JPS6035535A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS6035535A JPS6035535A JP14369483A JP14369483A JPS6035535A JP S6035535 A JPS6035535 A JP S6035535A JP 14369483 A JP14369483 A JP 14369483A JP 14369483 A JP14369483 A JP 14369483A JP S6035535 A JPS6035535 A JP S6035535A
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- insulating film
- wiring
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000011521 glass Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 238000001312 dry etching Methods 0.000 claims abstract description 3
- 238000009413 insulation Methods 0.000 claims description 5
- 238000004528 spin coating Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000013007 heat curing Methods 0.000 claims description 2
- 235000010627 Phaseolus vulgaris Nutrition 0.000 claims 1
- 244000046052 Phaseolus vulgaris Species 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 26
- 239000000377 silicon dioxide Substances 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 13
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 210000001364 upper extremity Anatomy 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 102100037547 Semenogelin-2 Human genes 0.000 description 1
- 101710089335 Semenogelin-2 Proteins 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Local Oxidation Of Silicon (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14369483A JPS6035535A (ja) | 1983-08-08 | 1983-08-08 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14369483A JPS6035535A (ja) | 1983-08-08 | 1983-08-08 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6035535A true JPS6035535A (ja) | 1985-02-23 |
| JPH0449258B2 JPH0449258B2 (enrdf_load_stackoverflow) | 1992-08-11 |
Family
ID=15344786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14369483A Granted JPS6035535A (ja) | 1983-08-08 | 1983-08-08 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6035535A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62295437A (ja) * | 1986-06-14 | 1987-12-22 | Yamaha Corp | 多層配線形成法 |
| JPS6365646A (ja) * | 1986-09-05 | 1988-03-24 | Nec Corp | 半導体装置 |
| EP0636937A1 (en) | 1993-07-28 | 1995-02-01 | Chugai Photo Chemical Co. Ltd. | Compositions of color developing agent and color developer composition for processing silver halide color photographic material and method of using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104186A (en) * | 1977-02-23 | 1978-09-11 | Hitachi Ltd | Multilayer wiring body |
-
1983
- 1983-08-08 JP JP14369483A patent/JPS6035535A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104186A (en) * | 1977-02-23 | 1978-09-11 | Hitachi Ltd | Multilayer wiring body |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62295437A (ja) * | 1986-06-14 | 1987-12-22 | Yamaha Corp | 多層配線形成法 |
| JPS6365646A (ja) * | 1986-09-05 | 1988-03-24 | Nec Corp | 半導体装置 |
| EP0636937A1 (en) | 1993-07-28 | 1995-02-01 | Chugai Photo Chemical Co. Ltd. | Compositions of color developing agent and color developer composition for processing silver halide color photographic material and method of using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0449258B2 (enrdf_load_stackoverflow) | 1992-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0345895B2 (enrdf_load_stackoverflow) | ||
| US3615949A (en) | Crossover for large scale arrays | |
| US4541892A (en) | Process for the positioning of an interconnection line on an electrical contact hole of an integrated circuit | |
| US4328263A (en) | Method of manufacturing semiconductor devices using lift-off technique | |
| JPS6035535A (ja) | 半導体装置の製造方法 | |
| JPS63312643A (ja) | 半導体装置の製造方法 | |
| JPS61152040A (ja) | 半導体装置の製造方法 | |
| JPS6148771B2 (enrdf_load_stackoverflow) | ||
| JPS58127326A (ja) | 半導体装置の製造方法 | |
| JPS5833853A (ja) | 半導体装置の製造方法 | |
| JPH0936115A (ja) | 半導体装置の製造方法 | |
| JPS62247523A (ja) | 半導体装置の製造方法 | |
| JPH04184444A (ja) | 感光性耐熱樹脂組成物と半導体装置の製造方法 | |
| JPS6214095B2 (enrdf_load_stackoverflow) | ||
| JPS5833854A (ja) | 半導体装置の製造方法 | |
| JPS593853B2 (ja) | 半導体素子の製造方法 | |
| JPS6032047A (ja) | 微細加工方法 | |
| JPS5917540B2 (ja) | 半導体装置の配線形成方法 | |
| JPS60219754A (ja) | ポリイミドのパタ−ン形成方法 | |
| JPS61128531A (ja) | 多層配線基板の製造方法 | |
| JPS59114824A (ja) | 半導体装置の平坦化方法 | |
| JPS61107731A (ja) | 半導体装置の製造方法 | |
| JPS56155549A (en) | Manufacture of semiconductor device | |
| JPH0457342A (ja) | 半導体装置の製造方法 | |
| JPS58188134A (ja) | 集積回路の製造方法 |