JPS5937550B2 - Manufacturing method for airtight terminals - Google Patents

Manufacturing method for airtight terminals

Info

Publication number
JPS5937550B2
JPS5937550B2 JP7429579A JP7429579A JPS5937550B2 JP S5937550 B2 JPS5937550 B2 JP S5937550B2 JP 7429579 A JP7429579 A JP 7429579A JP 7429579 A JP7429579 A JP 7429579A JP S5937550 B2 JPS5937550 B2 JP S5937550B2
Authority
JP
Japan
Prior art keywords
glass
pipe lead
terminal plate
airtight
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7429579A
Other languages
Japanese (ja)
Other versions
JPS55165589A (en
Inventor
喜春 小森
孝一 薦田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP7429579A priority Critical patent/JPS5937550B2/en
Publication of JPS55165589A publication Critical patent/JPS55165589A/en
Publication of JPS5937550B2 publication Critical patent/JPS5937550B2/en
Expired legal-status Critical Current

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  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Description

【発明の詳細な説明】 この発明は半導体装置用キャップとして用いられる端子
板付きパイプリードを有する気密端子の製造方法に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an airtight terminal having a pipe lead with a terminal plate used as a cap for a semiconductor device.

半導体整流器として、例えば第1図及び第2図に示すよ
うに取付け用ボルト1が一体に形成されたスタッド2に
半導体素子3を固着し、気密端子4を被せてスタッド2
に抵抗溶接したものがある。
As a semiconductor rectifier, for example, as shown in FIGS. 1 and 2, a semiconductor element 3 is fixed to a stud 2 integrally formed with a mounting bolt 1, and an airtight terminal 4 is placed on the stud 2.
Some are resistance welded.

この気密端子4は半導体素子3の電極を外部に導出する
パイプリード5を金属外環6にガラス7で封着して内部
を気密に封止するものである。パイプリード5の外方端
にはパイプリード5の孔を塞ぐとともに外部線接続用の
端子板8を備えている。また、パイプリード5の内側は
半導体素子3の電極に接続された内部リード線9の一端
が挿入され、パイプリード5の矢印の部分でピンチして
かしめ固定される。なお、端子板8はパイプリード5の
一方端をプレス整形加工して形成するか、或いは別部材
をロウ付けして形成される。ところで、この気密端子4
は従来次のようにして製造されてい1 た。まず、第3
図に示すように金属外環6の嵌まる凹孔10とこの凹孔
10の底面10’に端子板8が嵌合するスリット形状の
凹孔11とパイプリード5が嵌合する丸孔12とを有す
るグラファイト製・ の封着治具13を用意する。
This airtight terminal 4 has a pipe lead 5 for leading the electrode of the semiconductor element 3 to the outside, and is sealed to a metal outer ring 6 with glass 7, thereby airtightly sealing the inside. The outer end of the pipe lead 5 is provided with a terminal plate 8 for closing the hole of the pipe lead 5 and for connecting an external line. Further, one end of the internal lead wire 9 connected to the electrode of the semiconductor element 3 is inserted into the inside of the pipe lead 5, and is fixed by pinching and caulking the pipe lead 5 at the part indicated by the arrow. Note that the terminal plate 8 is formed by press-shaping one end of the pipe lead 5, or by brazing a separate member. By the way, this airtight terminal 4
Conventionally, it was manufactured as follows1. First, the third
As shown in the figure, a concave hole 10 into which the metal outer ring 6 fits, a slit-shaped concave hole 11 into which the terminal plate 8 fits into the bottom surface 10' of this concave hole 10, and a round hole 12 into which the pipe lead 5 fits. A sealing jig 13 made of graphite is prepared.

