JPS6045031A - 自動ウェ−ハ移換機 - Google Patents

自動ウェ−ハ移換機

Info

Publication number
JPS6045031A
JPS6045031A JP58153560A JP15356083A JPS6045031A JP S6045031 A JPS6045031 A JP S6045031A JP 58153560 A JP58153560 A JP 58153560A JP 15356083 A JP15356083 A JP 15356083A JP S6045031 A JPS6045031 A JP S6045031A
Authority
JP
Japan
Prior art keywords
pusher
hole
wafer
wafers
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58153560A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455335B2 (enExample
Inventor
Yasuo Yatabe
谷田部　保夫
Mitsuru Tachikawa
刀川　充
Yuichi Teshigawara
勅使河原　雄一
Koichi Otsubo
大坪　弘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOMUKO KK
Original Assignee
TOMUKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOMUKO KK filed Critical TOMUKO KK
Priority to JP58153560A priority Critical patent/JPS6045031A/ja
Publication of JPS6045031A publication Critical patent/JPS6045031A/ja
Publication of JPH0455335B2 publication Critical patent/JPH0455335B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Attitude Control For Articles On Conveyors (AREA)
JP58153560A 1983-08-22 1983-08-22 自動ウェ−ハ移換機 Granted JPS6045031A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58153560A JPS6045031A (ja) 1983-08-22 1983-08-22 自動ウェ−ハ移換機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58153560A JPS6045031A (ja) 1983-08-22 1983-08-22 自動ウェ−ハ移換機

Publications (2)

Publication Number Publication Date
JPS6045031A true JPS6045031A (ja) 1985-03-11
JPH0455335B2 JPH0455335B2 (enExample) 1992-09-03

Family

ID=15565161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58153560A Granted JPS6045031A (ja) 1983-08-22 1983-08-22 自動ウェ−ハ移換機

Country Status (1)

Country Link
JP (1) JPS6045031A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133443U (ja) * 1984-07-28 1986-02-28 ソニー株式会社 ウエハ−移載装置
JPH01319968A (ja) * 1988-06-21 1989-12-26 Matsushita Electric Ind Co Ltd 基板保持装置
JPH02103949A (ja) * 1988-10-13 1990-04-17 Seiko Epson Corp 半導体基板移載装置
JPH05291379A (ja) * 1992-04-10 1993-11-05 Kaijo Corp 半導体基板用搬送装置及び半導体基板処理器並びに自動処理装置
WO1999013497A1 (de) * 1997-09-10 1999-03-18 Tec-Sem Ag Transfervorrichtung für halbleiterscheiben
CH695472A5 (de) * 1997-09-10 2006-05-31 Tec Sem Ag Wafer-Transfervorrichtung und Wafer Transferverfahren.
CN108069229A (zh) * 2017-11-05 2018-05-25 安徽康乐机械科技有限公司 装瓶室输送机
CN117832158A (zh) * 2024-03-06 2024-04-05 无锡琨圣智能装备股份有限公司 一种晶圆插片装置及晶圆清洗装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54127960A (en) * 1978-03-29 1979-10-04 Toray Silicone Co Ltd Organopolysiloxane composition
JPS5527239U (enExample) * 1978-08-07 1980-02-21
JPS57126128A (en) * 1981-01-27 1982-08-05 Toshiba Corp Moving method for wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54127960A (en) * 1978-03-29 1979-10-04 Toray Silicone Co Ltd Organopolysiloxane composition
JPS5527239U (enExample) * 1978-08-07 1980-02-21
JPS57126128A (en) * 1981-01-27 1982-08-05 Toshiba Corp Moving method for wafer

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133443U (ja) * 1984-07-28 1986-02-28 ソニー株式会社 ウエハ−移載装置
JPH01319968A (ja) * 1988-06-21 1989-12-26 Matsushita Electric Ind Co Ltd 基板保持装置
JPH02103949A (ja) * 1988-10-13 1990-04-17 Seiko Epson Corp 半導体基板移載装置
JPH05291379A (ja) * 1992-04-10 1993-11-05 Kaijo Corp 半導体基板用搬送装置及び半導体基板処理器並びに自動処理装置
WO1999013497A1 (de) * 1997-09-10 1999-03-18 Tec-Sem Ag Transfervorrichtung für halbleiterscheiben
US6431811B1 (en) 1997-09-10 2002-08-13 Brooks Automation Ag Transfer device for semiconductor wafers
CH695472A5 (de) * 1997-09-10 2006-05-31 Tec Sem Ag Wafer-Transfervorrichtung und Wafer Transferverfahren.
CN108069229A (zh) * 2017-11-05 2018-05-25 安徽康乐机械科技有限公司 装瓶室输送机
CN117832158A (zh) * 2024-03-06 2024-04-05 无锡琨圣智能装备股份有限公司 一种晶圆插片装置及晶圆清洗装置

Also Published As

Publication number Publication date
JPH0455335B2 (enExample) 1992-09-03

Similar Documents

Publication Publication Date Title
JPS6045031A (ja) 自動ウェ−ハ移換機
Pastewka et al. Bond order potentials for fracture, wear, and plasticity
DE3687221D1 (de) Verfahren zum biegen von strangfoermigem material sowie biegemaschine zur durchfuehrung dieses verfahrens.
CN105382830B (zh) 纱锭码垛机器人
CH558514A (de) Vorrichtung zum durchfuehren eines rohrbuendels durch eine behaelterwand.
CN102493717A (zh) 一种转盘密码锁芯以及解锁方法
CN205077063U (zh) 一种细胞培养机械手
ATE335570T1 (de) Bearbeitungsmaschine zum mehrachsigen bewegen eines werkzeuges oder werkstückes
Seema et al. Peeling by nanomechanical forces: a route to selective creation of surface structures
GB878902A (en) Improvements in or relating to control apparatus
DE50102874D1 (de) Einrichtung zum schutz von körperteilen vor eindringenden gegenständen sowie schutzoberbekleidung unter verwendung einer solchen schutzeinrichtung
CN205571464U (zh) 一种高精度多工位钻孔装置
GB1329646A (en) Machine tool with tool exchangiang mechanism
Pannier et al. Molecular dynamics study of Frenkel pair recombinations in fluorite type compounds
DE45974C (de) Schreibunterlage
DE2411059A1 (de) Anordnung mehrerer werkstuecktraeger fuer rotierende bearbeitung an werkzeugmaschinen, insbesondere drehmaschinen
Zhu et al. Erratum: The real‐time intramolecular electronic excitation transfer dynamics of 9′, 9‐bifluorene and 2′, 2‐binaphthyl in solution [J. Chem. Phys. 98, 1042 (1993)]
CN204507511U (zh) 具有晶圆移位限止结构的晶圆承盘
CN206286868U (zh) 数控机床夹紧装置
BR102018008053B1 (pt) Máquina-ferramenta
Heimann Technological progress and market penetration of advanced ceramics in Canada
CN103909521B (zh) 利用托盘对角线辨识码垛机器人关节初始参数的方法
Ruzhentsev et al. Conclusion: Tectonic Development and Geodynamics of Central Asia
Shah et al. Extended Pattern Recognition Scheme for Self-learning Kinetic Monte Carlo (SLKMC-II) Simulations
CN206075694U (zh) 一种自动化打磨抛光教学工作站