JPH0431782B2 - - Google Patents
Info
- Publication number
- JPH0431782B2 JPH0431782B2 JP59023900A JP2390084A JPH0431782B2 JP H0431782 B2 JPH0431782 B2 JP H0431782B2 JP 59023900 A JP59023900 A JP 59023900A JP 2390084 A JP2390084 A JP 2390084A JP H0431782 B2 JPH0431782 B2 JP H0431782B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- brazing material
- silver solder
- silver
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005219 brazing Methods 0.000 claims description 77
- 239000000463 material Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000007791 liquid phase Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000007790 solid phase Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 58
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 238000007789 sealing Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 6
- 230000005496 eutectics Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910002056 binary alloy Inorganic materials 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LWUVWAREOOAHDW-UHFFFAOYSA-N lead silver Chemical compound [Ag].[Pb] LWUVWAREOOAHDW-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
Description
【発明の詳細な説明】
技術分野
この発明はロウ付け方法に関し、より詳しくは
二部材の一方に予備的にロウ材を固着しておいて
からロウ付けする方法に関し、特に気密端子ステ
ムにアースリードをロウ付けする場合に好適す
る。[Detailed Description of the Invention] Technical Field The present invention relates to a brazing method, and more particularly to a method in which a brazing material is preliminarily fixed to one of two members and then brazing. Suitable for brazing.
従来技術
二部材をロウ付けすることは各種分野で行なわ
れている。例えば第１図は水晶発振器用の気密端
子ステムの下面図を示し、第２図は第１図の−
線に沿う断面図を示す。図において、１はステ
ム基板で周縁にキヤツプの位置決め兼固着用のフ
ランジ２を有し、複数個のリード封着用の透孔
３，３，３および底面にアースリード固着用の凹
部４を有する。前記各透孔３，３，３にはガラス
５，５，５を介してリード線６，６，６が気密絶
縁的に封着されており、凹部４にはアースリード
７が銀ロウ８によつて電気的および機械的に接続
固着されている。Prior Art Brazing two parts together is practiced in various fields. For example, FIG. 1 shows a bottom view of a hermetic terminal stem for a crystal oscillator, and FIG.
A cross-sectional view along the line is shown. In the figure, reference numeral 1 denotes a stem substrate, which has a flange 2 on its periphery for positioning and fixing the cap, a plurality of through holes 3, 3, 3 for sealing leads, and a recess 4 on the bottom surface for fixing the ground lead. Lead wires 6, 6, 6 are hermetically and insulatively sealed in each of the through holes 3, 3, 3 through glasses 5, 5, 5, and a ground lead 7 is connected to a silver solder 8 in the recess 4. Therefore, the connection is fixed electrically and mechanically.
上記のような気密端子ステムは、一般に次のよ
うな方法で製造されている。まず、グラフアイト
製の封着治具を用いて、ステム基板１の各透孔
３，３，３にガラスタブレツトおよびリード線
６，６，６を所定の関係位置に組み立て、中性ま
たは弱還元性雰囲気中で950〜1050℃程度で加熱
して、前記ガラスタブレツトを溶融させて、リー
ド線６，６，６をガラス封着する。次いで、グラ
フアイト製のロウ付け治具を用いて、ステム基板
１の凹部４に、第３図に示すように、アースリー
ド７を位置せしめてリング状の銀ロウ８ａを配置
するか、第４図に示すように、棒状の銀ロウ８ｂ
を配置したのち、この銀ロウ８ｂの上にアースリ
ード７を配置して、全体を中性または弱還元性雰
囲気中で約830℃程度に加熱して、前記銀ロウ８
ａまたは８ｂを溶融させて、アースリード７をス
テム基板１にロウ付けする。 The hermetic terminal stem as described above is generally manufactured by the following method. First, using a sealing jig made of graphite, assemble the glass tablet and the lead wires 6, 6, 6 in the respective through holes 3, 3, 3 of the stem substrate 1 at predetermined positions, and attach neutral or weak The glass tablet is melted by heating at about 950 DEG to 1050 DEG C. in a reducing atmosphere, and the lead wires 6, 6, 6 are sealed with glass. Next, using a brazing jig made of graphite, as shown in FIG. As shown in the figure, a rod-shaped silver solder 8b
After arranging the silver solder 8b, the ground lead 7 is placed on top of the silver solder 8b, and the whole is heated to about 830°C in a neutral or weakly reducing atmosphere.
