JPS6455837A - Semiconductor wafer transferring apparatus - Google Patents
Semiconductor wafer transferring apparatusInfo
- Publication number
- JPS6455837A JPS6455837A JP62211465A JP21146587A JPS6455837A JP S6455837 A JPS6455837 A JP S6455837A JP 62211465 A JP62211465 A JP 62211465A JP 21146587 A JP21146587 A JP 21146587A JP S6455837 A JPS6455837 A JP S6455837A
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- wafer
- boat
- scraper
- contained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To simultaneously transfer a plurality of semiconductor wafers by providing a plurality of cassette supporting units each attached to a base movably in a direction perpendicular to a direction for connecting a scraper to a boat supporting unit and providing a cassette for containing a plurality of semiconductor wafers at the top. CONSTITUTION:A pair of cassette supporting units 13A, 13B movable in a direction (Y axis) perpendicularly crossing the direction (X axis) of a boat supporting unit 12 and provided on a base 11 are provided. When a wafer W is transferred from a cassette 2 to a boat 1a, a scraper 23 is inserted from the back side of the cassette 2 substantially to the intermediate position of the wafer W laminated and contained therein, the wafer W is scraped, and advanced to a predetermined position of the boat 1a, placed in its holding groove, contained, and the scraper 23 is then moved backward. Further, when the wafer W is transferred from the boat 15 to the cassette 2, the scraper 23 is inserted to the intermediate position of the wafer W laminated from the back side of the cassette 2 to the boat 1a and contained therein, the wafer W is scraped, then moved backward to a predetermined position of the cassette 2, placed and contained in the holding groove, and the scraper is further moved backward.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62211465A JPS6455837A (en) | 1987-08-27 | 1987-08-27 | Semiconductor wafer transferring apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62211465A JPS6455837A (en) | 1987-08-27 | 1987-08-27 | Semiconductor wafer transferring apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6455837A true JPS6455837A (en) | 1989-03-02 |
Family
ID=16606387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62211465A Pending JPS6455837A (en) | 1987-08-27 | 1987-08-27 | Semiconductor wafer transferring apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6455837A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5382128A (en) * | 1993-03-03 | 1995-01-17 | Takahashi; Kiyoshi | Wafer transfer device |
-
1987
- 1987-08-27 JP JP62211465A patent/JPS6455837A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5382128A (en) * | 1993-03-03 | 1995-01-17 | Takahashi; Kiyoshi | Wafer transfer device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL75207A (en) | Apparatus for transferring semiconductor wafers | |
GB2190345B (en) | Method and apparatus for transferring wafers between cassettes and a boat | |
EP0216054A3 (en) | Apparatus for polishing semiconductor wafers | |
EP0290218A3 (en) | Apparatus for retaining wafers | |
GB2121603B (en) | Apparatus and method for gas-assisted solid-to-solid thermal transfer with a semiconductor wafer | |
EP0278460A3 (en) | Wafer flip apparatus | |
EP0313466A3 (en) | Wafer positioning apparatus | |
GB2180097B (en) | Wafer handling apparatus | |
DE3379297D1 (en) | Substrate for semiconductor apparatus | |
GB2099951B (en) | Apparatus for cleaning semiconductor wafers | |
GB2099270B (en) | Apparatus for baking resist on semiconductor wafers | |
DE69227963D1 (en) | Wafer basket for containing semiconductor wafers | |
GB8715456D0 (en) | Wafer handling apparatus | |
DE3889473D1 (en) | Device for handling a wafer. | |
SG48868A1 (en) | Connection structure between components for semiconductor apparatus | |
DE3366974D1 (en) | Apparatus for introducing silicon wafers in magazines into a furnace | |
KR960011933B1 (en) | Planarized process for forming vias in silicon wafers | |
IL85329A (en) | Apparatus for handling semiconductor wafers | |
GB2201162B (en) | Electrode boat apparatus for processing semiconductor wafers or the like | |
EP0436731A4 (en) | Film for wafer processing | |
DK161610C (en) | PROCEDURE FOR KEEPING A SUBSTRATE IN PLACE IN A PHOTOLITOGRAPHIC TREATMENT HOLDER | |
GB8803604D0 (en) | Apparatus for processing semiconductor wafers &c | |
JPS6455837A (en) | Semiconductor wafer transferring apparatus | |
JPH0461146A (en) | Shifter for semiconductor wafer | |
HK164695A (en) | A semiconductor substrate having a superconducting thin film |