JPS6455837A - Semiconductor wafer transferring apparatus - Google Patents

Semiconductor wafer transferring apparatus

Info

Publication number
JPS6455837A
JPS6455837A JP62211465A JP21146587A JPS6455837A JP S6455837 A JPS6455837 A JP S6455837A JP 62211465 A JP62211465 A JP 62211465A JP 21146587 A JP21146587 A JP 21146587A JP S6455837 A JPS6455837 A JP S6455837A
Authority
JP
Japan
Prior art keywords
cassette
wafer
boat
scraper
contained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62211465A
Other languages
Japanese (ja)
Inventor
Yoshio Kameda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62211465A priority Critical patent/JPS6455837A/en
Publication of JPS6455837A publication Critical patent/JPS6455837A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To simultaneously transfer a plurality of semiconductor wafers by providing a plurality of cassette supporting units each attached to a base movably in a direction perpendicular to a direction for connecting a scraper to a boat supporting unit and providing a cassette for containing a plurality of semiconductor wafers at the top. CONSTITUTION:A pair of cassette supporting units 13A, 13B movable in a direction (Y axis) perpendicularly crossing the direction (X axis) of a boat supporting unit 12 and provided on a base 11 are provided. When a wafer W is transferred from a cassette 2 to a boat 1a, a scraper 23 is inserted from the back side of the cassette 2 substantially to the intermediate position of the wafer W laminated and contained therein, the wafer W is scraped, and advanced to a predetermined position of the boat 1a, placed in its holding groove, contained, and the scraper 23 is then moved backward. Further, when the wafer W is transferred from the boat 15 to the cassette 2, the scraper 23 is inserted to the intermediate position of the wafer W laminated from the back side of the cassette 2 to the boat 1a and contained therein, the wafer W is scraped, then moved backward to a predetermined position of the cassette 2, placed and contained in the holding groove, and the scraper is further moved backward.
JP62211465A 1987-08-27 1987-08-27 Semiconductor wafer transferring apparatus Pending JPS6455837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62211465A JPS6455837A (en) 1987-08-27 1987-08-27 Semiconductor wafer transferring apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62211465A JPS6455837A (en) 1987-08-27 1987-08-27 Semiconductor wafer transferring apparatus

Publications (1)

Publication Number Publication Date
JPS6455837A true JPS6455837A (en) 1989-03-02

Family

ID=16606387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62211465A Pending JPS6455837A (en) 1987-08-27 1987-08-27 Semiconductor wafer transferring apparatus

Country Status (1)

Country Link
JP (1) JPS6455837A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5382128A (en) * 1993-03-03 1995-01-17 Takahashi; Kiyoshi Wafer transfer device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5382128A (en) * 1993-03-03 1995-01-17 Takahashi; Kiyoshi Wafer transfer device

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