JPS6351540B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for simultaneously brazing a copper disk and an iron substrate of a stem that supports electronic components such as power transistors, and glass-sealing leads to the iron substrate. It is.

As shown in FIGS. 1 to 3, the stem for electronic components is inserted into an iron substrate 1, a copper disk 2 brazed thereon, and a pair of holes 1a, 1a in the iron substrate 1. A pair of glass-sealed leads 3,
It consists of 3. An IC chip I such as a power transistor is mounted on a copper disk, and its terminals are connected to leads 3,3. Then, a cap C is placed to cover this.

Therefore, when manufacturing such a stem, brazing the iron substrate 1 and the copper disk 2,
Two steps are required: glass-sealing the leads 3 into the holes 1a of the iron substrate 1. However, while the conventional glass sealing process is performed in a furnace with a nitrogen atmosphere at 1000°C to 1050°C, the brazing process must be performed in a furnace with a hydrogen atmosphere at approximately 800°C, so both processes are cannot be carried out at the same time, which is a bottleneck in labor saving, and there is also the problem that reheating for brazing after the glass sealing process deteriorates the airtightness of the sealed part.

The present invention was made by focusing on the above-mentioned problems in the conventional stem manufacturing method.
Use 82-85% copper and 18-15% tin at 1000℃~
The aim is to solve the above-mentioned conventional problems by making it possible to simultaneously perform glass sealing and brazing of the leads in a 1050°C furnace.

An embodiment of the present invention will be described below with reference to the drawings.
As shown in FIGS. 1 to 3, an iron substrate 1 has a pair of holes 1a and 1a in the center for attaching leads, and
A pair of bolt insertion holes 1 on both sides for mounting to equipment
b, 1b. The iron substrate 1 is placed on a carbon jig 10 as shown in FIG. The bolt insertion holes 1b, 1b are fitted and positioned by a pair of protrusions 10a, 10a protruding from the upper surface of the carbon jig 10.

The copper disk 2 is placed on top of the iron substrate 1. This copper disk 2 has a hole 2a for pouring the brazing material.

The brazing material piece 5 is inserted into the hole 2a of the copper disk 2. This brazing filler metal piece 5 is made of 82% to 85% copper and tin.
It consists of 18% to 15% and has a melting point of 1000°C to 1050°C.

The pair of leads 3, 3 are each inserted into a hole 4a at the center of a sealing material 4 made of a cylindrical molded product of powdered glass, and are inserted together with the sealing material 4 into a hole 1a of the iron substrate 1. The upper end of the lead 3 has an umbrella 3a for preventing the sealing material 4 from coming out from the hole 4a. The leads 3 extending downward from the iron substrate 1 are received in the support holes 10b of the carbon jig 10. The sealant 4 has a melting point of 1000°C to 1050°C.

When the material placed on the carbon jig 10 as described above is placed in a furnace with a nitrogen atmosphere and heated to 1000°C to 1050°C, the brazing filler metal pieces 5 are melted between the iron substrate 1 and the copper disk 2. flows into. Further, the sealing material 4 is also melted at the same time. When taken out of the furnace in this state and cooled, the iron substrate 1 and the copper disk 2 are brazed together, and at the same time the leads 3 are sealed to the iron substrate 1.

As explained above, the present invention provides an iron substrate 1 in which a copper disk 2 having a hole 2a for pouring a brazing material is mounted on an iron substrate 1 having holes 1a, 1a for inserting a pair of leads 3, 3. 1 pair of holes 1
a, 1a, a sealing material 4 made of a cylindrical molded product of powdered glass with a lead 3 inserted through a hole 4a in the center, respectively;
A piece of brazing material 5 made of 82% to 85% copper and 18% to 15% tin is inserted into the hole 2a of the copper disk 2, and heated to 1000°C to 1050°C in a furnace. Since the sealing material 4 and the brazing material piece 5 are simultaneously melted and then cooled and solidified, the process of brazing the iron substrate 1 and the copper disk 2 and the glass sealing process of the lead 3 to the iron substrate 1 are performed. This has the effect of saving labor in manufacturing stems for electronic components and producing high-quality products.

[Brief explanation of the drawing]

FIG. 1 is a front view of the stem for electronic parts, FIG. 2 is a plan view thereof, FIG. 3 is a sectional view taken from FIG. 2, and FIG. 4 is a sectional view of the manufacturing process thereof. 1... Iron substrate, 1a... Lead insertion hole, 2
. . . Copper disk, 2a . . . Hole for pouring brazing material, 4 . . . Glass sealing material, 4a .

Claims (1)

[Claims] 1. A copper disk having a hole for pouring brazing material is placed on an iron substrate having a pair of holes for inserting leads, and a lead is inserted into the hole in the center of each pair of holes in the iron substrate. A sealing material made of a cylindrical glass molded product is fitted, and a piece of brazing material made of 82% to 85% copper and 18% to 15% tin is inserted into the hole of the copper disk, and heated to 1000% in a furnace. Simultaneous construction method for brazing the iron substrate and copper disk of an electronic component stem and glass sealing the leads by heating to a temperature of ℃ to 1050℃ to melt the sealing material and brazing material at the same time, and then cooling and solidifying them. .