JPS5941239A - Mold for injection molding - Google Patents

Mold for injection molding

Info

Publication number
JPS5941239A
JPS5941239A JP15198282A JP15198282A JPS5941239A JP S5941239 A JPS5941239 A JP S5941239A JP 15198282 A JP15198282 A JP 15198282A JP 15198282 A JP15198282 A JP 15198282A JP S5941239 A JPS5941239 A JP S5941239A
Authority
JP
Japan
Prior art keywords
gate
mold
injection
injection molding
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15198282A
Other languages
Japanese (ja)
Inventor
Hidenori Idate
井立 秀則
Masaharu Ishikawa
正治 石川
Shigeo Iwami
岩見 重夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15198282A priority Critical patent/JPS5941239A/en
Publication of JPS5941239A publication Critical patent/JPS5941239A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/27Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701Details not specific to hot or cold runner channels
    • B29C45/2703Means for controlling the runner flow, e.g. runner switches, adjustable runners or gates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To obtain the titled mold that can provide an item with a low injection molding pressure without any short shot, burn mark, sink mark, etc., by supporting a gate tip in a floated manner by a spring thereby allowing the size of the gate to be varied in accordance with the injection pressure of the resin. CONSTITUTION:A melted resin is injection molded into cavities 1, 2 through a sprue 3, runners 4 and thin film gates 5. In the mold for said injection molding, the thin film gate 5 comprises a stationary gate 9 and the gate tip 6 housed slidably in a retaining chamber 8 through a spring 7.

Description

【発明の詳細な説明】 (イ)技術分野 この発明は、プラスチックスを成形する際に使用する金
型の設計に関するものである。特に熱可塑性プラスチッ
クスを射出成形する場合の金型の、特にゲートの設計に
関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to the design of a mold used in molding plastics. In particular, it relates to the design of molds, especially gates, when injection molding thermoplastics.

(ロ)背景技術 従来から、ゲート形状、寸法に起因する成形品の不良と
してショートショット、十ケ、ヒケ、圧力不足等が挙げ
られている。また、現在の射出成形機の設計の傾向は射
出圧を大きくするf頃向にあるようである。
(b) Background Art Conventionally, short shots, cracks, sink marks, insufficient pressure, etc. have been cited as defects in molded products due to gate shape and dimensions. Furthermore, the current trend in the design of injection molding machines seems to be toward increasing the injection pressure.

これは成形のハイサイクル化のための要請であると考え
られるが、この場合、射出圧力とゲートおよびキャビテ
ィの形状、寸法の兼合いを充分考慮して設計がなされる
べきであることは勿論である。要するにゲートは射出圧
力および成形品にマツチしたものにしなければならない
が、実際上ゲート寸法を決定するのは困難である。つま
り実際上射出圧力は成形時のショット期間中においても
大きく変化するものであるからである。
This is considered to be a request for high-cycle molding, but in this case, it goes without saying that the design should take into account the balance between injection pressure and the shape and dimensions of the gate and cavity. be. In short, the gate must match the injection pressure and the molded product, but in practice it is difficult to determine the gate dimensions. In other words, the injection pressure actually varies greatly even during the shot period during molding.

調節機能の付いたものはこれまで知られていなかった。Until now, no one with adjustable functions was known.

(ハ) 発明の目的 以上に述べたように、射出成形を行う場合成形品に種々
の不良が発生する。この原因のうちゲート寸法に原因す
る不良をなくするために、金型のゲート寸法を成形時に
調節できるようにした金型を提供することを目的とする
。なお、寸法調節機能の付いたゲートはこれまで知られ
ていなかった(ニ) 発明の開示 この発明は、ゲート部をランナ一部およびキャビィティ
部から独立させてゲートチップとなし、かつこのゲート
チップにより形成されているゲートを射出圧力の変化に
応じて広、狭自在に変化させるように、ハネで浮動的に
保持せしめたことを特徴とする射出成形用金型を提供す
るものである。以下実施例として示した図面に基づき説
明する第1図はこの発明に係る射出成形金型の1例の概
要図である。この図で1.2はキャビィティ、3はスプ
ルー、4はランナー、5はゲートであり、このゲート5
は薄層ゲートである。
(c) Purpose of the Invention As stated above, when injection molding is performed, various defects occur in molded products. In order to eliminate defects caused by gate dimensions among these causes, it is an object of the present invention to provide a mold in which the gate dimensions of the mold can be adjusted during molding. It should be noted that a gate with a dimension adjustment function has not been known until now. To provide an injection mold characterized in that a formed gate is held floating by springs so as to be freely widened or narrowed according to changes in injection pressure. DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1, which will be explained below based on drawings shown as examples, is a schematic diagram of an example of an injection molding die according to the present invention. In this figure, 1.2 is the cavity, 3 is the sprue, 4 is the runner, and 5 is the gate.
is a thin layer gate.