A or 8b is melted and the ground lead 7 is brazed to the stem substrate 1.
ところが、上記の方法では、銀ロウ８ａまたは
８ｂの自動供給が困難で手作業によるため著しく
作業性が悪く、しかも作業ミスによつて同一の凹
部４に複数個の銀ロウを配置したり、銀ロウ忘れ
が生じやすく、前者の場合は溶融した銀ロウが周
辺に流れ広がつて外観不良を生じるし、後者の場
合はロウ付け不能になるといつた問題があつた。 However, with the above method, it is difficult to automatically supply the silver solder 8a or 8b, and the work is performed manually, resulting in extremely poor workability.Moreover, due to a work error, multiple pieces of silver solder may be placed in the same recess 4, or the silver solder may be placed in the same recess 4. It is easy to forget the solder, and in the former case, the molten silver solder flows and spreads to the surrounding area, causing poor appearance, and in the latter case, there is a problem that brazing becomes impossible.
なお、上記の方法ではリード線のガラス封着と
アースリードのロウ付けとを別々に行なう場合に
ついて説明したが、ステム基板１、ガラスタブレ
ツトおよびリード線６，６，６を所定の関係位置
に配置した状態で、凹部４に銀ロウ８ａまたは８
ｂとアースリード７とを配置して約1000℃で加熱
すれば、リード線６，６，６をガラス封着すると
同時に、アースリード７のロウ付け固着を行なう
こともできる。しかし、この場合も前記と同様の
問題点があつた。 Note that in the above method, the glass sealing of the lead wire and the brazing of the ground lead are performed separately. In the arranged state, silver solder 8a or 8 is placed in the recess 4.
By arranging and heating the ground lead 7 at about 1000°C, the lead wires 6, 6, 6 can be sealed with glass and the ground lead 7 can be fixed by brazing at the same time. However, this case also had the same problems as above.
そこで、アースリードの一端に予めロウ材を固
着しておいて、ロウ付けすべき二部材のロウ付け
予定部分に過不足なく必要量のロウ材を供給する
ことも考えられる。しかし、共晶点を有するロウ
材を用いてその融点以上に加熱して予備ロウ付け
をしようとすると、溶融したロウ材がアースリー
ドに沿つて濡れ走り、ロウ付けすべきアースリー
ド先端部に必要量のロウ材が確保できなくなつ
て、確実なロウ付けができないのみならず、不要
部分にまでロウ材が付着して外観不良になつた
り、メツキ不着の問題が生じるという問題点があ
る。 Therefore, it is conceivable to fix brazing material to one end of the ground lead in advance and supplying the necessary amount of brazing material to the parts to be brazed of the two members to be brazed. However, if you try to use a brazing material that has a eutectic point and heat it above its melting point for pre-brazing, the molten brazing material will wet and run along the ground lead, causing the need for the tip of the ground lead to be brazed. There is a problem that not only is it impossible to secure a sufficient amount of brazing material, but also that brazing cannot be performed reliably, and that the brazing material also adheres to unnecessary parts, resulting in poor appearance and non-adherence of plating.
一方、共晶点を有するロウ材を用いてアースリ
ードの端部のみにロウ材を予備的に固着しようと
すれば、予備ロウ付け時に溶融したロウ材の濡れ
走りを防止するための特別な治具を必要とし、組
立作業が煩雑になり、生産性が低くなるという問
題点がある。 On the other hand, if an attempt is made to preliminarily bond the brazing material only to the end of the ground lead using a brazing material that has a eutectic point, a special treatment is required to prevent the melted brazing material from getting wet during preliminary brazing. There are problems in that it requires tools, complicates assembly work, and lowers productivity.