そして、第4図に示すように、端子板8がロウ付けされ
ているパイプリード5を端子板8を下向きにした状態で
スリツヘー卜形状の凹孔11および丸孔12に挿入し、
さらに凹孔10内にガラス粉末をリング状にプレス整形
したガラスタブレツト14と金属外環6とを同芯状に配
置する。
Then, as shown in FIG. 4, the pipe lead 5 to which the terminal plate 8 is brazed is inserted into the slit-shaped concave hole 11 and the round hole 12 with the terminal plate 8 facing downward.
Furthermore, a glass tablet 14 formed by pressing glass powder into a ring shape and a metal outer ring 6 are placed concentrically in the concave hole 10.

そして、加熱炉に入れてガラスタブレツト14を溶かし
パイプリード5と金属外環6とをガラス7を介して気密
絶縁的に封着する。そして、ガラスが冷却固化すると、
圧縮封止型のものでは金属外環6とガラスの熱膨張率の
差により金属外環6がガラスを締め付け高い気密性を得
られる。ところが、このガラス封着工程に用いられる封
着治具13の端子板1嵌合用の凹孔11は偏平状の端子
板8を通過させる必要のため、スリツト形状となり丸孔
12にパイプリード5を嵌入すると、その左右に広がる
空洞部15,15が形成される。
Then, it is placed in a heating furnace to melt the glass tablet 14 and seal the pipe lead 5 and the metal outer ring 6 through the glass 7 in an airtight and insulating manner. Then, when the glass cools and solidifies,
In the compression sealing type, the metal outer ring 6 tightens the glass due to the difference in thermal expansion coefficient between the metal outer ring 6 and the glass, thereby achieving high airtightness. However, the concave hole 11 for fitting the terminal plate 1 of the sealing jig 13 used in this glass sealing process has a slit shape because it is necessary to allow the flat terminal plate 8 to pass through, and the pipe lead 5 is inserted into the round hole 12. When inserted, hollow portions 15, 15 are formed that extend to the left and right.

そして、ガラスタブレツト14が溶けた時に、その下方
に位置した空洞部15,15へたれ込み、ガラス7がパ
イプリード5に沿つて濡れ易い。このため、封着された
気密端子は第5図に示す如くパイプリード5に沿つてガ
ラスの這い上り部rができ、端子板8の下部とパイプリ
ード5のガラス7の這い上り部rまでの距離hが短かく
なり、内部リード線9のピンチ固定作業が困難になる。
また、ガラスの這い上り部γからクラツクが入り易くな
り気密性、電気特性劣化の原因となる。また、金属外環
6にパイプリード5をガラス7により気密絶縁的に封着
したのち、パイプリード5に端子板8をロウ付けする場
合においても、使用するロウ材の作業温度がガラス7の
軟化点よりも高いような場合には、前記同様にガラス7
にパイブリード5に沿う這い上り部7′が形成されて、
同様の問題点を生ずる。そこで、この発明は上記欠点に
鑑み、これを改良して、パイプリードへのガラス這い上
りの原因となる端子板8を通過させるための治具の空洞
部にグラフアイト製の補助治具を挿入してガラスの下面
を支持することにより、パイプリードに沿つてのガラス
の這い上りを防止するようにしたものである。
When the glass tablet 14 melts, it sag into the hollow parts 15, 15 located below, and the glass 7 tends to get wet along the pipe lead 5. Therefore, the sealed airtight terminal has a rising part r of glass along the pipe lead 5 as shown in FIG. The distance h becomes shorter, making it difficult to pinch and fix the internal lead wire 9.
In addition, cracks are likely to occur from the rising portion γ of the glass, causing deterioration of airtightness and electrical characteristics. Furthermore, even when brazing the terminal plate 8 to the pipe lead 5 after sealing the pipe lead 5 to the metal outer ring 6 with the glass 7 in an airtight and insulating manner, the working temperature of the brazing material used is such that the glass 7 softens. If it is higher than the point, the glass 7
A climbing portion 7' is formed along the pipe lead 5, and
Similar problems arise. Therefore, in view of the above-mentioned drawbacks, the present invention improves this by inserting an auxiliary jig made of graphite into the hollow part of the jig for passing the terminal plate 8, which causes glass to creep up onto the pipe lead. By supporting the lower surface of the glass, the glass is prevented from creeping up along the pipe lead.

