JPH0155576B2 - - Google Patents
Info
- Publication number
- JPH0155576B2 JPH0155576B2 JP58151943A JP15194383A JPH0155576B2 JP H0155576 B2 JPH0155576 B2 JP H0155576B2 JP 58151943 A JP58151943 A JP 58151943A JP 15194383 A JP15194383 A JP 15194383A JP H0155576 B2 JPH0155576 B2 JP H0155576B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- runner
- block
- chamber
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- 238000000465 moulding Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は半導体装置の樹脂封止成形装置の改
良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement in a resin sealing molding apparatus for semiconductor devices.
第１図は従来装置の構成例を示す斜視図で、１
は上型で樹脂を投入射出するためのチヤンバー
２、上側チエイスブロツク３およびチヤンバーブ
ロツク４を備えている。５は下型で、ポツト６お
よびメインランナー７を有するランナーブロツク
８と、サブランナー９、ゲート１０およびキヤビ
テイ１１を有する下側チエイスブロツク１２とを
備えている。
FIG. 1 is a perspective view showing an example of the configuration of a conventional device.
The mold is equipped with a chamber 2, an upper chase block 3, and a chamber block 4 for charging and injecting resin with an upper mold. A lower die 5 includes a runner block 8 having a pot 6 and a main runner 7, and a lower chase block 12 having a sub runner 9, a gate 10 and a cavity 11.
この状態で、上型１と下型５との間に半導体装
置を装填し（図示省略）、上型１と下型５とを型
締めした後に、チヤンバー２から封止用樹脂を投
入し成形するわけである。すなわち、チヤンバー
２から投入された樹脂はプランジヤ（図示省略）
によつて高圧で押し出され、ポツト６、メインラ
ンナー７、各サブランナー９、およびゲート１０
を経由して、各キヤビテイ１１に充填され所定の
成形が完了する訳である。 In this state, a semiconductor device is loaded between the upper mold 1 and the lower mold 5 (not shown), and after the upper mold 1 and the lower mold 5 are clamped, sealing resin is poured from the chamber 2 and molded. That's why. In other words, the resin injected from chamber 2 is transferred to the plunger (not shown).
The pot 6, the main runner 7, each sub runner 9, and the gate 10
Through this process, each cavity 11 is filled with the resin, and the predetermined molding is completed.
ところで、この種の樹脂成形では樹脂を昇温し
樹脂の粘度が低下した状態で注入し、成形する方
法がとられているが、上記従来の装置では、チヤ
ンバー２から注入された樹脂の流れのうちでラン
ナー壁に近くを流れる樹脂と流れの中心部を流れ
る樹脂との間に温度差を生じ、これが原因で、成
形品にボイドやブリスターなどの成形不良が多発
するという欠点があつた。 By the way, in this type of resin molding, a method is used in which the temperature of the resin is raised and the viscosity of the resin is lowered before it is injected and molded. There was a temperature difference between the resin flowing near the runner wall and the resin flowing in the center of the flow, which caused molding defects such as voids and blisters to occur frequently in molded products.
この発明は以上のような点に鑑みてなされたも
ので、メインランナーの一部に、樹脂とランナー
壁との接触面積を増大させ、かつ樹脂流体の厚み
を薄くする絞り部を設け、樹脂全体が一様にラン
ナー壁に触れるようにすることによつて、樹脂温
度を一様にし、ボイドやブリスターなどの発生の
ない成形装置を提供するものである。
This invention was made in view of the above points, and includes a constriction part in a part of the main runner that increases the contact area between the resin and the runner wall and reduces the thickness of the resin fluid. By uniformly touching the runner wall, the temperature of the resin is made uniform, thereby providing a molding device that does not generate voids or blisters.
第２図はこの発明の一実施例の下型の平面図、
第３図はこの実施例の要部のみを示す平面図、第
４図は第３図の−線での断面図、第５図は第
３図の−線での断面図、第６図はこの要部の
斜視図である。１３はランナーブロツク８にねじ
１４で取りつけられた絞りブロツクで、メインラ
ンナー７の一部を絞つて、樹脂とランナー壁との
接触面積を増大させ、かつ樹脂流体の厚みを薄く
している。
FIG. 2 is a plan view of the lower die of an embodiment of the present invention.
