JPH07237066A - Chucking device for machining device - Google Patents

Abstract

PURPOSE:To fix a workpiece to be machined, using a refrigerating chuck while keeping a space between the workpiece and a chuck plate uniform. CONSTITUTION:A workpiece 11 to be machined is held onto a chuck plate 12 through liquid 14 so that a space between the workpiece 11 and the upper face of the chuck plate 12 is almost constant by the balance between the weight of the workpiece 11 and the pressure of the liquid 14 discharged from a liquid outlet 18 provided on the upper face of the chuck plate 12. In this state, when the chuck plate 12 is cooled by a refrigerating chuck 15, the liquid 14 is frozen, and the workpiece 11 is fixed onto the chuck plate 12 through an ice layer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chuck device of a processing device for fixing a work in a processing device for cutting a silicon wafer or flattening a thin plate.

[0002]

2. Description of the Related Art Conventionally, in a dicing device which is a processing device for cutting a silicon wafer, in order to fix the silicon wafer, for example, the silicon wafer is fixed to a carrier frame and the carrier frame is fixed by a vacuum chuck. Was there. FIG. 14 is a plan view showing a carrier frame and a silicon wafer, and FIG. 15 is a sectional view showing a state where the carrier frame is fixed to a vacuum chuck. As shown in these figures, the ring-shaped carrier frame 101 has a low-adhesion adhesive tape 102 from the lower side.
Is adhered, and the silicon wafer which is the workpiece 103 is adhered and fixed on the adhesive tape 102. Then, as shown in FIG. 15, the carrier frame 101 to which the workpiece 103 to be processed is fixed is clamped by the vacuum chuck 104 and cut.

Further, in a processing apparatus for performing flat processing of a glass or aluminum plate for a magnetic disk, or a thin plate such as a silicon wafer, for example, as shown in FIG. 17, a thin plate workpiece 111 is directly vacuum-chucked. It was clamped by 104 and plane processing was performed. The surface processing includes diamond lathe, face cutting, slicing, grinding with a cylindrical grindstone or cup grindstone, creep feed processing, work rotation processing, and the like, and any processing method is available. Further, in addition to these fixing methods, as a fixing method used for fixing a silicon wafer in a dicing device or fixing a workpiece to be processed in a processing device that performs planar processing, as shown in FIG. There is a method in which the workpiece 112 to be processed is attached to the chuck plate 114 with the wax 113 and the chuck plate 114 is clamped by the vacuum chuck 104.

[0004]

However, as shown in FIG.
Further, as shown in FIG. 15, in the fixing method of fixing the workpiece 103 to be processed to the carrier frame 101, it takes time and time to attach the adhesive tape 102 to the carrier frame 101 before cutting and requires an apparatus for that. Moreover, there is a problem that the adhesive tape 102 becomes disposable. In addition, after cutting the work, in order to remove each work, a device that pushes up the work with a pin or the like from the lower side and separates the work from the adhesive tape 102 (for example, UV irradiation as disclosed in JP-A-4-212422). However, there was a problem that means) was required. Further, when the individual works are peeled off from the adhesive tape 102, a load is applied to the individual works, so that there is a problem that defects such as chipping may occur in the individual works. Further, since the adhesive tape 102 is an insulator, there is a problem that static electricity is easily generated.

Further, as shown in FIG. 17, in the method of clamping the workpiece 111 to be processed by the vacuum chuck device 104, the workpiece 11 curved as shown in FIG.
When 1 is clamped by the vacuum chuck device 104, the workpiece 111 to be machined is flat during machining, but when the workpiece 111 to be machined is removed from the vacuum chuck device 104 after machining, it returns to a curved state as before machining. However, there is a problem that the flatness is poor. In addition, the workpiece 1 to be processed is held by the suction part of the vacuum chuck device 104 during clamping.
A part of 11 is dented, and if processed in this state, the thickness of the part corresponding to the suction part becomes thicker, and after processing, the part that was dented at the time of clamping returns to the original state, so as shown in FIG. There is a problem in that the convex portion 116 is formed on the workpiece 111, and the flatness is deteriorated.

Further, as shown in FIG. 19, the workpiece 112 to be machined is chucked with the wax 113.
The method of sticking to the work piece 14 has a problem that it takes time and effort to stick and remove the work 112 to be processed. In particular, at the time of removal, there is a problem that it is difficult to remove and handle the work divided into small pieces from the wax 113, and automation is difficult. Further, as shown in FIG. 19, it is difficult to uniformly insert the wax 113 between the workpiece 112 to be processed and the chuck plate 114 because bubbles 117 are generated in the wax 113, and it is possible to perform the processing with good parallelism. There was a problem that it was difficult.

