JPS6035530A - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JPS6035530A
JPS6035530A JP14387683A JP14387683A JPS6035530A JP S6035530 A JPS6035530 A JP S6035530A JP 14387683 A JP14387683 A JP 14387683A JP 14387683 A JP14387683 A JP 14387683A JP S6035530 A JPS6035530 A JP S6035530A
Authority
JP
Japan
Prior art keywords
jig
contact
pellet
positioning
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14387683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0357621B2 (enrdf_load_stackoverflow
Inventor
Takashi Terajima
寺島　隆
Shunei Uematsu
俊英 植松
Yasuo Kawada
川田　保夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd, Hitachi Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP14387683A priority Critical patent/JPS6035530A/ja
Publication of JPS6035530A publication Critical patent/JPS6035530A/ja
Publication of JPH0357621B2 publication Critical patent/JPH0357621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP14387683A 1983-08-08 1983-08-08 ボンディング装置 Granted JPS6035530A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14387683A JPS6035530A (ja) 1983-08-08 1983-08-08 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14387683A JPS6035530A (ja) 1983-08-08 1983-08-08 ボンディング装置

Publications (2)

Publication Number Publication Date
JPS6035530A true JPS6035530A (ja) 1985-02-23
JPH0357621B2 JPH0357621B2 (enrdf_load_stackoverflow) 1991-09-02

Family

ID=15349058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14387683A Granted JPS6035530A (ja) 1983-08-08 1983-08-08 ボンディング装置

Country Status (1)

Country Link
JP (1) JPS6035530A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146531U (ja) * 1983-12-28 1984-09-29 ダイキン工業株式会社 過給機付エンジンの吸入空気冷却装置
JPH021427U (enrdf_load_stackoverflow) * 1988-06-13 1990-01-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146531U (ja) * 1983-12-28 1984-09-29 ダイキン工業株式会社 過給機付エンジンの吸入空気冷却装置
JPH021427U (enrdf_load_stackoverflow) * 1988-06-13 1990-01-08

Also Published As

Publication number Publication date
JPH0357621B2 (enrdf_load_stackoverflow) 1991-09-02

Similar Documents

Publication Publication Date Title
US4631816A (en) Automatic apparatus for mounting electronic parts
US4598453A (en) Apparatus for centering and aligning a workpiece
JPH11245064A (ja) ディスク装置用サスペンションのレーザ溶接設備
JPS6035530A (ja) ボンディング装置
US5051555A (en) Hot-bar suspension system
JP3377725B2 (ja) 基板移送装置
JPS6395631A (ja) ダイボンデイング装置
CN100452950C (zh) 一种跳线开关自动组装机
CN218260736U (zh) 一种保险端子壳体上料机构
JPH0344434B2 (enrdf_load_stackoverflow)
JPS61249288A (ja) ロボツトの作業具交換装置
US12349278B2 (en) Self-guided placement of memory device component packages
CN217521948U (zh) 芯片挑拣设备
JPH035399Y2 (enrdf_load_stackoverflow)
JPS6377644A (ja) 搬送機
JPS6198000A (ja) Ｉｃ插着装置
JPS58186582A (ja) ロボツト
JPH0360942A (ja) ロケートピンによるワーク位置決め方法
CN204391056U (zh) Bga补球治具
JPS5828452A (ja) トランスフア−マシンにおける倍ピツチトランスフア−装置
JPS61241196A (ja) Ｘｙプロツタのペン交換装置
JPS60115498A (ja) プロツタのペン交換装置
JPH0629342A (ja) 同じ平面上にないボンド面に対するボンディング機構
JP2961584B2 (ja) 電子部品のベース部押え装置
JPS5837991A (ja) フラツトパツケ−ジ形電子部品の実装装置