発明の目的
そこで、この発明は、自動組立が可能でしかも
ロウ材の過剰供給や供給なしを生じることなく、
確実に二部材をロウ付けできる方法を提供するこ
とを目的とする。Purpose of the Invention Therefore, the present invention has been devised to enable automatic assembly without causing excessive or no supply of brazing material.
The purpose is to provide a method that can reliably braze two members.
発明の構成
この発明は、ロウ付けすべき二部材の一方に、
固相・液相共存域を有し、ロウ付けされる一方の
部材に予備的に固着された時のロウ材と一方の部
材からなる型が所定の型であり、かつロウ材の量
が上記二部材のロウ付け時において必要十分な量
となる寸法のロウ材を当接して、固相・液相共存
域の温度範囲内であり、かつロウ材の原形を保持
できる温度で加熱することによつてロウ材をその
原形に保持したまま予備的に固着する工程と、
前記一方部材に予備的に固着されたロウ材を他
方部材のロウ付け位置に当接して、ロウ材の融点
以上の温度で加熱することによつて前記両部材を
当接する工程とを含むことを特徴とするものであ
る。Structure of the Invention The present invention provides the following features: one of two members to be brazed;
A mold having a solid phase/liquid phase coexistence region and consisting of the brazing material and one component when preliminarily fixed to one component to be brazed is a predetermined mold, and the amount of the brazing material is above When brazing two parts, the solder metal is brought into contact with the necessary and sufficient amount and heated to a temperature that is within the temperature range of the coexistence of solid and liquid phases and at which the original shape of the solder metal can be maintained. Therefore, the step of preliminarily fixing the brazing material while keeping it in its original shape, and the step of bringing the brazing material preliminarily fixed to the one member into contact with the brazing position of the other member, and heating the brazing material to a temperature higher than the melting point of the brazing material. The method is characterized in that it includes a step of bringing the two members into contact by heating at .
すなわち、上記の方法によれば、一方部材の所
定位置にロウ材をその原形を保持したまま固定で
き、換言すれば、従来のように溶融したロウ材が
必要以上に濡れ走つて一方部材材の必要部分に必
要量のロウ材が確保できなくなるといつた現象が
皆無になつて、一方部材の所定位置に所定量のロ
ウ材を正確に固着することが可能になり、ロウ付
け位置に所定量のロウ材を確実に供給でるること
になり、組立作業が著しく容易になるばかりでな
く、確実にロウ付けできる。 That is, according to the above method, the solder metal can be fixed in a predetermined position on one member while maintaining its original shape. The phenomenon of not being able to secure the required amount of brazing material in the required area has completely disappeared, and it is now possible to accurately fix a predetermined amount of brazing material to a predetermined position on a member, and the predetermined amount of brazing material can be fixed at the brazing position. As a result, not only the assembly work becomes significantly easier, but also brazing can be carried out reliably.
さらに、上記のより改良された方法によれば、
一方部材の幅寸法より大きい幅寸法に設定されて
原形を保持したまま固着されたロウ材と一方部材
の幅寸法の差を利用して、ロウ材の幅寸法と一方
部材の幅寸法との中間方法の開口を有する選別シ
ユートにて一方部材のロウ材の固着された側を吊
下げ状で一定方向に自動的に揃えることが可能と
なり、しかもロウ材が複数個固着されたものやロ
ウ材が固着されていないものを自動的に選別除去
できるので、組立作業が著しく容易になる。 Furthermore, according to the improved method above,
By utilizing the difference between the width of the brazing material, which is set to a width larger than that of the other member and fixed while maintaining its original shape, and the width of the other member, the width of the brazing material is set to be larger than the width of the other member. By using a sorting chute with an opening, it is possible to automatically align the side of one member to which the solder metal is fixed in a hanging manner in a certain direction, and it is also possible to automatically align the side of one member with the solder metal fixed in a certain direction, and also to prevent the parts with multiple pieces of solder metal stuck together or with the solder metal Since unattached items can be automatically sorted and removed, assembly work becomes significantly easier.