By the way, for example, JP-A-1-188308
As shown in Japanese Patent Publication No.
As a fixing method that can be easily removed, a method using a freeze chuck has been proposed. This freezing chuck fixes a workpiece to be processed on a chuck plate via a frozen ice layer. However, even with this freezing chuck, conventionally, there has been a problem that it is difficult to make the interval between the workpiece to be processed and the chuck plate uniform and it is difficult to perform processing with good parallelism.

Therefore, an object of the present invention is to provide a chuck device of a processing apparatus which can fix a workpiece to be processed by using a freezing chuck while making a space between the workpiece to be processed and a chuck plate uniform. Especially.

[0009]

According to a first aspect of the present invention, a chuck plate for fixing a workpiece to be processed in a processing device via ice, and a liquid for forming ice on the chuck plate are provided. Liquid supplying means for supplying, freezing means for freezing the liquid supplied on the chuck plate by the liquid supplying means to form ice, and machining fixed to the upper surface of the chuck plate by the ice formed by the freezing means The above-mentioned object is achieved by equipping the chuck device of the processing apparatus with a gap equalizing means for equalizing the gap between the target work and the upper surface of the chuck plate.

According to a second aspect of the present invention, there is provided a chucking device for a processing apparatus according to the first aspect, wherein the spacing uniformizing means is
It has a groove formed on the upper surface of the chuck plate and holding a liquid for forming ice under the workpiece to be processed placed on the chuck plate. According to a third aspect of the present invention, in the chuck apparatus of the first aspect of the present invention, in the apparatus according to the first aspect, the gap uniformizing means equalizes the thickness of the ice layer formed between the workpiece to be processed and the upper surface of the chuck plate. It is a thing. According to a fourth aspect of the present invention, in the chuck device of the third aspect of the present invention, in the apparatus according to the third aspect, the spacing equalizing means chucks the target workpiece so that the distance between the target workpiece and the upper surface of the chuck plate is substantially constant. It has a holding means for holding it on the plate. According to a fifth aspect of the present invention, there is provided the chuck device of the processing apparatus according to the fourth aspect, wherein the holding means is provided on the upper surface of the chuck plate and has a plurality of liquid outlets for discharging the liquid supplied from the liquid supply means. The work to be processed is held by the balance between the pressure of the liquid discharged from the liquid outlet and the weight of the work to be processed. A chuck device for a processing apparatus according to claim 6 is the device according to claim 4, wherein the holding means is provided on the upper surface of the chuck plate, and a plurality of liquid outlets for discharging the liquid supplied from the liquid supply means, and a chuck. And a regulation means for regulating the upward movement of the workpiece to be machined on the plate, the workpiece to be machined is lifted upward by the pressure of the liquid discharged from the liquid outlet, and the workpiece to be machined upward by the regulating means. By restricting the movement, the work to be processed is held. A chuck device for a processing apparatus according to claim 7 is the device according to claim 4, wherein the holding means is provided on the upper surface of the chuck plate, and a plurality of liquid outlets for discharging the liquid supplied from the liquid supply means.
A work to be processed by means of a balance between the pressure of the liquid discharged from the liquid outlet and the pressure of the gas discharged from the gas discharge means. Is to hold. A chuck device for a processing apparatus according to an eighth aspect is the apparatus according to the fourth aspect, wherein the holding means is provided on the upper surface of the chuck plate, and the distance between the workpiece to be processed and the upper surface of the chuck plate is substantially constant. It has a spacer for holding the workpiece to be processed on the chuck plate. According to a ninth aspect of the present invention, there is provided a chuck device for a machining apparatus according to any one of the first to third aspects, wherein at least a portion of the chuck plate to which the workpiece to be machined is fixed is formed by an elastic member.

[0011]

In the chuck device of the processing apparatus according to claim 1,
The liquid supplied onto the chuck plate by the liquid supply means is frozen by the freezing means to form ice, and the workpiece is fixed to the upper surface of the chuck plate by the ice. Further, the interval uniformizing means uniformizes the interval between the workpiece to be processed and the upper surface of the chuck plate. In addition, in this invention, ice shall contain what solidifies the liquid other than water by freezing.