第2図は第1図のA−A ’断面図であり、この発明の
構成の要部を示している。この図で6はゲートチップ、
7はバネであり、ゲート5を流れる樹脂圧の変化に応じ
てゲートチップ6が運動し、ゲート間隔が変化するよう
に設定しである。8はゲートチップ保持室、9は固定的
なゲートであり、ゲートチップ6の変化を無意味にしな
いように、充分広く設計しである。要するにこの部分は
、少なくともゲートチップ6の可動的保持の機能を有す
ればよい。第3図は第1図のA−A ’面を示した図で
あり、薄層ゲート5の状態を示している。第4図は射出
成形時のシリンダーに加わる射出圧力の経時変化を示し
たグラフである。まずへステージはスプルー3、ランナ
ー4を樹脂が流れ、射出圧力P1は小さい。ところがB
ステージはゲート5を樹脂が流れる状態であり、P2で
示されるようにかなり高い圧力を要する。射出成形機が
大きな射出圧力を要する理由の1つは、射出圧力がCス
テージに移動するためであると考えられる。Bステージ
からCステージへ何故移動するかと言えば、それはゲー
ト5での摩擦発熱により、成形材料の粘性が低下し、結
局射出圧力の低下をもたらすためと考えられる。
FIG. 2 is a sectional view taken along the line AA' in FIG. 1, showing the main parts of the structure of the present invention. In this figure, 6 is the gate chip,
Reference numeral 7 denotes a spring, which is set so that the gate chip 6 moves in response to changes in the resin pressure flowing through the gate 5, and the gate interval changes. 8 is a gate chip holding chamber, and 9 is a fixed gate, which is designed to be sufficiently wide so that changes in the gate chip 6 do not become meaningless. In short, this portion only needs to have at least the function of movably holding the gate chip 6. FIG. 3 is a view showing the plane AA' of FIG. 1, and shows the state of the thin layer gate 5. In FIG. FIG. 4 is a graph showing changes over time in the injection pressure applied to the cylinder during injection molding. First, in the stage, resin flows through the sprue 3 and the runner 4, and the injection pressure P1 is small. However, B
The stage is a state in which the resin flows through the gate 5, and a considerably high pressure is required as indicated by P2. One of the reasons why an injection molding machine requires a large injection pressure is thought to be that the injection pressure is transferred to the C stage. The reason why the molding material moves from the B stage to the C stage is considered to be that the viscosity of the molding material decreases due to frictional heat generation at the gate 5, resulting in a decrease in the injection pressure.

つぎに、Dステージは充填完了時の圧力であり、Eステ
ージは保圧、Fステージは型開きの状態を示している。
Next, the D stage shows the pressure at the time of completion of filling, the E stage shows the holding pressure state, and the F stage shows the mold opening state.

以上に説明したように、この発明ではBステージにおい
て、大きな射出圧力を必要とするのを、ゲートを自動的
に広げることにより緩和して、以て過大な摩擦発熱の発
生を押えるのである。すなわちBステージにおいては、
射出圧力が大きいためにゲート5が開き、Cステージで
はゲート5が狭くなり、Dステージではキャビィティl
、2内に充分圧力が加わるようにゲート5を開かせると
言う機構を有する。
As explained above, in the present invention, the need for large injection pressure in the B stage is alleviated by automatically widening the gate, thereby suppressing the generation of excessive frictional heat generation. In other words, in stage B,
Gate 5 opens due to high injection pressure, gate 5 narrows in C stage, and cavity l in D stage.
, 2 has a mechanism for opening the gate 5 so that sufficient pressure is applied to the inside.