実施例
以下に、この発明の実施例について図面を参照
して説明する。Examples Examples of the present invention will be described below with reference to the drawings.
まず、第５図は銀−銅二元合金のwt％による
状態図を示す。従来の銀ロウ８ａまたは８ｂは、
銀72wt％、銅28wt％のいわゆる共晶を用いてい
るのに対し、この発明では固相・液相共存域を有
する図示ａの範囲またはｂの範囲、すなわち銀90
〜80wt％、銅10〜20wt％または銀60〜20wt％、
銅40〜80wt％の組成の銀−銅合金を用いる。 First, FIG. 5 shows a phase diagram according to wt% of a silver-copper binary alloy. The conventional silver solder 8a or 8b is
Whereas a so-called eutectic of 72 wt% silver and 28 wt% copper is used, in this invention, the range a or b in the figure, which has a solid-liquid coexistence region, that is, silver 90
~80wt%, copper 10~20wt% or silver 60~20wt%,
A silver-copper alloy with a composition of 40 to 80 wt% copper is used.
そして、組立治具を用いて、例えばアースリー
ド７の直径Ａよりも大きい長さ寸法Ｂの棒状の銀
ロウ９ａ上にアースリード７を配置し、固相・液
相共存域の温度、例えば約800℃で加熱する。す
ると銀ロウ９ａの一部のみが液相になつて、第６
図に示すように、アースリード７の下端に棒状の
銀ロウ９ａが原形を保持したまゝ溶融固化した銀
ロウ９によつて固着されたＴ字状のアースリー
ド・銀ロウ結合体１０ａが得られる。また、棒状
の銀ロウ９ａのみを、グラフアイト製の治具上等
で液相点以上の温度で加熱溶融して表面張力で球
状の銀ロウ９ｂを形成したのち、前記と同様に球
状の銀ロウ９ｂ上にアースリード７を配置して、
固相・液相共存域の温度で再加熱すると、第７図
に示すように、銀ロウ９ｂが原形を保持したまゝ
溶融固化した銀ロウ９によつて銀ロウ９ｂとアー
スリード７が一体化されたアースリード・銀ロウ
結合体１０ｂが得られる。なお、共晶銀ロウを用
いた場合は、銀ロウ全体が溶融してアースリード
７に沿つて這い上るので、アースリード７と銀ロ
ウとの寸法差がほとんどできない。 Then, using an assembly jig, the ground lead 7 is placed on a bar-shaped silver solder 9a having a length B larger than the diameter A of the ground lead 7, and the temperature in the solid-liquid coexistence region is set to about Heat at 800℃. Then, only a part of the silver solder 9a becomes a liquid phase, and the sixth
As shown in the figure, a T-shaped earth lead/silver solder combination 10a is obtained, in which a bar-shaped silver solder 9a is fixed to the lower end of the earth lead 7 with the melted and solidified silver solder 9 while maintaining its original shape. It will be done. Further, only the rod-shaped silver solder 9a is heated and melted on a graphite jig or the like at a temperature above the liquidus point to form a spherical silver solder 9b by surface tension, and then the spherical silver solder 9b is formed in the same manner as above. Arrange the ground lead 7 on the row 9b,
When reheated at a temperature in the solid-liquid coexistence region, as shown in FIG. 7, the silver solder 9b and the earth lead 7 are integrated by the melted and solidified silver solder 9 while the silver solder 9b retains its original shape. A ground lead/silver solder combination 10b is obtained. Note that when eutectic silver solder is used, the entire silver solder melts and creeps up along the earth lead 7, so there is almost no difference in dimension between the earth lead 7 and the silver solder.
