電極7と突起2a七の接合が確実なものとなる。そして
、挟み込んだ外部電極7を抵抗加熱によりスポット溶接
して外部電極7と突起2aとを電気的に接合する。After this, thin plate-shaped external electrodes 7 made of stainless steel material are placed on the outside of the protrusions 2a, and both sides of the protrusions 2a of the external electrodes 7 are pressed with strong force, and the external electrodes 7 are used to protrude the protrusions. 2a are sandwiched as shown in FIG. At this time, the thin film sheet 5 covering the protrusion 2a is pushed away by the external electrode 7, so the external electrode 7 and the protrusion 2a come into contact with each other.
When sandwiching the protrusion 2a between the external electrodes 7, if the thin film sheet 5 near the sandwiched protrusion 2a is melted while heating with high frequency, the bonding between the protrusion 2a and the external electrode 7 will be more reliable. . Furthermore, if the external electrode 7 is made of a strong material and provided with a sharp protrusion 7a as shown in FIG. The bonding becomes reliable. Then, the sandwiched external electrode 7 is spot-welded by resistance heating to electrically connect the external electrode 7 and the protrusion 2a.
第10図は以上のような積層型圧電素子の製造方法によ
り作られた圧電積層体4の全体構成を示すものである。FIG. 10 shows the overall structure of a piezoelectric laminate 4 manufactured by the method for manufacturing a laminated piezoelectric element as described above.
内部電極2の突起2aを連絡する外部電極7は、この後
、リード線8により異なった電源に接続される。この図
から分かるように、圧電積層体4はその外表面のほぼ全
域が2枚の薄膜シート5によって覆われているので、内
部電極2の突起2aの根元付近が確実に絶縁される。従
って、2個の外部電極7は反対側の極性を持つ内部電極
2の端部に接触せず、短絡の恐れは全くない。The external electrode 7, which connects the protrusion 2a of the internal electrode 2, is then connected to a different power source via a lead wire 8. As can be seen from this figure, since almost the entire outer surface of the piezoelectric laminate 4 is covered with the two thin film sheets 5, the vicinity of the base of the protrusion 2a of the internal electrode 2 is reliably insulated. Therefore, the two external electrodes 7 do not come into contact with the ends of the internal electrodes 2 having opposite polarities, and there is no risk of short circuit.
[発明の効果]
以上説明したように、本発明の積層型圧電素子の製造方
法によれば、内部電極として圧電素子と同形状の金属板
を使用し、外部電極との接続はこの金属板に設けられた
突起を介して行うタイプの積層型圧電体において、圧電
体の側面に一層おきに露出する内部電極の端面を容易に
かつ精度を必要とすることなく絶縁することができ、生
産性を向上させてコストを下げることができるいう効果
がある。[Effects of the Invention] As explained above, according to the method of manufacturing a laminated piezoelectric element of the present invention, a metal plate having the same shape as the piezoelectric element is used as the internal electrode, and the connection with the external electrode is made by using this metal plate. In a laminated piezoelectric body of the type that uses the protrusions provided, the end faces of internal electrodes exposed every other layer on the sides of the piezoelectric body can be insulated easily and without requiring precision, increasing productivity. This has the effect of improving performance and reducing costs.
第1図から第9図は本発明の積層型圧電素子の製造方法
の工程を示す図であり、第1図は圧電積層体の製造工程
図、第2図〜第4図は圧電積層体を薄膜シートを覆う工
程図、第5図は薄膜シートで覆われた圧電積層体の断面
図、第6・図及び第7図は第5図の状態から加熱した時
の薄膜シートの様子を示す部分断面図、第8図及び第9
図は第6図または第7図の状態の突起に外部電極を取り
付ける工程を示す図、第10図は本発明の製造方法によ
り製造された積層型圧電素子の全体構成を示す側面図、
第11図は従来の内部電極の絶縁方法を示す斜視図であ
る。
1・・・圧電板、2・・・内部電極、2a・・・突起、
3・・・シム、4・・・圧電積層体、5・・・薄膜シー
ト、7・・・外部電極、8・・・リード線。1 to 9 are diagrams showing the steps of the method for manufacturing a laminated piezoelectric element of the present invention. FIG. 1 is a manufacturing process diagram of a piezoelectric laminate, and FIGS. Figure 5 is a cross-sectional view of the piezoelectric laminate covered with the thin film sheet, and Figures 6, 7, and 7 are the parts showing the state of the thin film sheet when heated from the state shown in Figure 5. Cross-sectional view, Figures 8 and 9
10 is a side view showing the overall structure of a laminated piezoelectric element manufactured by the manufacturing method of the present invention,
FIG. 11 is a perspective view showing a conventional method of insulating internal electrodes. DESCRIPTION OF SYMBOLS 1... Piezoelectric plate, 2... Internal electrode, 2a... Protrusion,
3...Shim, 4...Piezoelectric laminate, 5...Thin film sheet, 7...External electrode, 8...Lead wire.
