JPS57126128A - Moving method for wafer - Google Patents

Moving method for wafer

Info

Publication number
JPS57126128A
JPS57126128A JP1058181A JP1058181A JPS57126128A JP S57126128 A JPS57126128 A JP S57126128A JP 1058181 A JP1058181 A JP 1058181A JP 1058181 A JP1058181 A JP 1058181A JP S57126128 A JPS57126128 A JP S57126128A
Authority
JP
Japan
Prior art keywords
section
wafers
grooves
guide
pusher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1058181A
Other languages
Japanese (ja)
Other versions
JPS6216019B2 (en
Inventor
Kiyoshi Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1058181A priority Critical patent/JPS57126128A/en
Publication of JPS57126128A publication Critical patent/JPS57126128A/en
Publication of JPS6216019B2 publication Critical patent/JPS6216019B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Abstract

PURPOSE:To shift the wafers with ease and automatically while arranging the directions by disposing a movable and rotatable orientation flat alignment section between supporting bars to which grooves are formed symmetrically and interlocking the orientation flat aligment section with a guide section and a pusher section. CONSTITUTION:A frame-shaped boat 46 is placed on the upper section of a fixed stand 5, a carrier housing a plurality of the wafers 48 is mounted to a holder 18, and a stage 6 is moved and positioned. The holder 18 is turned and made parallel with a guide supporting bar 19, the orientation flat alignment section 34 is elevated while pusher grooves sections 45 are inserted among guide grooves 20, the guide section and the holder are rotated simultaneously, and the wafers 48 are dropped into the pusher grooves 45. The grooves 45 are pulled out and the wafers 48 are positioned onto the conforming section 34, a shaft 35 is turned and an orientation flat alignment section 47 is arranged onto the positioning section 34, the positioning section 34 is dropped, and the wafers 48 are housed in a holding groove of the boat 46. When the wafers are shifted to the carrier from the upper section of the boat, on the contrary, the guide grooves 20 are made horizontal, and the wafers 48 are elevated by the positioning section 34, pushed into the carrier by the pusher grooves 45 and housed.
JP1058181A 1981-01-27 1981-01-27 Moving method for wafer Granted JPS57126128A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1058181A JPS57126128A (en) 1981-01-27 1981-01-27 Moving method for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1058181A JPS57126128A (en) 1981-01-27 1981-01-27 Moving method for wafer

Publications (2)

Publication Number Publication Date
JPS57126128A true JPS57126128A (en) 1982-08-05
JPS6216019B2 JPS6216019B2 (en) 1987-04-10

Family

ID=11754204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1058181A Granted JPS57126128A (en) 1981-01-27 1981-01-27 Moving method for wafer

Country Status (1)

Country Link
JP (1) JPS57126128A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045031A (en) * 1983-08-22 1985-03-11 Tomuko:Kk Automatic wafer transfer machine
JPH05291379A (en) * 1992-04-10 1993-11-05 Kaijo Corp Transport and processing apparatus and automatic processing equipment for semiconductor substrate
US10273864B2 (en) 2015-03-26 2019-04-30 Honda Motor Co., Ltd. Engine-driven generator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045031A (en) * 1983-08-22 1985-03-11 Tomuko:Kk Automatic wafer transfer machine
JPH0455335B2 (en) * 1983-08-22 1992-09-03 Tomuko Kk
JPH05291379A (en) * 1992-04-10 1993-11-05 Kaijo Corp Transport and processing apparatus and automatic processing equipment for semiconductor substrate
US10273864B2 (en) 2015-03-26 2019-04-30 Honda Motor Co., Ltd. Engine-driven generator

Also Published As

Publication number Publication date
JPS6216019B2 (en) 1987-04-10

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