今、第６図のアースリード・銀ロウ結合体１０
ａを用いる場合について説明すると、例えば「シ
ントロン」の商品名で知られる加震装置に、上記
の多数のアースリード・銀ロウ結合体１０ａを収
納し加震すると、アースリード・銀ロウ結合体１
０ａが軸方向に並んで出てくる。そこで、装置の
出口端に、第８図に示すように、その寸法Ｃがア
ースリード７の外径寸法Ａよりも大きく、銀ロウ
９ａの長さ寸法Ｂよりも小さい開口１１を有する
選別シユート１２を設けておけば、図示するよう
に、アースリード７が開口１１を通過し、銀ロウ
９ａは選別シユート１２上に残り、いわゆる吊下
げ状になつて滑走していき、銀ロウ９ａの固着さ
れている側が一定方向に揃えられる。なお、万一
アースリード７に銀ロウ９ａが固着されていない
ものがあると、開口１１を通り抜けて落下するの
で、このようなものは選別除去される。第７図の
アースリード・銀ロウ結合体１０ｂについても同
様にして、銀ロウ９ｂの固着されている側を一定
方向に揃えることができる。 Now, the earth lead/silver solder combination 10 in Figure 6
To explain the case where a is used, for example, when a large number of the above-mentioned earth lead/silver solder combinations 10a are housed in a vibrating device known by the trade name of "Cintron" and vibrated, the earth lead/silver solder combinations 1
0a come out lined up in the axial direction. Therefore, at the exit end of the apparatus, as shown in FIG. 8, a sorting chute 12 is provided which has an opening 11 whose dimension C is larger than the outer diameter dimension A of the earth lead 7 and smaller than the length dimension B of the silver solder 9a. As shown in the figure, the ground lead 7 passes through the opening 11, the silver solder 9a remains on the sorting chute 12, and slides in a so-called hanging shape, and the silver solder 9a is fixed. The side that is facing is aligned in a certain direction. Incidentally, if there is any earth lead 7 to which the silver solder 9a is not fixed, it will pass through the opening 11 and fall, so such a piece will be sorted out and removed. Similarly, for the earth lead/silver solder combination 10b shown in FIG. 7, the side to which the silver solder 9b is fixed can be aligned in a certain direction.
上記のようにして銀ロウ９ａが一定方向に揃え
られたアースリード・銀ロウ結合体１０ａを、選
別シユート１２から１個ずつ切り出してビニルチ
ユーブ等のシユートを介して上部封着治具の孔に
順次挿入していく。一方、下部封着治具の所定位
置にステム基板１、ガラスタブレツトおよびリー
ド線６，６，６を組立てておき、この下部封着治
具に上記アースリード・銀ロウ結合体１０ａを挿
入した上部封着治具を被せ、第９図に示すよう
に、ステム基板１の凹部４に銀ロウ９ａを位置せ
しめる。この状態で全体を中性または弱還元性雰
囲気中において950〜1000℃程度で加熱する。す
ると、ガラスタブレツトが溶融してステム基板１
の各透孔３，３，３にガラス５，５，５を介して
リード線６，６，６が気密かつ絶縁して封着され
るとともに、銀ロウ９ａが溶融してアースリード
７が凹部４にロウ付けされる。 The earth lead/silver solder combinations 10a with the silver solder 9a aligned in a certain direction as described above are cut out one by one from the sorting chute 12 and inserted into the hole of the upper sealing jig through a chute such as a vinyl tube. Insert them one by one. On the other hand, the stem substrate 1, the glass tablet, and the lead wires 6, 6, 6 were assembled at predetermined positions in the lower sealing jig, and the earth lead/silver solder combination 10a was inserted into this lower sealing jig. An upper sealing jig is placed on the upper sealing jig, and the silver solder 9a is placed in the recess 4 of the stem substrate 1, as shown in FIG. In this state, the whole is heated at about 950 to 1000°C in a neutral or weakly reducing atmosphere. Then, the glass tablet melts and the stem substrate 1
The lead wires 6, 6, 6 are hermetically and insulatedly sealed in the respective through holes 3, 3, 3 through the glasses 5, 5, 5, and the silver solder 9a is melted and the ground lead 7 is inserted into the recessed part. 4 is brazed.
