JPS59155138A - Resin sealing device for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent an internal cavity from generating in an outer casing of a semiconductor device by a method wherein the inner diameter of a pot, in which a sealing resin is thrown, is formed in such a way as to be broadened in an extent corresponding to a space part where there exists no resin and the air in this part is made to exhaust to the outside from the outer periphery of a plunger. CONSTITUTION:When a resin 16 is thrown in a spot 20, the resin 16 drops until a position in an extent A from a resin throw-in port, in short, a position where the inner peripheral surface of the pot 20 beins to be run short of a taper form, and stops there. A plunger 15 is inserted into the pot 20. In this case, since the pot 20 has been formed in a taper form in the extent A, there exists a gap between the inner peripheral suface of the pot 20 and the outer peripheral surface of the plunger 15 until a position where the plunger 15 is made to come in contact with the upper end of the resin 16, and the air, where was remaining within the extend A, runs away to the outside. The plunger 15 is made to contact to the resin 16 part and, at the same time, is closely fitted into the pot 20 together, while the resin 16 is fused by a heater and is extruded in a mold.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a resin sealing device for a semiconductor device that seals a semiconductor chip on which a circuit network is formed with a resin during a semiconductor device manufacturing process.

[Technical background of the invention]

Semiconductor devices such as general KLSI are sealed with resin such as epoxy to form an envelope. Figure 1 shows the resin sealing device, which consists of an upper mold 11 and a lower mold. Type 1
2.

Between the upper mold 11 and the lower mold 12, a plurality of spaces are formed in a shape corresponding to the envelope shape of the semiconductor device, and the upper mold 1 and the lower mold 12 can be moved vertically. Pump 1. ”
ra, closely adhered to 13bK. Further, a cylindrical pot 14 is provided at the center of the upper Mll side. This pot 14 communicates with the mold space formed between the two molds 11 and 12, and with respect to this pot 14,
Then, the plunger J5 is inserted like a piston.

That is, in this sealing device, a semiconductor chip to be sealed with a resin is set in a mold space, a solid resin 16 such as epoxy formed in a cylindrical shape is put into a pot 14, and a resin 16 is placed on the upper mold 11 side. While melting with the built-in heater,
It is pushed out into the mold space by the plunger 16. This results in
The mold space in which the semiconductor chip is set is filled with molten resin to seal the chip, and the resin is hardened to form an envelope of the semiconductor device.

In this case, as shown in FIG. 2, the resin 16 to be charged into the pot is a cylindrical cylinder whose diameter is slightly smaller than the inner diameter of the pot 14, so that it can be easily charged in advance. It is formed to have a length of about two-thirds C, and after the resin 16 is poured into the pot 14, a large force space range A exists at its inlet. Then, the plunger 15 is inserted into the pot 14 from the inlet of the pot 14 into which the resin 16 is introduced in a piston-like manner so as to inject the resin 16 into the inner surface of the pot 14 with good viscosity. It is pushed out from the downward force of. In this case, in order to prevent the molten ridge fat from leaking outside, the pot 1
The inner surface of the plunger 4 and the outer peripheral surface of the plunger 15 are set to be in close contact with each other.

[Problems with background technology]

Therefore, in the resin sealing device configured in this way,
The air in the spatial range A remaining in the pot 14 when the plunger 15 is inserted does not escape to the outside of the pot 14.
It mixes with the melted Jugetsupi and is injected into the upper and lower molds 11 and 12. In other words, the mold space in which the semiconductor chip is set is filled with resin containing excess air, and when the resin is cured in this state to seal the semiconductor chip, as shown in FIG. A defective space called an internal cavity 17 occurs in the envelope case of a manufactured semiconductor device.

[Purpose of the invention]

This invention was made in order to solve the above-mentioned problems, and it is an object of the present invention to prevent the formation of internal cavities in the envelope case of a semiconductor device without introducing excess air into the sealing resin. The purpose of the present invention is to provide a complete resin molding device for semiconductor devices that can perform the following steps.