In the chuck device of the processing apparatus according to the second aspect of the invention, the liquid held in the groove formed on the upper surface of the chuck plate is frozen by the freezing means to form ice, and this ice causes the workpiece to be machined and the chuck plate. The workpiece to be machined is fixed to the upper surface of the chuck plate with almost no distance from the upper surface of the chuck plate. In the chuck device of the processing device according to the third aspect, the thickness of the ice layer formed between the workpiece to be processed and the upper surface of the chuck plate is made uniform by the gap uniformizing means. In the chuck device of the machining apparatus according to the fourth aspect, the workpiece is held on the chuck plate by the holding means such that the distance between the workpiece and the upper surface of the chuck plate is substantially constant. In the chuck device of the processing device according to claim 5,
The work to be processed is held by the balance between the pressure of the liquid discharged from the liquid outlet provided on the upper surface of the chuck plate and the weight of the work to be processed. In the chuck device of the processing apparatus according to claim 6, the work to be processed is lifted up by the pressure of the liquid discharged from the liquid outlet provided on the upper surface of the chuck plate, and the work to be processed is moved upward by the restricting means. The movement is restricted and the workpiece to be processed is held. In the chuck device of the processing apparatus according to claim 7, the workpiece to be processed is held by the balance between the pressure of the liquid discharged from the liquid outlet provided on the upper surface of the chuck plate and the pressure of the gas discharged from the gas discharging means. To be done. In the chuck device of the processing apparatus according to claim 8, the spacer provided on the upper surface of the chuck plate causes a space between the workpiece to be processed and the upper surface of the chuck plate to be substantially constant,
The workpiece to be processed is held on the chuck plate. In the chuck device of the processing apparatus according to the ninth aspect, since at least the portion of the chuck plate to which the workpiece to be processed is fixed is formed by the elastic member, it is easy to remove the workpiece after processing.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chuck device of a processing apparatus according to the present invention will be described in detail below with reference to FIGS. FIG. 1 is a sectional view showing the structure of a chuck device according to a first embodiment of the present invention. As shown in this figure, the chuck device of this embodiment is provided with a workpiece 11 such as a silicon wafer.
Plate 12 for fixing the plate through an ice layer
A liquid supply device 13 for supplying a liquid 14 for forming an ice layer on the chuck plate 12, and a liquid supply device 13 provided below the chuck plate 12 and supplied on the chuck plate 12 by the liquid supply device 13. And a freezing chuck 15 as freezing means for freezing the liquid 14 to form an ice layer.

A liquid inlet 17 is provided on the side of the chuck plate 12, and a plurality of liquid outlets 18 are provided on the upper surface of the chuck plate 12 at equal intervals. Further, inside the chuck plate 12, a liquid passage 19 that connects the liquid inlet 17 and the liquid outlet 18 is provided.
In addition, a circumferential convex portion 20 is formed on the peripheral portion of the upper surface of the chuck plate 12, and the liquid 14 can be held on the upper surface of the chuck plate 12 surrounded by the convex portion 20. The liquid supply device 13 is connected to the liquid inlet portion 17 via a pipe 21. This liquid supply device 1
3 supplies the liquid at a constant pressure.
In the present embodiment, the distance between the upper surface of the chuck plate 12 and the workpiece 11 to be machined is balanced by the balance between the pressure of the liquid 14 discharged from the liquid outlet 18 provided on the upper surface of the chuck plate 12 and the weight of the workpiece 11 to be machined. The workpiece 11 is held on the chuck plate 12 via the liquid 14 so that As the liquid 14, a liquid that solidifies at about 0 to −30 ° C. is used, and pure water is particularly preferable.

The freezing chuck 15 is adapted to cool the chuck plate 12 by utilizing, for example, the Peltier effect. The Peltier effect is a phenomenon in which, as shown in FIG. 2, when different metals 23 and 24 are joined and an electric current is applied to the metal 23 and 24, heat is generated or absorbed at the joint between the metals 23 and 24. The freezing chuck 15
In addition to utilizing the Peltier effect, may be cooled by using a low temperature fluid such as liquid nitrogen or CFC gas.
The chuck plate 12 may be integrated with the freezing chuck 15 or may be a separate body. When the chuck plate 12 is separate from the freezing chuck 15, the freezing chuck 15 may also have a vacuum chuck function. In this case, the workpiece 11 to be machined through the ice layer.
The chuck plate 12 to which is fixed is fixed on the freezing chuck 15 by the vacuum chuck function, and processing such as cutting and grinding is performed. When the freeze chuck 15 does not have a vacuum chuck function, the chuck plate 12 to which the workpiece 11 is fixed is fixed to a vacuum chuck (not shown) through an ice layer, and processing such as cutting and grinding is performed.