以下、この発明を実施例について詳細に説明する。第6
図において、16はガラスと濡れ性の悪いグラフアイト
製の封着治具でパイブリード5を嵌合する丸孔12の両
側に補助封着治具嵌合用の丸孔17,17を設けた他は
第3図に示す従来の封着治具12と同様であり、同一部
分に同一参照符号を付し、その説明を省略する。
Hereinafter, the present invention will be described in detail with reference to examples. 6th
In the figure, 16 is a sealing jig made of graphite, which has poor wettability with glass, and round holes 17, 17 for fitting auxiliary sealing jig are provided on both sides of the round hole 12 into which the pipe lead 5 is fitted. The sealing jig 12 is similar to the conventional sealing jig 12 shown in FIG. 3, and the same parts are given the same reference numerals and the explanation thereof will be omitted.

そして第7図に示すように、封着治具16内に設けられ
たスリツト状凹孔11及び丸孔12内に端子板8をロウ
付けしたパイプリード5を端子板8を下に向けて嵌合す
る。次に、パイプリード5嵌合用の丸孔12の左右に形
成された二個の丸孔17,17に補助封着治具18,1
8を上から第8図に示すように嵌入させる。この補助封
着治具18,18はグラフアイト製で必らずしも断面形
状が円形状でなくてもよく、例えば四角形状等でもよい
。そして、ガラスタブレツト14及び金属外環6を所定
の位置関係に挿入・配置し、封着治具16ごと中性又は
弱還元性の加熱炉に入れる。そして、約1000℃で加
熱すればガラスタブレツトrが溶融して、金属外環6と
パイプリード5とがガラス7により気密絶縁的に封着さ
れるが、パイプリード5に隣接して補助封着治具18,
18が配置されているので、溶けたガラス7が補助封着
治具18,18に遮ぎられてパイブリード5へのガラス
7の這い上りは起こらない。封着後、冷却された気密端
子4を封着治具16から取り出せば、2個の補助封着治
具18,18も各々側方に外れて取り出せ、再使用でき
る。このような製法によつて得られた気密端子は第9図
に示すように、パイプリード5の端子板8の下端と封着
ガラス7との距離hが設計通りに充分に長くなるので、
内部リード線9のピンチ接続が容易に行なえ、従来這い
上り部で起きたピッチ時のガラスクラツクが生じなくな
る。また、上記説明では半導体整流器に用いる気密端子
について説明したが、この発明は、これと同様に端子板
を持つパイプリードをガラス封着した構造を持つ気密端
子に適用できる。例えば逆阻止3端子サイリスタや双方
性3端子サイリスタのようなゲート付きの半導体装置の
場合、端子板8付きのパイプリード5に加えて第10図
に示すようにゲート用のパイプリード19が金属外環6
″にガラス封着される。しかし、この場合もパイプリー
ド5″に隣接して適当な形状の補助封着治具18″,1
8′を嵌入配置させればよい。尚、上記実施例では、端
子板8がロウ付けされているパイブリード5を用いる場
合について説明したが、金属パイプの一端を圧潰封止し
て形成した端子板を一体に備えるパイプリードの場合に
も同様に実施できるものである。
Then, as shown in FIG. 7, the pipe lead 5 with the terminal plate 8 brazed thereon is inserted into the slit-shaped recessed hole 11 and round hole 12 provided in the sealing jig 16 with the terminal plate 8 facing downward. match. Next, the auxiliary sealing jigs 18, 1 are inserted into the two round holes 17, 17 formed on the left and right sides of the round hole 12 for fitting the pipe lead 5.
8 from above as shown in FIG. The auxiliary sealing jigs 18, 18 are made of graphite, and the cross-sectional shape does not necessarily have to be circular, but may be square, for example. Then, the glass tablet 14 and the metal outer ring 6 are inserted and arranged in a predetermined positional relationship, and the sealing jig 16 is placed in a neutral or weakly reducing heating furnace. When heated at about 1000°C, the glass tablet r melts, and the metal outer ring 6 and the pipe lead 5 are sealed in an airtight and insulating manner by the glass 7. Wearing jig 18,
18, the molten glass 7 is blocked by the auxiliary sealing jigs 18, 18, and the glass 7 does not creep up onto the pipe bleed 5. After sealing, if the cooled airtight terminal 4 is taken out from the sealing jig 16, the two auxiliary sealing jigs 18, 18 can also be taken out laterally and reused. As shown in FIG. 9, in the airtight terminal obtained by such a manufacturing method, the distance h between the lower end of the terminal plate 8 of the pipe lead 5 and the sealing glass 7 is sufficiently long as designed.
Pinch connections of the internal lead wires 9 can be easily made, and glass cracks at the time of pitching, which conventionally occur at creeping portions, do not occur. Further, in the above description, an airtight terminal used in a semiconductor rectifier has been described, but the present invention can similarly be applied to an airtight terminal having a structure in which a pipe lead having a terminal plate is sealed with glass. For example, in the case of a semiconductor device with a gate such as a reverse blocking three-terminal thyristor or a bidirectional three-terminal thyristor, in addition to the pipe lead 5 with the terminal plate 8, the pipe lead 19 for the gate is made of metal as shown in FIG. ring 6
However, in this case as well, an auxiliary sealing jig 18'', 1 of an appropriate shape is installed adjacent to the pipe lead 5''.
8' may be inserted and arranged. In the above embodiment, the case where the pipe lead 5 to which the terminal plate 8 is brazed is used has been described, but it is also possible to use a pipe lead that integrally includes a terminal plate formed by crushing and sealing one end of a metal pipe. can also be implemented in the same way.