(へ) 効果 この発明は、ゲート部をランナ一部およびキャビィティ
部から独立させてゲートチップとなし、かつこのゲート
チップにより形成されているゲートを射出圧力の変化に
応して広、狭自在に変化させるように、ハネで浮動的に
保持せしめたことを特徴とするので以下のような効果を
有するに至った。
(F) Effect This invention makes the gate part independent from a part of the runner and the cavity part to form a gate chip, and the gate formed by this gate chip can be made wide or narrow according to changes in injection pressure. It is characterized in that it is held floating with springs so as to change the shape, so it has the following effects.

(1)射出圧力が小さくても充填可能である。(1) Filling is possible even at low injection pressure.

(2)ゲート発熱を適当な大きさに押えることができる
(2) Gate heat generation can be suppressed to an appropriate level.

<3>m形品に充分圧力を加えることが出来る(4)等
圧力でキャビィティ内に充填が可能となる。
<3> Sufficient pressure can be applied to the m-shaped product (4) It is possible to fill the cavity with equal pressure.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の実施例としての金型の概要図、第2
図は第1図のA−A ’断面図、第3図は第1図のA−
A ’面を示す図、第4図は射出成形時のシリンダーに
加わる射出成形圧の経時変化を示すグラフだある。 ■、2はキャビィティ 3はスプルー 4はランナー 5はゲート 6はゲートチップ 7はバネ 8はゲートチップ保持室 9は固定的ゲート 特許出願人   松下電工株式会社 代理人弁理士  竹元敏九(ほか2名)第1図 第2図 6    °l 第3図 第4図 射出問間t
Figure 1 is a schematic diagram of a mold as an embodiment of this invention, Figure 2
The figure is a sectional view taken along line A-A' in figure 1, and figure 3 is a cross-sectional view taken along line A-A' in figure 1.
Figure 4, which shows the A' side, is a graph showing changes over time in the injection molding pressure applied to the cylinder during injection molding. ■, 2 is the cavity 3 is the sprue 4 is the runner 5 is the gate 6 is the gate chip 7 is the spring 8 is the gate chip holding chamber 9 is a fixed gate Patent applicant Toshikuro Takemoto (other 2 Figure 1 Figure 2 Figure 6 °l Figure 3 Figure 4 Injection distance t

Claims (1)

【特許請求の範囲】[Claims] (1)射出成形用金型において、ゲート部をランナ一部
およびキャビィティ部から独立させてゲートチップとな
し、かつこのゲートチップにより形成されているゲート
を射出圧力の変化に応じて広、狭自在に変化させるよう
に、バネで浮動的に保持せしめたことを特徴とする射出
成形用金型。
(1) In an injection mold, the gate part is made independent from a part of the runner and the cavity part to form a gate chip, and the gate formed by this gate chip can be widened or narrowed according to changes in injection pressure. An injection mold characterized by being held floating by a spring so as to change the shape of the mold.
JP15198282A 1982-08-31 1982-08-31 Mold for injection molding Pending JPS5941239A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15198282A JPS5941239A (en) 1982-08-31 1982-08-31 Mold for injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15198282A JPS5941239A (en) 1982-08-31 1982-08-31 Mold for injection molding

Publications (1)

Publication Number Publication Date
JPS5941239A true JPS5941239A (en) 1984-03-07

Family

ID=15530470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15198282A Pending JPS5941239A (en) 1982-08-31 1982-08-31 Mold for injection molding

Country Status (1)

Country Link
JP (1) JPS5941239A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260313U (en) * 1985-10-07 1987-04-14
CN112872314A (en) * 2019-11-29 2021-06-01 贺利氏阿姆洛伊技术有限公司 Injection molding system for injection molding amorphous metals

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260313U (en) * 1985-10-07 1987-04-14
CN112872314A (en) * 2019-11-29 2021-06-01 贺利氏阿姆洛伊技术有限公司 Injection molding system for injection molding amorphous metals
US11318649B2 (en) 2019-11-29 2022-05-03 Heraeus Amloy Technologies Gmbh Injection molding system for the injection molding of amorphous metals

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