上記の方法によれば、銀ロウ９ａをアースリー
ド７に固着した状態で自動供給できるため、組立
作業が著しく容易になる。しかも、手作業の場合
のように同一の凹部４に複数個の銀ロウ９ａを供
給したり、銀ロウ９ａの供給忘れといつたことが
皆無になり、過剰の銀ロウの流れ広がりによる外
観不良や、ロウ付け不能といつた不良をなくすこ
とができる。 According to the above method, the silver solder 9a can be automatically supplied in a state that it is fixed to the earth lead 7, so that the assembly work is considerably facilitated. Moreover, there is no need to supply multiple pieces of silver solder 9a to the same concave portion 4 or forget to supply silver solder 9a, unlike in the case of manual work, and the appearance is poor due to the flow and spread of excess silver solder. It is possible to eliminate defects such as failure and inability to braze.
なお、上記実施例は、第６図のアースリード
銀・銀ロウ結合体１０ａを用いる場合について説
明したが、第７図のアースリード・銀ロウ結合体
１０ｂを用いる場合も全く同様に行なえる。 In the above embodiment, the case where the earth lead silver/silver solder combination 10a of FIG. 6 is used is described, but it can be carried out in exactly the same way when the earth lead/silver solder combination 10b of FIG. 7 is used.
また、上記実施例は、第１図に示す気密端子ス
テムにおけるステム基板１とアースリード７とを
ロウ付けする場合について説明したが、他の任意
の二部材のロウ付けに実施できるものである。 Furthermore, although the above embodiment has been described in connection with the brazing of the stem substrate 1 and the ground lead 7 in the hermetic terminal stem shown in FIG. 1, the present invention can be implemented in brazing any two other members.
さらに、上記実施例では固相・液相共存域を有
するロウ材として、銀−銅二元合金について説明
したが、銀−銅合金にZn，Cd，Pd等を添加した
多元合金であつてもよいし、銀−銅系以外の合金
よりなるものであつてもよい。 Furthermore, in the above example, a silver-copper binary alloy was explained as a brazing material having a solid phase/liquid phase coexistence region, but a multi-component alloy made by adding Zn, Cd, Pd, etc. to a silver-copper alloy may also be used. Alternatively, it may be made of an alloy other than silver-copper.
発明の効果
この発明は以上のように、ロウ付けすべき二部
材の一方に、固相・液相共存域を有し好ましくは
一方部材より幅寸法の大きいロウ材をその原形を
保持したまま予備的に固着する工程と、前記一方
部材に予備的に固着されたロウ材を他方部材のロ
ウ付け位置に当接して、ロウ材の融点以上の温度
で加熱する工程とを含むものであるから、一方部
材へのロウ材の予備的固着工程において、共晶点
を有するロウ材を用いる場合のような溶融したロ
ウ材の濡れ走りがなく、したがつて、溶融したロ
ウ材の濡れ走りを防止するための特別な治具を何
ら用いることなく、一方部材の所定部分に容易に
必要量のロウ材を予備的に固着することができ
る。また、一方部材の所定部分に必要量のロウ材
が予備的に固着されているので、煩雑なロウ材の
供給を自動化でき、組立作業が著しく容易になる
のみならず、ロウ材の複数個供給や供給忘れとい
つたこともなくなり、過剰のロウ材の流れ広がり
による外観不良やロウ材なしによるロウ付け不能
といつた不良を皆無にすることができる。Effects of the Invention As described above, the present invention prepares one of two members to be brazed with a brazing material having a solid phase/liquid phase coexistence region and preferably having a width larger than that of the other member while maintaining its original shape. and a step of bringing the brazing material preliminarily fixed to the one member into contact with the brazing position of the other member and heating it at a temperature equal to or higher than the melting point of the brazing material. In the preliminary fixing step of the brazing filler metal, there is no wetting and running of the molten brazing filler metal unlike when using a brazing filler metal having a eutectic point. A required amount of brazing material can be easily preliminarily fixed to a predetermined portion of one member without using any special jig. In addition, since the necessary amount of brazing material is preliminarily fixed to a predetermined portion of one member, the complicated supply of brazing material can be automated, which not only greatly simplifies assembly work, but also allows the supply of multiple pieces of brazing material. There is no need to worry about forgetting to supply the solder, and it is possible to completely eliminate defects such as poor appearance due to excessive brazing material flowing and spreading, and failure to braze due to lack of brazing material.