又、上記実施例ではパイプリード5に端子板8がロウ付
けされており、この端子板付きパイプリード5と金属外
環6,6!とをガラス7により封着する場合について説
明したが、例えば予め金属外環6,6″と端子板無しの
パイプリード5,19とがガラス7により封着された気
密封着構体を製作しておき、この気密封着構体のパイプ
リード5に端子板8をロウ付けするような場合でも、ロ
ウ付け作業温度をガラス7の軟化点よりも高い場合には
、同様にガラス7にパイプリード5に沿つて這い上り部
7″を生じるので、前記と同様の封着治具16を用いて
ロウ付け作業を行なえば、ガラス7の這い上り部rを防
止することができる。
Further, in the above embodiment, a terminal plate 8 is brazed to the pipe lead 5, and the pipe lead 5 with the terminal plate and the metal outer rings 6, 6! Although the case where the metal outer rings 6, 6'' and the pipe leads 5, 19 without terminal plates are sealed with the glass 7 has been described, for example, an airtight sealing structure in which the metal outer rings 6, 6'' and the pipe leads 5, 19 without terminal plates are sealed with the glass 7 is manufactured in advance. Even when brazing the terminal plate 8 to the pipe lead 5 of this hermetically sealed structure, if the brazing temperature is higher than the softening point of the glass 7, the pipe lead 5 may be attached to the glass 7 in the same way. Since a creeping portion 7'' is formed along the glass 7, the creeping portion r of the glass 7 can be prevented by performing the brazing operation using the same sealing jig 16 as described above.

更には、ガラス7の封着作業温度と、パイブリード5と
端子板8とのロウ付け作業温度とが近似しているような
場合には、金属外環6,6″と端子板無しのパイプリー
ド5,19とをガラス7により封着すると同時に、端子
板無しのパイプリード5に端子板8をロウ付けすること
も可能であり、このような場合においてもこの発明を実
施し得るものである。
Furthermore, if the sealing temperature of the glass 7 and the brazing temperature of the pipe lead 5 and the terminal plate 8 are similar, the metal outer ring 6, 6'' and the pipe without a terminal plate may be used. It is also possible to seal the leads 5 and 19 with the glass 7 and at the same time braze the terminal plate 8 to the pipe lead 5 without a terminal plate, and the present invention can also be carried out in such a case. .

