JPS6043836A - Resin sealing and forming device - Google Patents
Resin sealing and forming deviceInfo
- Publication number
- JPS6043836A JPS6043836A JP15194383A JP15194383A JPS6043836A JP S6043836 A JPS6043836 A JP S6043836A JP 15194383 A JP15194383 A JP 15194383A JP 15194383 A JP15194383 A JP 15194383A JP S6043836 A JPS6043836 A JP S6043836A
- Authority
- JP
- Japan
- Prior art keywords
- runner
- resin
- block
- resin sealing
- main runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 29
- 229920005989 resin Polymers 0.000 title claims abstract description 29
- 238000007789 sealing Methods 0.000 title claims description 7
- 238000000465 moulding Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は半導体装置の樹脂封止成形装置の改良に関す
るものであるＱ
〔従来技術〕
第１図は従来装置の構成例を示す斜視図で、（１）は上
型で樹脂を投入射出するためのチャン７＜ −（２）。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an improvement of a resin encapsulation molding device for semiconductor devices. [Prior Art] Fig. 1 is a perspective view showing an example of the configuration of a conventional device. (1) is a channel 7<-(2) for charging and injecting resin with the upper mold.
上側チェイスブロック（３）およびチャンノ（−ブロッ
ク（４）を備えている。（５）は下型で、ポット（６）
およびメインランナー（７）を有するランナーブロック
（８）と、サブランナー（９）、ゲート叫およびキャピ
テイ０心を有する下側チェイスブロック０カとを備えて
いる。It is equipped with an upper chase block (3) and a Channo (- block (4). (5) is the lower mold, and a pot (6)
and a runner block (8) having a main runner (7), and a lower chase block (0) having a sub-runner (9), a gate call, and a capacity (0).
この状態で、上型（１）と下型（５）との間に半導体装
置を装填しく図示省略）、上型（１）と下型（５）とを
型締めした後に、チャンバー（２）から封止用樹脂を投
入し成形するわけである。すなわち、チャン／クー（２
）から投入された樹脂はプランジャ（図示省略）によっ
て高圧で押し出され、ボッ） （６） 、メインランナ
ー（７）、各サブランナー（９）、およびゲート（１１
を経由して、各キャビティ（ロ）に充填され所定の成形
が完了する訳である。In this state, a semiconductor device is loaded between the upper mold (1) and the lower mold (5) (not shown), and after the upper mold (1) and the lower mold (5) are clamped, the chamber (2) is Then, the sealing resin is added and molded. That is, Chan/Ku (2
) is pushed out under high pressure by a plunger (not shown), and the resin is pushed out from the bottom (6), the main runner (7), each sub-runner (9), and the gate (11).
The resin is filled into each cavity (b) and the prescribed molding is completed.
ところで、この種の樹脂成形では樹脂を昇温し樹脂の粘
度が低下した状態で注入し、成形する方法がとられてい
るが、上記従来の装置では、チャンバー （２）から注
入された樹脂の流れのうちでランナー壁に近くを流れる
樹脂と流れの中心部を流れる樹脂との間に温反差を生じ
、これが原因で、成形品にボイドや、ブリスターなどの
成形不良が多発するという欠点がおった０
〔発明の概要〕
この発明は以上のような点に鑑みてなされたもので、メ
インランナーの一部に絞り部を設け、樹脂全体が一様に
ランナー壁に触れるよりにすることによって、樹脂温度
を一様にし、ボイドやブリスターなどの発生のない成形
装置を提供するものである。By the way, in this type of resin molding, a method is used in which the temperature of the resin is raised and the viscosity of the resin is lowered before it is injected and molded. However, in the conventional equipment described above, the resin injected from the chamber (2) There is a temperature difference between the resin flowing close to the runner wall and the resin flowing in the center of the flow, which has the disadvantage of frequently causing molding defects such as voids and blisters in the molded product. [Summary of the Invention] This invention was made in view of the above points, and by providing a constriction part in a part of the main runner so that the entire resin uniformly touches the runner wall, The purpose is to provide a molding device that makes the resin temperature uniform and does not generate voids or blisters.