Next, the operation of the chuck device of this embodiment will be described. When fixing the workpiece 11 to be processed on the chuck plate 12, first, the workpiece 11 to be processed is placed on the chuck plate 12, and the liquid supply device 13 causes the pipe 21 to reach the liquid inlet portion 17 of the chuck plate 12. The liquid 14 is supplied at a constant pressure. This liquid 14
Is discharged from the liquid outlet 18 through the liquid passage 19 in the chuck plate 12 and lifts the workpiece 11 to be processed. As a result, the workpiece 11 to be processed is the liquid outlet 1
Pressure of liquid 14 discharged from 8 and workpiece 11 to be processed
Is held in a position that balances with the weight of. When the chuck plate 12 is cooled by the freezing chuck 15 in this state, the liquid 14 is solidified, and the workpiece 11 to be processed is fixed on the chuck plate 12 through the ice layer.

At this time, the workpiece 11 to be machined is held on the chuck plate 12 so that the distance between the upper surface of the chuck plate 12 and the workpiece 11 to be machined is substantially constant. The thickness of the ice layer between the work 11 and the work 11 is substantially uniform. The thickness of the ice layer can be adjusted by adjusting the liquid supply pressure in the liquid supply device 13. The thickness of this ice layer is preferably several mm or less, particularly 100 μm or less. As described above, by making the ice layer thin, even if the thickness of the ice layer varies, the magnitude of the variation can be reduced. The workpiece 11 fixed on the chuck plate 12 in this manner
On the other hand, cutting work or flat work is performed, and after the work, the work 1 to be processed by thawing ice with hot air or the like.
1 is removed from the chuck plate 12.

As described above, according to this embodiment, the workpiece 11 to be processed is chucked to the chuck plate 1 by the freezing chuck.
Since it is fixed to No. 2, it is not necessary to attach it with the conventional adhesive tape or wax, and the labor and time for attaching and detaching the workpiece 11 to be processed can be saved. Further, in this embodiment, since the thickness of the ice layer between the upper surface of the chuck plate 12 and the workpiece 11 to be machined is substantially uniform, it is possible to machine the workpiece with good parallelism. In the case of cutting, the ice layer is the chuck plate 1.
Since it is between the upper surface of 2 and the workpiece 11 to be machined, the workpiece 1 to be machined without damaging the chuck plate 12
One cutting can be performed. Further, since the ice layer covers the work surface at the time of chucking or cutting, the work can be protected by the ice layer and chipping can be prevented. Furthermore, when removing individual workpieces after cutting,
Since no load is applied to each work, chipping during removal can be prevented.

Further, as shown in FIG. 3, in this embodiment,
Since the workpiece 11 can be fixed to the chuck plate 12 via the ice layer 16 without imposing a load on the workpiece 11, in the case of planar machining, the curved workpiece 11 can be left as it is. By fixing in a shape and performing flat surface processing, it is possible to remove the warp of the flat surface after flat surface processing, and it is possible to perform flatness processing. Further, unlike the case where the workpiece to be machined is directly fixed by the vacuum chuck, a part of the workpiece to be machined is not dented by the suction portion of the vacuum chuck, so that the workpiece can be machined with good flatness.

FIG. 4 is a sectional view showing the structure of the chuck device according to the second embodiment of the present invention. As shown in this figure, the chuck device of the present embodiment is provided with a pressing plate 31 as a restricting means for restricting upward movement of the workpiece 11 on the chuck plate 12. The pressing plate 31 includes a flat surface portion 31 a and a flat surface portion 31 a.
It has a downwardly projecting circular protrusion 31b formed on the peripheral portion of the lower surface of a and a liquid outlet 31c provided at an appropriate interval on the protrusion 31b. Further, in this embodiment,
Circular protrusions 20 are not formed on the upper surface of the chuck plate 12.

In this embodiment, when the work 11 to be machined is fixed on the chuck plate 12, first, the work 11 to be machined is placed on the chuck plate 12 and the pressing plate 31 is arranged so as to cover the work 11 to be machined. Is placed on the chuck plate 12. Then, the liquid supply device 13
The liquid 14 is supplied to the chuck plate 12 and discharged from the liquid outlet 18. Then, the work 11 to be processed is lifted up by the pressure of the liquid 14 discharged from the liquid outlet 18, and is held in contact with the flat surface portion 31 a of the pressing plate 31. The liquid 14 discharged from the liquid outlet 18 is discharged from the liquid outlet 31c of the pressing plate 31.