又、上記実施例では多数の気密端子を同時に製造するた
めに多数個取り用の封着治具16において加工の便宜上
スリツト形状の凹孔11を連続的に形成した場合につい
て説明したが、各スリツト形状の凹孔11を独立状に形
成してもよい。
Furthermore, in the above embodiment, a case was explained in which the slit-shaped recesses 11 were continuously formed for convenience of processing in the sealing jig 16 for manufacturing a large number of airtight terminals at the same time. The recessed holes 11 may be formed independently.

以上説明したように、この発明によれば端子板付きパイ
プリードを備える気密端子において、ガラス封着時及び
/またはロウ付け作業時に、パイプリードに隣接して棒
状の単純な構造の補助治具を配置するだけで、パイプリ
ードへのガラスの這い上りを確実に防止できる。従つて
、パイプリードへの内部リードのピンチによる接続が容
易になり、ガラスクラツクの発生をも防止できる。
As explained above, according to the present invention, in an airtight terminal having a pipe lead with a terminal plate, an auxiliary jig with a simple rod-like structure is installed adjacent to the pipe lead during glass sealing and/or brazing work. Just by placing it, you can reliably prevent glass from climbing up into the pipe lead. Therefore, the internal lead can be easily connected to the pipe lead by pinching, and the occurrence of glass cracks can also be prevented.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の背景となる気密端子を用いた半導体
整流器の一例を示す断面図、第2図はその上面図、第3
図は従来の気密端子の製造用封着治具の斜視図、第4図
は第3図の封着治具を用いた従来の気密端子の製造方法
を説明する断面図、第5図はそれによつて製造された気
密端子の要部拡大断面図、第6図はこの発明の気密端子
の製造用封着治具の一例の斜視図、第7図は第6図の封
着治具を用いたこの発明の気密端子の製造方法を説明す
る断面図、第8図は第5図の要部拡大斜視図、第9図は
この発明方法によつて製造された気密端子の要部拡大断
面図、第10図はこの発明の他の実施例の気密端子の製
造方法を示す平面図である。 4・・・・・・気密端子、5・・・・・・パイプリード
、6・・・・・・金属外環、7・・・・・・封着ガラス
、8・・・・・・端子板、10・・・・・・凹孔、10
″・・・・・・凹孔の底面、11・・・・・・端子板嵌
合用のスリツト状凹孔、12・・・・・・パイプリード
嵌合用の丸化 14・・・・・・ガラスタブレツト、1
5,15・・・・・・空洞敵 16・・・・・・封着治
具、17,17・・・・・・補助封着治具嵌合用の丸孔
、18,18・・・・・・補助封着治具、19・・・・
・・ゲート端子用パイプリード。
FIG. 1 is a cross-sectional view showing an example of a semiconductor rectifier using airtight terminals, which is the background of this invention, FIG. 2 is a top view thereof, and FIG.
The figure is a perspective view of a conventional sealing jig for manufacturing airtight terminals, FIG. 4 is a cross-sectional view illustrating a conventional method of manufacturing airtight terminals using the sealing jig shown in FIG. 6 is a perspective view of an example of a sealing jig for manufacturing an airtight terminal of the present invention, and FIG. 8 is an enlarged perspective view of the main part of FIG. 5, and FIG. 9 is an enlarged sectional view of the main part of the airtight terminal manufactured by the method of the invention. , FIG. 10 is a plan view showing a method of manufacturing an airtight terminal according to another embodiment of the present invention. 4...Airtight terminal, 5...Pipe lead, 6...Metal outer ring, 7...Sealing glass, 8...Terminal Plate, 10... Concave hole, 10
″...Bottom surface of the recess, 11...Slit-shaped recess for fitting the terminal plate, 12...Rounded for fitting the pipe lead 14... glass tablet, 1
5, 15...Cavity hole 16...Sealing jig, 17,17...Round hole for fitting auxiliary sealing jig, 18,18... ...Auxiliary sealing jig, 19...
... Pipe lead for gate terminal.

