JPS6059704A - Ｐｔｃ素子放熱構造 - Google Patents
Ｐｔｃ素子放熱構造Info
- Publication number
- JPS6059704A JPS6059704A JP16886483A JP16886483A JPS6059704A JP S6059704 A JPS6059704 A JP S6059704A JP 16886483 A JP16886483 A JP 16886483A JP 16886483 A JP16886483 A JP 16886483A JP S6059704 A JPS6059704 A JP S6059704A
- Authority
- JP
- Japan
- Prior art keywords
- ptc element
- heat dissipation
- ptc
- heat sink
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 229920002379 silicone rubber Polymers 0.000 claims description 9
- 239000004945 silicone rubber Substances 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 7
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 238000007259 addition reaction Methods 0.000 claims 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- -1 color rejuvenators Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000006258 conductive agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 241000282693 Cercopithecidae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 210000003041 ligament Anatomy 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 229910001954 samarium oxide Inorganic materials 0.000 description 1
- 229940075630 samarium oxide Drugs 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16886483A JPS6059704A (ja) | 1983-09-13 | 1983-09-13 | Ｐｔｃ素子放熱構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16886483A JPS6059704A (ja) | 1983-09-13 | 1983-09-13 | Ｐｔｃ素子放熱構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6059704A true JPS6059704A (ja) | 1985-04-06 |
| JPH0227801B2 JPH0227801B2 (enrdf_load_stackoverflow) | 1990-06-20 |
Family
ID=15875970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16886483A Granted JPS6059704A (ja) | 1983-09-13 | 1983-09-13 | Ｐｔｃ素子放熱構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059704A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6221972A (ja) * | 1985-07-23 | 1987-01-30 | 日本テキサス・インスツルメンツ株式会社 | キ−ホ−ルヒ−タ− |
| JP2008270551A (ja) * | 2007-04-20 | 2008-11-06 | Nichicon Corp | 正特性サーミスタ装置およびその製造方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS476832U (enrdf_load_stackoverflow) * | 1971-02-17 | 1972-09-25 | ||
| JPS50124953A (enrdf_load_stackoverflow) * | 1974-03-19 | 1975-10-01 | ||
| JPS528040U (enrdf_load_stackoverflow) * | 1975-07-04 | 1977-01-20 | ||
| JPS5222965A (en) * | 1975-08-14 | 1977-02-21 | Matsushita Electric Ind Co Ltd | Frequency voltage converting device |
| JPS5333256A (en) * | 1976-09-08 | 1978-03-29 | Toshiba Silicone | Composition of polyorganosiloxane curable like rubber |
| JPS5350818U (enrdf_load_stackoverflow) * | 1976-10-04 | 1978-04-28 | ||
| JPS562349A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Silicone Co Ltd | Molded rubber article for heat dissipation |
| JPS56155501A (en) * | 1980-04-30 | 1981-12-01 | Nippon Denso Co | Resistor |
-
1983
- 1983-09-13 JP JP16886483A patent/JPS6059704A/ja active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS476832U (enrdf_load_stackoverflow) * | 1971-02-17 | 1972-09-25 | ||
| JPS50124953A (enrdf_load_stackoverflow) * | 1974-03-19 | 1975-10-01 | ||
| JPS528040U (enrdf_load_stackoverflow) * | 1975-07-04 | 1977-01-20 | ||
| JPS5222965A (en) * | 1975-08-14 | 1977-02-21 | Matsushita Electric Ind Co Ltd | Frequency voltage converting device |
| JPS5333256A (en) * | 1976-09-08 | 1978-03-29 | Toshiba Silicone | Composition of polyorganosiloxane curable like rubber |
| JPS5350818U (enrdf_load_stackoverflow) * | 1976-10-04 | 1978-04-28 | ||
| JPS562349A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Silicone Co Ltd | Molded rubber article for heat dissipation |
| JPS56155501A (en) * | 1980-04-30 | 1981-12-01 | Nippon Denso Co | Resistor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6221972A (ja) * | 1985-07-23 | 1987-01-30 | 日本テキサス・インスツルメンツ株式会社 | キ−ホ−ルヒ−タ− |
| JP2008270551A (ja) * | 2007-04-20 | 2008-11-06 | Nichicon Corp | 正特性サーミスタ装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0227801B2 (enrdf_load_stackoverflow) | 1990-06-20 |
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