第１図は二部材のロウ付け構体の一例として示
す気密端子ステムの下面図で、第２図は第１図の
−線に沿う断面図である。第３図および第４
図は上記気密端子ステムにおけるステム基板とア
ースリードとの従来のロウ付け方法について説明
するための組立状態の要部拡大断面図である。第
５図はこの発明に用いるロウ材について説明する
ための銀−銅二元合金の状態図である。第６図お
よび第７図はこの発明に用いる異なる実施例のア
ースリード・銀ロウ結合体の側面図である。第８
図はこの発明における銀ロウの固着された側を自
動的に一定方向に揃える場合の要部拡大断面図で
ある。第９図はこの発明におけるロウ付け前の組
立状態の要部拡大断面図である。
１……他方部材（ステム基板）、７……一方部
材（アースリード）、９，９ａ，９ｂ……銀ロウ、
１０ａ，１０ｂ……アースリード・銀ロウ結合
体、１１……開口、１２……選別シユート。
FIG. 1 is a bottom view of a hermetic terminal stem as an example of a two-member brazing structure, and FIG. 2 is a sectional view taken along the line - in FIG. 1. Figures 3 and 4
The figure is an enlarged sectional view of a main part of the airtight terminal stem in an assembled state for explaining a conventional method of brazing the stem substrate and the ground lead. FIG. 5 is a state diagram of a silver-copper binary alloy for explaining the brazing material used in the present invention. 6 and 7 are side views of earth lead/silver solder combinations of different embodiments used in the present invention. 8th
The figure is an enlarged sectional view of a main part in the case where the side to which the silver solder is fixed is automatically aligned in a certain direction according to the present invention. FIG. 9 is an enlarged sectional view of the main parts of the present invention in an assembled state before brazing. 1... Other member (stem board), 7... One member (earth lead), 9, 9a, 9b... Silver solder,
10a, 10b...Earth lead/silver solder combination, 11...Opening, 12...Selecting chute.