Claims (1)

【特許請求の範囲】 1 金属外環及びガラスを嵌合させる凹孔と、この凹孔
の底面に端子板を嵌入させるスリット状凹孔及びパイプ
リードを嵌入させる丸孔を持つ治具における、前記スリ
ット状凹孔及び丸孔に、端子板を下にして端子板及びパ
イプリードを嵌合させると共に、前記凹孔に金属外環及
びガラスを嵌合させて加熱する工程において、上記パイ
プリードの左右に生じる空洞部に、該パイプリードに接
して棒状の補助治具を嵌入させて前記ガラスの下面を支
持することを特徴とする気密端子の製造方法。 2 前記加熱工程は、金属外環と端子板付きパイプリー
ドとをガラス封着する工程であつて、前記凹孔に嵌合さ
れるガラスはガラスタブレットである、特許請求の範囲
第1項記載の気密端子の製造方法。 3 前記加熱工程は、前記パイプリードと端子板とをロ
ウ付けする工程である、特許請求の範囲第1項記載の気
密端子の製造方法。 4 前記加熱工程は、金属外環とパイプリードとをガラ
ス封着するとともに、前記パイプリードと端子板とをロ
ウ付けする工程である、特許請求の範囲第1項記載の気
密端子の製造方法。 5 前記補助治具が、スリット状凹孔の幅よりも径大の
丸棒である、特許請求の範囲第1項記載の気密端子の製
造方法。
[Scope of Claims] 1. A jig having a recessed hole into which a metal outer ring and a glass are fitted, a slit-like recessed hole into which a terminal plate is fitted into the bottom of the recessed hole, and a round hole into which a pipe lead is fitted; In the step of fitting a terminal plate and a pipe lead into a slit-shaped recessed hole and a round hole with the terminal plate facing down, and also fitting a metal outer ring and a glass into the recessed hole and heating them, the left and right sides of the pipe lead are heated. A method for manufacturing an airtight terminal, comprising the step of fitting a rod-shaped auxiliary jig in contact with the pipe lead into a cavity formed in the pipe lead to support the lower surface of the glass. 2. The method according to claim 1, wherein the heating step is a step of glass-sealing the metal outer ring and the pipe lead with a terminal plate, and the glass fitted into the recessed hole is a glass tablet. Method of manufacturing airtight terminals. 3. The method of manufacturing an airtight terminal according to claim 1, wherein the heating step is a step of brazing the pipe lead and the terminal plate. 4. The method of manufacturing an airtight terminal according to claim 1, wherein the heating step is a step of glass-sealing the metal outer ring and the pipe lead and brazing the pipe lead and the terminal plate. 5. The method of manufacturing an airtight terminal according to claim 1, wherein the auxiliary jig is a round bar having a diameter larger than the width of the slit-like recessed hole.
JP7429579A 1979-06-12 1979-06-12 Manufacturing method for airtight terminals Expired JPS5937550B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7429579A JPS5937550B2 (en) 1979-06-12 1979-06-12 Manufacturing method for airtight terminals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7429579A JPS5937550B2 (en) 1979-06-12 1979-06-12 Manufacturing method for airtight terminals

Publications (2)

Publication Number Publication Date
JPS55165589A JPS55165589A (en) 1980-12-24
JPS5937550B2 true JPS5937550B2 (en) 1984-09-10

Family

ID=13542998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7429579A Expired JPS5937550B2 (en) 1979-06-12 1979-06-12 Manufacturing method for airtight terminals

Country Status (1)

Country Link
JP (1) JPS5937550B2 (en)

Also Published As

Publication number Publication date
JPS55165589A (en) 1980-12-24

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