JPS6037254Y2 - polishing equipment - Google Patents

Description

[Detailed description of the invention] This invention has a pressure plate that can be raised and lowered above a horizontally rotated surface plate, and polishes one side of the workpiece sandwiched between the surface plate and the pressure plate. The present invention relates to improvements in polishing equipment.

Conventionally, in the polishing apparatus described above, when polishing a small-diameter silicon wafer of about 2", the entire pressure platen 2 disposed on the surface plate 1 is pressurized with a sill mechanism, as shown in FIG. It is removed from the mechanism 3, hot water is supplied into the pressure platen 2, or the entire pressure plate is heated, the workpiece 4 is bonded to the lower surface with wax or the like and cooled, and then the pressure platen 2 is again pressurized. It is attached to mechanism 3, but in recent years the workpiece is 3”,
4" in diameter, aiming at further mass production of semiconductor devices, but at that time, the polishing machine also became larger, and the pressure plate became larger and heavier, but in general, the polisher weighed 8 kg.
There is a limit to how heavy the material can be, making it difficult to handle when attaching and detaching it.

In addition, in order to improve the polishing ability, when polishing under high temperature and high pressure, the wax softens and cannot hold the workpiece, or when high-precision lapping is required, processing due to thermal deformation of the pressure platen 2 is performed. In order to prevent a decrease in accuracy, it is conceivable to form a cooling chamber 2a inside the pressure platen 2 and cool the pressure platen 2 by passing cooling water into the cooling chamber 2a. It is important to prevent this leakage, as not only will it become heavier, but also the cooling water will leak when the pressure plate is attached and detached, and rust and dirt in the cooling water piping will fall onto the polishing cloth, causing defects such as scratches on the wafer, etc. This makes handling such as when attaching and detaching the pressure plate even more difficult.

This idea was developed by fixing a workpiece mounting plate made of ceramic or the like to the bottom surface of the pressure plate so that it can be attached and detached with a simple operation in the polishing device described above, and attaching the workpiece to the bottom surface of the workpiece mounting plate. By adhering using the method described above, the purpose is to eliminate the need for the difficult operation of attaching and detaching the pressure plate, and to facilitate the attachment and detachment of workpieces in a short time. In addition, it does not impair the original water cooling effect.

An embodiment of this invention will be described below with reference to the drawings.

FIG. 2 shows a polishing device according to an embodiment of this invention.

This polishing device has a plurality of pressure plates 12 arranged above a surface plate 11 that is horizontally rotated, and each of these pressure plates 12 is attached to a pressure mechanism 13 equipped with a cylinder mechanism provided in a main body 15 of the device. It is being

The pressure plate 12 has a cooling chamber 1 therein as shown in FIG.
2a is formed, and cooling water is allowed to flow into this cooling chamber 12a from outside the pressure plate 12 by appropriate means (not shown).

Further, as shown in FIGS. 3, 4, and 5, a workpiece mounting plate 16 is removably fixed in close contact with the lower surface of the pressure plate 12.

That is, on the lower outer circumferential surface of the pressure plate 12, four linear notches 12b are formed at equal angular intervals in a part of the circular arc of the outer circumferential surface, and the workpiece mounting plate 16 has a planar shape similar to that of the pressure plate. The detent portion 16a has approximately the same shape and size as the transverse planar shape of the portion having the twelve notches 12b, and has a detent portion 16a formed by cutting out a portion of the circular arc of the outer circumferential surface of the workpiece mounting plate 16 in a straight line.

Furthermore, claws 17 projecting downward are fixed to the notches 12b of the pressure plate 12, respectively.

Then, the pawl 17 is fitted into the rotation preventing portion 16a of the workpiece mounting plate 16 to prevent and position the workpiece mounting plate 16 from rotating in the circumferential direction with respect to the pressure plate 12, and to apply pressure. A workpiece mounting plate 16 is brought into close contact with the lower surface of the platen 12.

Further, a bracket 25 is attached to the upper surface of the pressure plate 12 so as to protrude outward from its periphery, and a clamp 21 is attached to a protruding portion 25a of the bracket 25.
4, and a lever 20 having a cam 20a at the end is pivotally connected to the top side of the bracket 25 by a pin 23, and below the pin 23, a push rod 22 is attached vertically so as to pass through the pressure plate. The clamp 21 is rotated or the push rod 22 is slid downward by raising and lowering the lever 20.

Then, when the lever 20 is tipped over from the upright position to the down position B with the workpiece brought into close contact with the lower surface of the pressure plate 12, the clamp 21 is pushed outward by the cam 20a and pivots around the pin 24. , rotates, and its lower end attaches the workpiece mounting plate 16 to the claw 17 on the side opposite the clamp 21.
In this state, the workpiece mounting plate 1
6 can be fixed under the pressure plate.