In this state, when the chuck plate 12 is cooled by the freezing chuck 15, the liquid 14 is solidified,
The workpiece 11 to be processed is fixed on the chuck plate 12 via the ice layer. At this time, the pressing plate 31 causes the upper surface of the chuck plate 12 and the workpiece 1 to be machined.
Since the distance from the chuck plate 12 is kept constant, the thickness of the ice layer between the upper surface of the chuck plate 12 and the workpiece 11 is substantially uniform. The pressing plate 31 may be formed of metal or the like, but may be formed of an elastic member such as rubber to prevent the upper surface of the workpiece 11 from being scratched. Other configurations, operations and effects are similar to those of the first embodiment.

FIG. 5 is a sectional view showing the structure of the chuck device according to the third embodiment of the present invention. As shown in this figure, in the chuck device of this embodiment, a fluid passage 31d for passing cold water or cold air is formed inside the pressing plate 31 of the second embodiment. In this embodiment, when fixing the workpiece 11 to be processed on the chuck plate 12,
By passing cold water or cold air through the fluid passage 31d, the temperature difference between the upper side and the lower side of the liquid 14 on the chuck plate 12 can be reduced, and the time for freezing and solidifying the liquid 14 can be shortened. Other configurations, operations and effects are similar to those of the second embodiment.

FIG. 6 is a sectional view showing the structure of a chuck device according to the fourth embodiment of the present invention. As shown in this figure, in the chuck device of the present embodiment, in the chuck device of the second embodiment, instead of the pressing plate 31, a gas that releases gas such as air from above to the upper surface of the workpiece 11 to be processed. The discharging device 41 is provided. The gas releasing device 41 is formed inside with a gas inlet portion 41a provided on a side portion, a plurality of gas outlet portions 41b formed on a lower surface,
It has a gas passage 41c that connects the gas inlet portion 41a and the gas outlet 41b. The gas inlet 41a is connected to a gas supply device (not shown) via a pipe (not shown).

In the present embodiment, when the workpiece 11 to be machined is fixed on the chuck plate 12, the workpiece 11 to be machined is first placed on the chuck plate 12 and the gas releasing device 41 is placed above the workpiece 11 to be machined. To place. Then, the liquid 14 is supplied from the liquid supply device 13 to the chuck plate 12 and discharged from the liquid outlet 18, and the gas is supplied from the gas supply device (not shown) to the gas discharge device 41 and discharged from the gas outlet 41b. Then, the pressure of the liquid 14 discharged from the liquid outlet 18 and the gas discharge device 4
The workpiece 11 is held at a predetermined position by the balance with the pressure of the gas discharged from the first gas outlet 41b. When the chuck plate 12 is cooled by the freezing chuck 15 in this state, the liquid 14 is solidified, and the workpiece 11 to be processed is fixed on the chuck plate 12 through the ice layer.

At this time, since the distance between the upper surface of the chuck plate 12 and the workpiece 11 to be machined is kept constant, the upper surface of the chuck plate 12 and the workpiece 11 to be machined.
The thickness of the ice layer between and becomes almost uniform. In the present embodiment, the gas released by the gas releasing device 41 may be cold air. Thereby, the temperature difference between the upper side and the lower side of the liquid 14 on the chuck plate 12 can be reduced, and the time for freezing and solidifying the liquid 14 can be shortened. Other configurations, operations and effects are similar to those of the second embodiment.

FIG. 7 is a sectional view showing the structure of a chuck device according to the fifth embodiment of the present invention. As shown in this figure, in the chuck device of the present embodiment, a chuck plate 50 is provided instead of the chuck plate 12 of the first embodiment. The chuck plate 50 is a liquid inlet part 1 like the chuck plate 12 in the first embodiment.
7, the liquid outlet 18 and the liquid passage 19 are not provided.
The liquid 14 supplied from the liquid supply device 13 is the pipe 5
It is configured to be discharged to the upper surface of the chuck plate 50 via the first.