FIG. 3 is a plan view showing only the main parts of this embodiment, FIG. 4 is a sectional view taken along the - line in FIG. 3, FIG. 5 is a sectional view taken along the - line in FIG. 3, and FIG. It is a perspective view of this main part. Reference numeral 13 denotes a squeezing block attached to the runner block 8 with a screw 14, which squeezes a part of the main runner 7 to increase the contact area between the resin and the runner wall and to reduce the thickness of the resin fluid.
このようにメインランナー７の一部を絞ること
によつて、樹脂のランナー壁への接触は均一とな
り、樹脂の温度は一様にすることができ、均一な
溶融状態でキヤビテイ１１に注入されるので、ボ
イドやブリスターなどのない成型製品が得られ
る。 By squeezing a part of the main runner 7 in this way, the resin contacts the runner wall uniformly, the temperature of the resin can be made uniform, and the resin is injected into the cavity 11 in a uniform molten state. Therefore, molded products without voids or blisters can be obtained.
具体的には、メインランナー７の断面積Ｒと絞
りブロツク１３の断面積Ｖの比率を、Ｖ／Ｒ＝50
％付近にすると、従来に比べてボイド数は1/5程
度に、またクラツク数は1/20程度に減少した。こ
こでレプリカクラツクの数は樹脂の反応の良否を
判定する一つの目安であり、樹脂の反応要因の一
つは温度である。このように本実施例の金型を使
用ることにより、樹脂を均一な温度にさせて良好
な成形品を得ることができる。 Specifically, the ratio of the cross-sectional area R of the main runner 7 to the cross-sectional area V of the drawing block 13 is set as V/R=50.
%, the number of voids was reduced to about 1/5 and the number of cracks was reduced to about 1/20 compared to the conventional one. Here, the number of replica cracks is one of the indicators for determining the quality of the reaction of the resin, and one of the factors for the reaction of the resin is the temperature. As described above, by using the mold of this embodiment, it is possible to bring the resin to a uniform temperature and obtain a good molded product.
上記例ではメインランナー７の一部に絞りブロ
ツク１３を取りつけて絞りも形成したが、第７図
に平面図で示す他の実施例のように、メインラン
ナー７自体の一部に幅のせまい絞り部１５を設け
てもよく、また樹脂の種類によつては第８図に示
すように、上型４に絞りブロツク１３を取りつ
け、メインランナー７の樹脂流路の断面積を減少
するようにしてもよく、いずれにしても上記メイ
ンライナー７の断面積Ｒと絞りブロツク１３の断
面積Ｖの比率を50％程度とすることにより良好な
結果を得ることができる。 In the above example, the aperture block 13 is attached to a part of the main runner 7 to form an aperture, but as in another embodiment shown in a plan view in FIG. Depending on the type of resin, as shown in FIG. In any case, good results can be obtained by setting the ratio of the cross-sectional area R of the main liner 7 to the cross-sectional area V of the drawing block 13 to about 50%.
以上説明したように、この発明になる成形装置
では溶融樹脂を流し込む通路を構成するメインラ
ンナーに、樹脂とランナー壁との接触面積を増大
させ、かつ樹脂流体の厚みを薄くする絞り部を設
け、樹脂全体が一様にランナー壁に触れるように
したので、樹脂温度は一様となり、成型製品にボ
イドやブリスターのような欠陥の発生を防止でき
る。
As explained above, in the molding apparatus according to the present invention, the main runner constituting the passage into which the molten resin is poured is provided with a constriction part that increases the contact area between the resin and the runner wall and reduces the thickness of the resin fluid. Since the entire resin uniformly touches the runner wall, the resin temperature becomes uniform and defects such as voids and blisters can be prevented from occurring in the molded product.