第２図はこの発明の一実施例の下型の平面図、第３図は
この実施例の要部のみを示す平面図、第４図は第３図の
Ｗ−ＩＶ線での断面図、第５図は第３図のＶ−Ｖ線での
断面図、第６図はこの要部の斜視図である。（２）はラ
ンナーブロック（８）にねじａ４で取シつけられた絞ジ
ブロックで、メインランナー（力の一部を絞っている。FIG. 2 is a plan view of a lower mold according to an embodiment of the present invention, FIG. 3 is a plan view showing only the essential parts of this embodiment, and FIG. 4 is a sectional view taken along line W-IV in FIG. 3. FIG. 5 is a sectional view taken along the line V-V in FIG. 3, and FIG. 6 is a perspective view of the main part. (2) is a throttle block attached to the runner block (8) with screw A4, which throttles part of the force of the main runner.
このようにメインランナー（７）の一部を絞ることによ
って、樹脂のランナー壁への接触は均一となシ、樹脂の
温度は一様にすることができ、均一な溶融状態でキャビ
ティ（ロ）に注入されるので、ボイドやブリスターなど
のない成型製品が得られる。By squeezing a part of the main runner (7) in this way, the contact of the resin with the runner wall is uniform, the temperature of the resin can be made uniform, and the cavity (7) is heated in a uniform molten state. Since it is injected into the mold, molded products without voids or blisters can be obtained.
上記例ではメインランナー（７）の一部に絞りプロ１１
劃 −−゛ ツク
（２）を取シつけて絞シを形成したが、第７図に平面図
で示す他の実施例のように、メインランナー（７）自体
の一部に幅のせまい絞シ部αＱを設けてもよい。In the above example, a part of the main runner (7) is squeezed into Pro 11.
劃 --゛ Although the tsuk (2) was attached to form a diaphragm, a narrow diaphragm was formed on a part of the main runner (7) itself, as in another embodiment shown in the plan view in FIG. A portion αQ may also be provided.
以上説明したように、この発明になる成形装置では溶融
樹脂を流し込む通路を構成するメインランナーに絞り部
を設け、樹脂全体が一様にランナー壁に触れるようにし
たので、樹脂温度゛は一様となり、成型製品にボイドや
ブリスターのような欠陥の発生を防止でき−る。As explained above, in the molding apparatus according to the present invention, a constriction part is provided in the main runner constituting the passage through which the molten resin is poured, so that the entire resin uniformly touches the runner wall, so that the resin temperature is uniform. Therefore, defects such as voids and blisters can be prevented from occurring in the molded product.
第１図は従来の成形装置の構成例を示す斜視図、第２図
はこの発明の一実施例の下型の平面図、第３図はその要
部のみを示す平面図、第４図および第５図はそれぞれ第
３図の■−ＩＶ線およびＶ−ｖ線での断面図、第６図は
この要部の斜視図、第７図はこの発明の他の実施例の要
部平面図である。
図において、（１）は上型、（２）はチャンバー、（３
）は上側チェイスプ日ツク、（４）はチャンバーブロッ
ク、（５）は下型、（６）はポット、（７）はメインラ
ンナー、（８）はランナーブロック、（９）はサブラン
ナー、ａＱはゲート、α◇はキャビティ、（６）は下側
チェイスブロック、０）は絞ジブロック、（１０はメイ
ンランナー狭窄部である。
なお、図中同一符号は同一または相当部分を示す０
代理人 大岩増雄
第１図
１
第２図
第３図
第４図 第５図
第６図
第７図
／ＳFig. 1 is a perspective view showing an example of the configuration of a conventional molding device, Fig. 2 is a plan view of a lower mold according to an embodiment of the present invention, Fig. 3 is a plan view showing only the main parts thereof, Figs. 5 is a sectional view taken along the line ■-IV and line V-v in FIG. 3, FIG. 6 is a perspective view of the main part, and FIG. 7 is a plan view of the main part of another embodiment of the present invention. It is. In the figure, (1) is the upper mold, (2) is the chamber, and (3) is the upper mold.