[Summary of the invention]

That is, the resin sealing device for a semiconductor device according to the present invention has the following features:
The inner diameter of the pot into which the sealing Jt resin is introduced is widened in a range corresponding to the space where no resin is present, so that the air in the above range is allowed to settle to the outside from the outer periphery of the plunger.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. FIG. The inner diameter of the section reaching the length of range A is gradually widened toward the input port direction to form a tapered shape. here,
The above-mentioned node A is 0, which corresponds to the so-called space where the resin 16 does not exist, from the end of the resin 16 to the resin 16 inlet when the resin 16 is charged into the bot 2o. A pot 20 is provided at the center of the resin-sealed upper film 114All.

In this case, it is effective to align the pot 2o and the plunger 15 by using a setting sleeve 2 for alignment, as shown in FIG. 5, for example. This setting sleeve 211d, pot matching end 21a
and a plunger mating end 21b. This pot mating end 2JIL is formed in a cylindrical shape so as to be inscribed in the pot 20, and the plunger mating end 21b is formed in an annular shape so as to be circumscribed in the plunger 15. The inner peripheral surface of this plunger mating end 21b is , is set at a position that coincides with the extension of the outer circumferential surface of the pot mating end 21a.

That is, the pot mating end 21a of the setting sleeve 21 is inserted into the bot 2θ, and then the plunger mating end 21bK is confirmed to be inserted easily, and the positions of the pot 20 and the plunger 15 are adjusted. Complete the alignment.

That is, when the resin 16 is poured into the pot 20, it falls from the resin injection port to a position in range A, that is, a position where the inner surface of the pot 20 is no longer tapered and stops. Then, the plunger 15 is inserted into the pot 2o. In this case, since the pot 20 has a tapered shape in range A,
The plunger 15 is titted to the point where it contacts the upper end of the resin 16.
A gap exists between the inner circumferential surface of the pot 20 and the outer circumferential surface of the plunger 15, so that the air remaining in the range AK escapes to the outside wJK. When the plunger 15 comes into contact with the resin 16, the plunger 15 is tightly lowered against the pot 20, and the resin 16 is melted by the heater and extruded into the mold.

Therefore, the air remaining in the pot 20 is allowed to escape to the outside until just before it comes into contact with the resin 16, and no air is mixed into the resin injected into the mold space.

In the above embodiment, the area corresponding to the wasted space inside the pot 20 is shaped like a hole to allow excess air to escape. You may also allow excess air to escape.

〔Effect of the invention〕

As described above, according to the present invention, when the semiconductor device is sealed with resin, the air remaining in the pot is released, so that the semiconductor device can be sealed without any excess air getting mixed into the sealing resin. It is possible to prevent internal cavities from forming in the envelope case.

[Brief explanation of the drawing]

Figure 1 is a diagram explaining a resin sealing device for semiconductor devices, Figure 2 is a diagram explaining a resin sealing device for semiconductor devices.
The figures explain the conventional pot used in this resin sealing device. (4) is a plan view, @ is a sectional view, and Fig. 3 (4)
) and ) are cross-sectional views taken along the line ■-■ showing internal cavities generated in the manufactured semiconductor device and its envelope, respectively.
The figure shows a resin sealing device for a semiconductor device according to an embodiment of the present invention.Figure 6 shows another embodiment of the present invention. 11.12...Resin-sealed type, 15...Plunger,
16... Sealing resin, 20... Pot. Applicant's agent Patent attorney Takehiko Suzue Figure 4

Claims (1)

[Claims] The mold includes a cylindrical pot that communicates with the mold through a molten resin passage and into which a solid columnar raw material resin is introduced, and a plunger that is inserted like a piston from the solid resin inlet of the pot. 1. A resin sealing device for a semiconductor device, characterized in that the pot has a large diameter of 4:2 to correspond to the spatial range on the input port side of the solid resin to be input.