Claims (1)
き出し用の突起を備える金属電極とを、前記突起が一層
おきに反対側に突出するように複数枚積層して積層体を
作る段階と、 この積層体の両側に突出する前記突起の外側を、絶縁材
料製の薄膜シートで包んで積層体の側面全体を覆う段階
と、 前記シートを軟化点近くまで加熱し、前記シートを積層
体の側表面に付着させる段階と、 前記積層体の同じ側にある前記突起の外側に、それぞれ
導電性の外部電極を掛け渡し、この外部電極で各突起を
外側から挟んで外部電極と各突起とを電気的に接合する
段階と、 により積層型圧電素子を製造することを特徴とする積層
型圧電素子の製造方法。[Claims] A plurality of piezoelectric plates made of a piezoelectric material and metal electrodes having the same shape and having protrusions for external extraction are stacked so that the protrusions protrude every other layer to the opposite side. forming a laminate; wrapping the outside of the projections protruding on both sides of the laminate with a thin film sheet made of an insulating material to cover the entire side surface of the laminate; heating the sheet to near its softening point; The step of attaching the sheet to the side surface of the laminate, and extending conductive external electrodes to the outside of the protrusions on the same side of the laminate, sandwiching each protrusion from the outside with the external electrodes to connect the protrusions to the outside. 1. A method for manufacturing a laminated piezoelectric element, comprising the steps of electrically bonding an electrode and each protrusion; and manufacturing a laminated piezoelectric element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1293859A JPH03155176A (en) | 1989-11-14 | 1989-11-14 | Manufacture of laminated piezoelectric element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1293859A JPH03155176A (en) | 1989-11-14 | 1989-11-14 | Manufacture of laminated piezoelectric element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03155176A true JPH03155176A (en) | 1991-07-03 |
Family
ID=17800081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1293859A Pending JPH03155176A (en) | 1989-11-14 | 1989-11-14 | Manufacture of laminated piezoelectric element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03155176A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6700306B2 (en) * | 2001-02-27 | 2004-03-02 | Kyocera Corporation | Laminated piezo-electric device |
US7765660B2 (en) | 2005-11-28 | 2010-08-03 | Fujifilm Corporation | Method of manufacturing a multilayered piezoelectric element having internal electrodes and side electrodes |
CN103814452A (en) * | 2011-07-18 | 2014-05-21 | 雷诺股份公司 | Method of assembling an ultrasonic transducer and the transducer obtained thereby |
-
1989
- 1989-11-14 JP JP1293859A patent/JPH03155176A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6700306B2 (en) * | 2001-02-27 | 2004-03-02 | Kyocera Corporation | Laminated piezo-electric device |
US7765660B2 (en) | 2005-11-28 | 2010-08-03 | Fujifilm Corporation | Method of manufacturing a multilayered piezoelectric element having internal electrodes and side electrodes |
CN103814452A (en) * | 2011-07-18 | 2014-05-21 | 雷诺股份公司 | Method of assembling an ultrasonic transducer and the transducer obtained thereby |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5914556A (en) | Piezoelectric element and method of manufacturing the same | |
GB2044030A (en) | Surface acoustic wave device and method of manufactguring same | |
JPH03155176A (en) | Manufacture of laminated piezoelectric element | |
JPS63153870A (en) | Electrostrictive effect element | |
JPH05218519A (en) | Electrostrictive effect element | |
JPH0740613B2 (en) | Method for manufacturing laminated piezoelectric material | |
JP2824116B2 (en) | Multilayer piezoelectric actuator | |
JP2001210886A (en) | Stacked type piezoelectric actuator | |
JPH034576A (en) | Laminated type piezoelectric element | |
JPS62211974A (en) | Laminated piezoelectric element and manufacture thereof | |
JPS59110217A (en) | Piezoelectric oscillating parts in chip shape and its manufacture | |
JP3994758B2 (en) | Manufacturing method of chip-type electronic component | |
JP2508314B2 (en) | Method for manufacturing laminated piezoelectric element | |
JP2707782B2 (en) | Multilayer piezoelectric element | |
JPH1174576A (en) | Laminated piezoelectric actuator | |
JPH0366822B2 (en) | ||
JPH02305402A (en) | Resistor and manufacture thereof | |
JPH01112805A (en) | Manufacture of piezoelectric component | |
JP3979121B2 (en) | Manufacturing method of electronic parts | |
JPH0832131A (en) | Laminated piezolectric element and its manufacture | |
JPH0496285A (en) | Laminated piezoelectric element | |
JPH0496286A (en) | Manufacture of laminated piezoelectric element | |
JP2570665B2 (en) | Piezoelectric vibrator | |
JP3377922B2 (en) | Multilayer piezoelectric actuator | |
JPH04333294A (en) | Laminated type piezoelectric actuator element |