A circumferential convex portion 52 is formed on the upper surface of the chuck plate 50, and the liquid 14 can be held on the upper surface of the chuck plate 50 surrounded by the convex portion 52. . Further, at least three pin insertion holes 53 are vertically penetrated through the chuck plate 50, and pins 54 having the same length are inserted as spacers into the plurality of pin insertion holes 53 as spacers. ing. The lower ends of the plurality of pins 54 are fixed to the plate 55, and the upper ends project from the upper surface of the chuck plate 50 by the same length. The protrusion amount of the pin 54 is set to several mm or less, preferably 100 μm or less, depending on the thickness of the ice layer. In addition, the chuck plate 50 in the present embodiment is separated from the freezing chuck 15, and the chuck plate 50 after the workpiece 11 to be processed is fixed.
Is fixed on the freezing chuck 15 by the vacuum chuck function of the freezing chuck 15 or fixed to another vacuum chuck.

In this embodiment, when the workpiece 11 to be machined is fixed on the chuck plate 50, first, the pin 54 is used.
Through the pin insertion hole 53, and the upper end of the pin 54 is projected from the upper surface of the chuck plate 50. Next, the workpiece 11 to be processed is placed on the pin 54, and the upper surface of the chuck plate 50 surrounded by the convex portion 52 is filled with the liquid 14. When the chuck plate 50 is cooled by the freezing chuck 15 in this state, the liquid 14 is solidified, and the workpiece 11 to be processed is transferred to the chuck plate 5 through the ice layer.
It is fixed on 0. At this time, since the distance between the upper surface of the chuck plate 50 and the workpiece 11 is kept constant by the pin 54, the thickness of the ice layer between the upper surface of the chuck plate 50 and the workpiece 11 is substantially equal. Be uniform.

The pin 54 may be withdrawn after the ice layer is formed. In this case, for example, heat may be applied to each pin 54 via the plate 55 and the pins 54 may be pulled out downward.
Alternatively, without providing the plate 55, each pin 54 may be a separate member, and each pin 54 may be pulled out downward while rotating one by one. Other configurations, operations and effects are similar to those of the first embodiment.

8 and 9 relate to the sixth embodiment of the present invention. FIG. 8 is a plan view of the chuck plate and FIG. 9 is a sectional view of the chuck plate. As shown in these figures, in this embodiment, the chuck plate 12 in the first embodiment is used.
Instead of, a chuck plate 61 is provided.
The chuck plate 61 includes the liquid inlet portion 17 and the liquid outlet 1 like the chuck plate 12 in the first embodiment.
8 and the liquid passage 19 are not provided. Liquid supply device 1
The liquid supplied from No. 3 is discharged to the upper surface of the chuck plate 61 via the pipe 51 shown in FIG. On the upper surface of the chuck plate 61, as shown in FIG. 9, relief grooves 62 for the cutting blade 63 are formed in a grid pattern.

In the present embodiment, when the workpiece 11 to be machined is fixed on the chuck plate 61, the escape groove 62 on the upper surface of the chuck plate 61 is filled with liquid, and the workpiece 11 to be machined is mounted on the upper surface of the chuck plate 61. Place. In this state, when the chuck plate 61 is cooled by the freezing chuck 15, the liquid in the escape groove 62 is solidified, and the workpiece 11 is fixed on the chuck plate 61 by the ice in the escape groove 62. At this time, no ice layer is formed at all between the upper surface of the chuck plate 61 and the workpiece 11 to be processed, or an extremely thin ice layer is formed. Therefore, according to the present embodiment, the parallelism of the workpiece 11 to be machined becomes higher. Other configurations, operations and effects are similar to those of the first embodiment.

10 and 11 relate to the seventh embodiment of the present invention, FIG. 10 is a plan view of the chuck plate, and FIG. 11 is a sectional view of the chuck plate. As shown in these drawings, in the present embodiment, a chuck plate 71 is provided instead of the chuck plate 61 in the sixth embodiment. The chuck plate 71 does not have the liquid inlet portion 17, the liquid outlet 18 and the liquid passage 19 unlike the chuck plate 12 in the first embodiment. The liquid supplied from the liquid supply device 13 is the pipe 5 shown in FIG.
1 is discharged to the upper surface of the chuck plate 71. Circular convex portions 72 are formed on the peripheral portion of the upper surface of the chuck plate 71, and liquid can be held on the upper surface of the chuck plate 71 surrounded by the convex portions 72. Further, on the upper surface of the chuck plate 71, a plurality of convex portions 73 having the same height and arranged in a grid pattern are formed as spacers. Convex part 7
The height of 3 is several mm or less, preferably 100 μm or less, depending on the thickness of the ice layer.