第１図は従来の成形装置の構成例を示す斜視
図、第２図はこの発明の一実施例の下型の平面
図、第３図はその要部のみを示す平面図、第４図
および第５図はそれぞれ第３図の−線および
−線での断面図、第６図はこの要部の斜視
図、第７図、第８図はそれぞれこの発明の他の実
施例を説明するための図である。
図において、１は上型、２はチヤンバー、３は
上側チエイスブロツク、４はチヤンバーブロツ
ク、５は下型、６はポツト、７はメインランナ
ー、８はランナーブロツク、９はサブランナー、
１０はゲート、１１はキヤビテイ、１２は下側チ
エイスブロツク、１３は絞りブロツク、１５はメ
インランナー狭窄部である。なお、図中同一符号
は同一または相当部分を示す。
Fig. 1 is a perspective view showing an example of the configuration of a conventional molding device, Fig. 2 is a plan view of a lower mold according to an embodiment of the present invention, Fig. 3 is a plan view showing only the main parts thereof, Figs. 5 is a sectional view taken along lines - and - in FIG. 3, FIG. 6 is a perspective view of the main part, and FIGS. 7 and 8 are for explaining other embodiments of the invention, respectively. This is a diagram. In the figure, 1 is the upper mold, 2 is the chamber, 3 is the upper chase block, 4 is the chamber block, 5 is the lower mold, 6 is the pot, 7 is the main runner, 8 is the runner block, 9 is the sub-runner,
10 is a gate, 11 is a cavity, 12 is a lower chase block, 13 is a throttle block, and 15 is a main runner constriction section. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
側チエイスブロツクを有する上型と、ランナーブ
ロツクおよび下側チエイスブロツクを有する下型
とを備え、上記上型と下型とを組み合わせて、上
記下側チエイスブロツクに形成されたキヤビテイ
内に装填した半導体装置を、上記チヤンバーから
注入した溶融樹脂を上記ランナーブロツクに形成
されたポツトおよびメインランナー並びに上記下
側チエイスブロツクに形成されたサブランナーお
よびゲートを介して上記キヤビテイ内に導いて、
樹脂封止し成形する装置において、 上記メインランナーの一部にその樹脂流路断面
積を狭めた絞り部を設け、樹脂とランナー壁との
接触面積を増大させ、かつ該絞り部にて樹脂流体
の厚みを薄くするようにしたことを特徴とする樹
脂封止成形装置。 ２ メインランナーの一部に絞りプロツクを挿入
して絞り部を形成したことを特徴とする特許請求
の範囲第１項記載の樹脂封止成形装置。 ３ メインランナーの一部の幅を狭くして絞り部
を形成したことを特徴とする特許請求の範囲第１
項記載の樹脂封止成形装置。[Scope of Claims] 1. An upper mold having a chamber, a chamber block, and an upper chase block, and a lower mold having a runner block and a lower chase block, and the upper mold and the lower mold are combined. A semiconductor device loaded in a cavity formed in the lower chase block is injected from the chamber into a pot formed in the runner block, a main runner, and the lower chase block. Guided into the cavity through the sub-runner and gate,
In an apparatus for resin sealing and molding, a part of the main runner is provided with a constriction part that narrows the cross-sectional area of the resin flow path to increase the contact area between the resin and the runner wall, and the resin fluid is A resin sealing molding device characterized in that the thickness of the resin molding device is reduced. 2. The resin sealing molding apparatus according to claim 1, wherein the drawing section is formed by inserting a drawing block into a part of the main runner. 3. Claim 1 characterized in that the width of a part of the main runner is narrowed to form a constricted part.
The resin sealing molding apparatus described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15194383A JPS6043836A (en) | 1983-08-20 | 1983-08-20 | Resin sealing and forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15194383A JPS6043836A (en) | 1983-08-20 | 1983-08-20 | Resin sealing and forming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6043836A JPS6043836A (en) | 1985-03-08 |
| JPH0155576B2 true JPH0155576B2 (en) | 1989-11-27 |
Family
ID=15529597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15194383A Granted JPS6043836A (en) | 1983-08-20 | 1983-08-20 | Resin sealing and forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6043836A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS503567U (en) * | 1973-05-04 | 1975-01-14 | ||
| JPS5330726A (en) * | 1976-09-02 | 1978-03-23 | Fuji Electric Co Ltd | Slip frequency detector for induction motor |
| JPS54101858A (en) * | 1978-01-27 | 1979-08-10 | Hitachi Ltd | Mold |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5999728U (en) * | 1982-12-24 | 1984-07-05 | 株式会社日立製作所 | Mold for resin sealing |
| JPH0690581B2 (en) * | 1987-08-26 | 1994-11-14 | キヤノン株式会社 | Image forming device |
-
1983
- 1983-08-20 JP JP15194383A patent/JPS6043836A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS503567U (en) * | 1973-05-04 | 1975-01-14 | ||
| JPS5330726A (en) * | 1976-09-02 | 1978-03-23 | Fuji Electric Co Ltd | Slip frequency detector for induction motor |
| JPS54101858A (en) * | 1978-01-27 | 1979-08-10 | Hitachi Ltd | Mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6043836A (en) | 1985-03-08 |
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