Claims (1)
共存域を有し、ロウ付けされる一方の部材に予備
的に固着された時のロウ材と一方の部材からなる
型が所定の型であり、かつロウ材の量が上記二部
材のロウ付け時において必要十分な量となる寸法
のロウ材を当接して、固相・液相共存域の温度範
囲内であり、かつロウ材の原形を保持できる温度
で加熱することによつてロウ材をその原形に保持
したまま予備的に固着する工程と、 前記一方部材に予備的に固着されたロウ材を他
方部材のロウ付け位置に当接して、ロウ材の融点
以上の温度で加熱することによつて前記両部材を
当接する工程とを含むことを特徴とするロウ付け
方法。 ２ 前記ロウ材の固着両側の幅寸法を一方部材の
固着部の幅寸法よりも大きく設定して固着し、前
記ロウ材の幅寸法と一方部材の幅寸法との中間寸
法の開口を有する選択シユートに供給してロウ材
の固着された側を上方にして吊下げ状で一方方向
に揃えた後、該ロウ材を他方部材のロウ付け位置
に当接して、前記両部材を接合する工程を含む、
特許請求の範囲第１項記載のロウ付け方法。 ３ 前記ロウ材が、銀80〜90wt％、銅20〜10wt
％の組成を有する、特許請求の範囲第１項または
第２項記載のロウ付け方法。 ４ 前記ロウ材が、銀20〜60wt％、銅80〜40wt
％の組成を有する、特許請求の範囲第１項または
第２項記載のロウ付け方法。[Scope of Claims] 1 One of the two members to be brazed has a solid phase/liquid phase coexistence region, and the brazing material and the other member are preliminarily fixed to the one member to be brazed. The mold consisting of is a predetermined mold, and the amount of brazing material is a necessary and sufficient amount when brazing the above two components, and the temperature is within the solid-liquid coexistence region. and a step of preliminarily fixing the brazing material while holding it in its original shape by heating at a temperature that allows the brazing material to maintain its original shape; A brazing method comprising the step of abutting the two members at a brazing position of the members and heating them at a temperature equal to or higher than the melting point of the brazing material. 2. A selection chute in which the brazing material is fixed by setting the width on both sides to be larger than the width of the fixed portion of one member, and having an opening having an intermediate dimension between the width of the brazing material and the width of the one member. The method includes the step of supplying the brazing material to the brazing material and arranging it in one direction in a hanging manner with the side to which the brazing material is fixed upward, and then bringing the brazing material into contact with the brazing position of the other member to join the two members. ,
A brazing method according to claim 1. 3 The brazing material contains 80 to 90 wt% silver and 20 to 10 wt% copper.
The brazing method according to claim 1 or 2, having a composition of %. 4 The brazing material contains 20 to 60 wt% silver and 80 to 40 wt% copper.
The brazing method according to claim 1 or 2, having a composition of %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2390084A JPS60166163A (en) | 1984-02-09 | 1984-02-09 | Brazing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2390084A JPS60166163A (en) | 1984-02-09 | 1984-02-09 | Brazing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60166163A JPS60166163A (en) | 1985-08-29 |
| JPH0431782B2 true JPH0431782B2 (en) | 1992-05-27 |
Family
ID=12123335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2390084A Granted JPS60166163A (en) | 1984-02-09 | 1984-02-09 | Brazing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60166163A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0821665B2 (en) * | 1986-11-27 | 1996-03-04 | 京セラ株式会社 | Lead pin and manufacturing method thereof |
| JPS63157457A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| JPS63157459A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Manufacture of lead pin |
| JPS63157455A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| JPS63157456A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin and manufacture thereof |
| JPS63157458A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| US5280414A (en) * | 1990-06-11 | 1994-01-18 | International Business Machines Corp. | Au-Sn transient liquid bonding in high performance laminates |
| JP2000182818A (en) * | 1998-12-11 | 2000-06-30 | Sumitomo Heavy Ind Ltd | Connecting structure and connecting method of oxide superconducting current lead and mesh wire current lead |
| US6343647B2 (en) * | 2000-01-11 | 2002-02-05 | Thermax International, Ll.C. | Thermal joint and method of use |
| FR2893191B1 (en) * | 2005-11-09 | 2008-02-01 | Ncs Pyrotechnie & Tech | GLASS-METAL TRAVERSEE, ITS MANUFACTURING METHOD AND ELECTRO-PYROTECHNIC INITIATOR. |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59105347A (en) * | 1982-12-08 | 1984-06-18 | Tanaka Kikinzoku Kogyo Kk | Manufacture of silver brazed pin |
-
1984
- 1984-02-09 JP JP2390084A patent/JPS60166163A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59105347A (en) * | 1982-12-08 | 1984-06-18 | Tanaka Kikinzoku Kogyo Kk | Manufacture of silver brazed pin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60166163A (en) | 1985-08-29 |
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