JPS603138A - 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法 - Google Patents

電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法

Info

Publication number
JPS603138A
JPS603138A JP58110093A JP11009383A JPS603138A JP S603138 A JPS603138 A JP S603138A JP 58110093 A JP58110093 A JP 58110093A JP 11009383 A JP11009383 A JP 11009383A JP S603138 A JPS603138 A JP S603138A
Authority
JP
Japan
Prior art keywords
brazing
copper
disk
substrate
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58110093A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6351540B2 (enrdf_load_stackoverflow
Inventor
Hajime Goto
肇 後藤
Ikuzo Amamiya
雨宮　育造
Masanobu Nakayama
中山　正展
Kozo Ono
公三 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanagawa Seisakusho KK
Original Assignee
Kanagawa Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanagawa Seisakusho KK filed Critical Kanagawa Seisakusho KK
Priority to JP58110093A priority Critical patent/JPS603138A/ja
Publication of JPS603138A publication Critical patent/JPS603138A/ja
Publication of JPS6351540B2 publication Critical patent/JPS6351540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP58110093A 1983-06-21 1983-06-21 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法 Granted JPS603138A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58110093A JPS603138A (ja) 1983-06-21 1983-06-21 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58110093A JPS603138A (ja) 1983-06-21 1983-06-21 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法

Publications (2)

Publication Number Publication Date
JPS603138A true JPS603138A (ja) 1985-01-09
JPS6351540B2 JPS6351540B2 (enrdf_load_stackoverflow) 1988-10-14

Family

ID=14526845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58110093A Granted JPS603138A (ja) 1983-06-21 1983-06-21 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法

Country Status (1)

Country Link
JP (1) JPS603138A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63194148A (ja) * 1987-02-05 1988-08-11 Toshiba Corp 空気調和機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63194148A (ja) * 1987-02-05 1988-08-11 Toshiba Corp 空気調和機

Also Published As

Publication number Publication date
JPS6351540B2 (enrdf_load_stackoverflow) 1988-10-14

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