In this embodiment, when the workpiece 11 to be machined is fixed on the chuck plate 71, the workpiece 11 to be machined is placed on the convex portion 73, and the upper surface of the chuck plate 71 surrounded by the convex portion 72. Is filled with liquid 14. In this state, the chuck plate 71 is moved by the freezing chuck 15.
Is cooled, the liquid 14 is solidified, and the workpiece 11 is fixed on the chuck plate 71 through the ice layer. At this time, the protrusion 73 causes the chuck plate 7 to move.
Since the distance between the upper surface of the workpiece 1 and the workpiece 11 is kept constant, the thickness of the ice layer between the upper surface of the chuck plate 71 and the workpiece 11 is substantially uniform.

Further, in the present embodiment, when used in a processing apparatus for cutting a silicon wafer, the cutting position of the silicon wafer is changed by arranging the convex portion 73 at a position which is unlikely to be the cutting position of the silicon wafer. Even if
It is possible to deal with this without exchanging the chuck plate 71. Other configurations, operations and effects are similar to those of the first embodiment.

FIG. 12 is a sectional view of a chuck plate according to the eighth embodiment of the present invention. Like the chuck plate 71 in the seventh embodiment, the chuck plate 81 in the present embodiment has a circumferential convex portion 82 formed on the peripheral portion of the upper surface, and the chuck plate 81 surrounded by the convex portion 82 has an upper surface. It can hold liquid. Further, the convex portion 73 as in the seventh embodiment is not formed on the upper surface of the chuck plate 81, and instead, as a spacer,
A plurality of spherical gap members 83 having a uniform diameter are placed. The gap material 83 has a diameter of 0.0, for example.
A plastic, ceramics, or the like having a thickness of about 5 to 0.1 mm and softer than silicon is used.

In this embodiment, when the workpiece 11 to be processed is fixed on the chuck plate 81, the gap member 83 is used.
The work 11 to be processed is placed on the upper surface of the chuck plate 81, and the liquid 14 is filled on the upper surface of the chuck plate 81 surrounded by the convex portions 82.
In this state, when the chuck plate 81 is cooled by the freezing chuck 15, the liquid 14 is solidified and the workpiece 11 to be processed is fixed on the chuck plate 81 through the ice layer. At this time, since the gap between the upper surface of the chuck plate 81 and the workpiece 11 is kept constant by the gap material 83, the thickness of the ice layer between the upper surface of the chuck plate 81 and the workpiece 11 is It becomes almost uniform. Other configurations, operations and effects are similar to those of the first embodiment.

FIG. 13 is a sectional view of a chuck plate according to the ninth embodiment of the present invention. The chuck plate 91 in this embodiment includes a ring-shaped frame 92 and a disk-shaped elastic member 9 attached to the lower side of the frame 92.
3 and 3. As the material of the elastic member 93,
Rubber, polypropylene, resin film or the like is used.
Further, the liquid supplied from the liquid supply device 13 is discharged onto the upper surface of the chuck plate 91 via the pipe 51 shown in FIG.

In this embodiment, when the workpiece 11 to be processed is fixed on the chuck plate 91, first, the liquid 14 is filled inside the frame 92. When the chuck plate 91 is cooled by the freezing chuck 15 in this state, the liquid 14 is solidified and an ice layer having a substantially uniform thickness is formed. Next, when the work 11 to be processed is placed on the ice layer, part of the ice is melted by the heat of the work 11 to be processed, and the work 11 is fixed on the chuck plate 91 by solidifying again. . Then, the chuck plate 91 to which the work 11 to be processed is fixed is fixed by a vacuum chuck, and processing such as cutting of the work 11 to be processed is performed. After processing, the ice layer is thawed and the elastic member 93
The workpiece 11 to be processed can be easily removed by pushing up the workpiece 11 to be processed from below. In particular, in the case of cutting a silicon wafer, the chip can be handled without touching the pattern surface of the chip after cutting. The present invention is not limited to the above-mentioned embodiments, and for example, in order to make the thickness of the ice layer formed between the workpiece to be processed and the upper surface of the chuck plate uniform, the chuck plate is rotated while rotating. The liquid on the plate may be frozen.

[0040]

As described above, according to the present invention, the gap between the workpiece to be machined and the upper surface of the chuck plate is made uniform by the spacing equalizing means, so that the gap between the workpiece to be machined and the chuck plate is made uniform. There is an effect that the workpiece to be processed can be fixed by using the freezing chuck while making the temperature uniform.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the structure of a chuck device according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing the principle of the Peltier effect used in the freeze chuck in FIG.

3 is a cross-sectional view showing a state in which a workpiece to be processed is fixed to a chuck plate by the chuck device of FIG.

