JPS6037291A - 接合材料およびそれを用いた接合方法 - Google Patents

接合材料およびそれを用いた接合方法

Info

Publication number
JPS6037291A
JPS6037291A JP14456483A JP14456483A JPS6037291A JP S6037291 A JPS6037291 A JP S6037291A JP 14456483 A JP14456483 A JP 14456483A JP 14456483 A JP14456483 A JP 14456483A JP S6037291 A JPS6037291 A JP S6037291A
Authority
JP
Japan
Prior art keywords
bonding
joining
silver
copper
bonding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14456483A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349598B2 (enExample
Inventor
Isao Okutomi
功 奥富
Sadao Sugiyama
杉山　貞夫
Masanori Ishimatsu
石松　正規
Hidekazu Aoki
青木　英一
Masanao Tanaka
田中　政直
Takeshiro Sakida
崎田　猛城
Hideki Tamaya
玉谷　英樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Ishifuku Metal Industry Co Ltd
Original Assignee
Toshiba Corp
Ishifuku Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Ishifuku Metal Industry Co Ltd filed Critical Toshiba Corp
Priority to JP14456483A priority Critical patent/JPS6037291A/ja
Publication of JPS6037291A publication Critical patent/JPS6037291A/ja
Publication of JPS6349598B2 publication Critical patent/JPS6349598B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP14456483A 1983-08-08 1983-08-08 接合材料およびそれを用いた接合方法 Granted JPS6037291A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14456483A JPS6037291A (ja) 1983-08-08 1983-08-08 接合材料およびそれを用いた接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14456483A JPS6037291A (ja) 1983-08-08 1983-08-08 接合材料およびそれを用いた接合方法

Publications (2)

Publication Number Publication Date
JPS6037291A true JPS6037291A (ja) 1985-02-26
JPS6349598B2 JPS6349598B2 (enExample) 1988-10-05

Family

ID=15365171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14456483A Granted JPS6037291A (ja) 1983-08-08 1983-08-08 接合材料およびそれを用いた接合方法

Country Status (1)

Country Link
JP (1) JPS6037291A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299855A (ja) * 1987-05-29 1988-12-07 Fujitsu General Ltd ハンダ付け方法
JPH0292492A (ja) * 1988-09-30 1990-04-03 Toshiba Corp ロウ材料
CN104526181A (zh) * 2014-12-03 2015-04-22 浙江亚通焊材有限公司 一种应用于真空电子器件钎焊封接的电真空银基合金钎料及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132147A (en) * 1975-01-16 1976-11-17 Dowa Mining Co Silverrbrazing alloy

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132147A (en) * 1975-01-16 1976-11-17 Dowa Mining Co Silverrbrazing alloy

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299855A (ja) * 1987-05-29 1988-12-07 Fujitsu General Ltd ハンダ付け方法
JPH0292492A (ja) * 1988-09-30 1990-04-03 Toshiba Corp ロウ材料
CN104526181A (zh) * 2014-12-03 2015-04-22 浙江亚通焊材有限公司 一种应用于真空电子器件钎焊封接的电真空银基合金钎料及其制备方法

Also Published As

Publication number Publication date
JPS6349598B2 (enExample) 1988-10-05

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