JPS6351540B2 - - Google Patents
Info
- Publication number
- JPS6351540B2 JPS6351540B2 JP58110093A JP11009383A JPS6351540B2 JP S6351540 B2 JPS6351540 B2 JP S6351540B2 JP 58110093 A JP58110093 A JP 58110093A JP 11009383 A JP11009383 A JP 11009383A JP S6351540 B2 JPS6351540 B2 JP S6351540B2
- Authority
- JP
- Japan
- Prior art keywords
- iron substrate
- hole
- brazing
- copper disk
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 44
- 229910052742 iron Inorganic materials 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 238000005219 brazing Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 239000003566 sealing material Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58110093A JPS603138A (ja) | 1983-06-21 | 1983-06-21 | 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58110093A JPS603138A (ja) | 1983-06-21 | 1983-06-21 | 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS603138A JPS603138A (ja) | 1985-01-09 |
| JPS6351540B2 true JPS6351540B2 (enrdf_load_stackoverflow) | 1988-10-14 |
Family
ID=14526845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58110093A Granted JPS603138A (ja) | 1983-06-21 | 1983-06-21 | 電子部品用ステムの鉄製基板と銅製デイスクとのろう付およびリ−ドのガラス封着の同時施工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS603138A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63194148A (ja) * | 1987-02-05 | 1988-08-11 | Toshiba Corp | 空気調和機 |
-
1983
- 1983-06-21 JP JP58110093A patent/JPS603138A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS603138A (ja) | 1985-01-09 |
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