) is the upper chase block, (4) is the chamber block, (5) is the lower mold, (6) is the pot, (7) is the main runner, (8) is the runner block, (9) is the sub-runner, and aQ is gate, α◇ is the cavity, (6) is the lower chase block, 0) is the aperture block, (10 is the main runner narrowing part. In addition, the same reference numerals in the figure indicate the same or equivalent parts. 0 Agent: Oiwa Masuo Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7/S
Claims (2)
ェイスブロックを有する上型と、ランナーブロックおよ
び下側チェイスブロックを有する下型とを備え、上記上
型と下型とを組み合わせて、上記下側チェイスブロック
に形成されたキャピテイ内に装填した半導体装置を上記
チャンバーから注入した溶融樹脂を上記ランナーブロッ
クに形成されたポットおよびメインランナー並びに上記
下側チェイスブロックに形成されたサブランナーおよび
ゲートを介して上記キャビティ内に導いて上記半導体装
置を樹脂封止し成形するものにおいて、上記メインラン
ナーの一部にその樹脂流路断面積を狭めた絞り部を設け
たことを特徴とする樹脂封止成形装置。(1) An upper mold having a chamber, a chamber block, and an upper chase block, and a lower mold having a runner block and a lower chase block, and the upper mold and the lower mold are combined to form the lower chase block. The semiconductor device loaded into the cavity is injected from the chamber into the cavity through the pot and main runner formed in the runner block, and the sub-runner and gate formed in the lower chase block. 1. A resin sealing molding apparatus for molding the semiconductor device by resin-sealing the semiconductor device, characterized in that a part of the main runner is provided with a constriction portion that narrows the cross-sectional area of the resin flow path.
て絞り部を形成したどとを特徴とする特許請求の範囲第
１項記載の樹脂封止成形装置○（３） メインランナー
の一部の幅を狭くして絞り部を形成したことを特徴とす
る特許請求の範囲第１項記載の樹脂封止成形装置。(2) A resin sealing molding apparatus according to claim 1, characterized in that a constriction block is inserted into a part of the main runner to form a constriction part.(3) A part of the main runner 2. The resin sealing molding apparatus according to claim 1, wherein the narrowed portion is formed by narrowing the width of the resin sealing molding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15194383A JPS6043836A (en) | 1983-08-20 | 1983-08-20 | Resin sealing and forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15194383A JPS6043836A (en) | 1983-08-20 | 1983-08-20 | Resin sealing and forming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6043836A true JPS6043836A (en) | 1985-03-08 |
| JPH0155576B2 JPH0155576B2 (en) | 1989-11-27 |
Family
ID=15529597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15194383A Granted JPS6043836A (en) | 1983-08-20 | 1983-08-20 | Resin sealing and forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6043836A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS503567U (en) * | 1973-05-04 | 1975-01-14 | ||
| JPS5330726A (en) * | 1976-09-02 | 1978-03-23 | Fuji Electric Co Ltd | Slip frequency detector for induction motor |
| JPS54101858A (en) * | 1978-01-27 | 1979-08-10 | Hitachi Ltd | Mold |
| JPS5999728U (en) * | 1982-12-24 | 1984-07-05 | 株式会社日立製作所 | Mold for resin sealing |
| JPS6455576A (en) * | 1987-08-26 | 1989-03-02 | Canon Kk | Image forming device |
-
1983
- 1983-08-20 JP JP15194383A patent/JPS6043836A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS503567U (en) * | 1973-05-04 | 1975-01-14 | ||
| JPS5330726A (en) * | 1976-09-02 | 1978-03-23 | Fuji Electric Co Ltd | Slip frequency detector for induction motor |
| JPS54101858A (en) * | 1978-01-27 | 1979-08-10 | Hitachi Ltd | Mold |
| JPS5999728U (en) * | 1982-12-24 | 1984-07-05 | 株式会社日立製作所 | Mold for resin sealing |
| JPS6455576A (en) * | 1987-08-26 | 1989-03-02 | Canon Kk | Image forming device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155576B2 (en) | 1989-11-27 |
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