FIG. 4 is a sectional view showing the structure of a chuck device according to a second embodiment of the present invention.

FIG. 5 is a sectional view showing the structure of a chuck device according to a third embodiment of the present invention.

FIG. 6 is a sectional view showing the structure of a chuck device according to a fourth embodiment of the present invention.

FIG. 7 is a sectional view showing the structure of a chuck device according to a fifth embodiment of the present invention.

FIG. 8 is a plan view of a chuck plate according to a sixth embodiment of the present invention.

9 is a cross-sectional view of the chuck plate shown in FIG.

FIG. 10 is a plan view of a chuck plate according to a seventh embodiment of the present invention.

11 is a cross-sectional view of the chuck plate shown in FIG.

FIG. 12 is a sectional view of a chuck plate according to an eighth embodiment of the present invention.

FIG. 13 is a sectional view of a chuck plate according to a ninth embodiment of the present invention.

FIG. 14 is a plan view showing a carrier frame and a silicon wafer according to a conventional fixing method.

15 is a cross-sectional view showing a state where the carrier frame of FIG. 14 is fixed to a vacuum chuck.

FIG. 16 is a cross-sectional view showing a curved workpiece.

FIG. 17 is a cross-sectional view showing a state in which a workpiece to be processed is fixed by a vacuum chuck device.

FIG. 18 is a cross-sectional view showing a state after processing of a workpiece to be processed fixed by a vacuum chuck device.

FIG. 19 is a cross-sectional view showing a state in which a workpiece to be processed is fixed to a chuck plate with wax.

[Explanation of symbols]

 11 Workpiece to be Processed 12 Chuck Plate 13 Liquid Supply Device 14 Liquid 15 Freezing Chuck 18 Liquid Outlet

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/68 N 21/301

Claims (9)

[Claims] 1. A chuck plate for fixing a workpiece to be processed in a processing apparatus via ice, liquid supply means for supplying a liquid for forming ice onto the chuck plate, and the liquid supply means. A freezing means for freezing the liquid supplied onto the chuck plate to form ice; a workpiece to be fixed on the upper surface of the chuck plate by the ice formed by the freezing means; and an upper surface of the chuck plate. A chuck device for a processing apparatus, comprising: a uniform spacing means for uniformizing the spacing. 2. The gap uniformizing means has a groove formed on the upper surface of the chuck plate and holding a liquid for forming the ice under the workpiece to be machined placed on the chuck plate. The chuck device of the processing apparatus according to claim 1, wherein the chuck device is a chuck device. 3. The chuck of a processing apparatus according to claim 1, wherein the spacing uniformizing means uniformizes a thickness of an ice layer formed between the workpiece to be processed and the upper surface of the chuck plate. apparatus. 4. The holding means for holding the workpiece to be machined on the chuck plate so that the distance between the workpiece to be machined and the upper surface of the chuck plate is substantially constant. The chuck device of the processing apparatus according to claim 3. 5. The holding means is provided on the upper surface of the chuck plate and has a plurality of liquid outlets for discharging the liquid supplied from the liquid supply means, and the pressure of the liquid discharged from the liquid outlets and the object to be processed. The chuck device for a processing apparatus according to claim 4, wherein the workpiece to be processed is held by a balance with the weight of the workpiece. 6. The holding means is provided on the upper surface of the chuck plate, and regulates a plurality of liquid outlets for discharging the liquid supplied from the liquid supply means and the upward movement of the workpiece to be machined on the chuck plate. A workpiece to be machined is held by restricting the workpiece to be processed upward by the pressure of the liquid discharged from the liquid outlet and restricting the upward movement of the workpiece to be processed by the controller. The chuck device of the processing apparatus according to claim 4, wherein: 7. The holding means is provided on the upper surface of the chuck plate, and has a plurality of liquid outlets for discharging the liquid supplied from the liquid supply means, and a gas for discharging gas from above to the upper surface of the workpiece to be processed. The workpiece to be machined is held by a balance between the pressure of the liquid discharged from the liquid outlet and the pressure of the gas discharged from the gas discharging unit. Chuck device for processing equipment. 8. The holding means has a spacer which is provided on the upper surface of the chuck plate and holds the workpiece to be processed on the chuck plate so that the distance between the workpiece to be processed and the upper surface of the chuck plate is substantially constant. The chuck device of the processing apparatus according to claim 4, wherein. 9. The chuck device for a processing apparatus according to claim 1, wherein at least a portion of the chuck plate to which the workpiece to be processed is fixed is formed of an elastic member.