In FIG. 3, reference numeral 14 indicates a workpiece adhered to the lower surface of the workpiece mounting plate 16, and reference numeral 19 indicates a polishing cloth made of a nonwoven fabric laid on the surface plate 11.

Next, the operation of attaching and detaching a workpiece to the polishing apparatus configured as described above will be explained. With the pressurizing plate 12 being lifted apart from the lower surface plate 11 by the pressurizing mechanism 13, the workpiece 14 is coated with wax or the like. By inserting the fixed workpiece mounting plate 16 with the workpiece surface facing down from below to the position where the large cut portion 16a and the claw 17 match, and at the same time tipping the lever 20 from position A to position B. The workpiece mounting plate 16 is held.

Thereafter, the pressure plate 12 is lowered by the pressure mechanism 13, and the workpiece 14 is pressed onto the horizontally rotating surface plate 11 via the workpiece mounting plate 16, and polishing such as lapping or polishing is performed on the lower surface of the workpiece 14. It is something to do.

After polishing the workpiece, the polishing liquid or the like enters between the lower surface of the pressure plate 12 and the workpiece mounting plate 16, creating a kind of adsorption state, so that the workpiece mounting plate 16 can be easily removed. It is difficult to do so.

Therefore, when the lever 20 is moved upright from position B to position A, the tip of the lever 20 pushes the push rod 22 and the push rod pushes the workpiece mounting plate 16, causing the lower surface of the pressure plate 12 and the workpiece mounting plate 1
6. A gap is created between the upper surfaces of 6, and in this state, the pressure plate 12 is raised by a pressure mechanism using an upper air cylinder, and then the workpiece mounting plate is taken out.

In addition, in this invention, the shape of the rotation stopper 12b provided on the pressure plate 12 can be changed as appropriate, such as a trapezoidal groove, and the number of rotation stoppers 12b is also limited to four if there are multiple locations. isn't it.

As explained above, the polishing device of this invention forms a rotation stopper on the outer peripheral surface of the pressure plate, fits the pawl into the rotation stopper, and fastens the workpiece mounting plate with a clamp. Since the workpiece mounting plate is removably fixed to the bottom surface of the pressure plate, the workpiece mounting plate is lighter than the pressure plate, and even if the pressure plate has cooling water flowing inside, it will not be exposed to heat. Because there is no need to take into account cooling water leakage when attaching and detaching the workpiece mounting plate, compared to the conventional method in which the entire pressure plate is attached and detached and the workpiece is attached, it is easier to attach and detach the workpiece attachment plate to the pressure plate. The polishing device of this invention, which attaches and detaches the workpiece to the workpiece mounting plate and attaches the workpiece to the workpiece mounting plate, makes it easier to attach the workpiece in a shorter time, and only requires the addition of a clamp. This has the effect that the configuration is not too complicated.

[Brief explanation of the drawing]

Fig. 1 is a schematic vertical sectional view showing the surface plate and pressure plate portion of a conventional polishing device, Fig. 2 is a schematic front view showing a polishing device according to an embodiment of the invention, and Fig. 3 is a schematic longitudinal sectional view showing the rotating pressure plate portion. FIG. 4 is a schematic longitudinal sectional view, FIG. 4 is a schematic plan view of the same, and FIG. 5 is a plan view of the workpiece mounting plate. 11... Surface plate, 12... Pressure plate, 12
a... Cooling chamber, 12b... Rotating portion, 13... Pressure mechanism, 14... Workpiece, 16... Workpiece mounting plate, 17...
- Claw, 18... Fastener, 20... Lever 21... Clamp, 22... Push rod.

Claims (1)

[Scope of utility model registration request] A polishing device in which a pressure plate that can be raised and lowered is disposed above a horizontally rotated surface plate, a workpiece is sandwiched between the surface plate and the pressure plate, and one side of the workpiece is polished. Fixing claws projecting downward from the pressure plate to a plurality of locations on the outer circumferential surface of the pressure plate through which water communicates, and fitting the claws into rotation prevention portions formed on the outer circumference of the workpiece mounting plate;
A bracket formed to protrude outward from the periphery of the pressure plate is further attached to the top surface of the pressure plate, and a lever having a cam at the end is pivotally mounted on the top surface of this bracket so as to be able to rise and fall freely. A clamp whose upper end engages the cam of the lever and whose lower end engages the side surface of the workpiece mounting plate is pivotally attached to the protruding part of the lever, and below the pin of the lever, the upper end engages the lever. A polishing device characterized in that a push rod that engages with a cam is provided so as to be slidable in the vertical direction through a pressure plate.