JPS6031247A - アルミニウム合金パッケ−ジの製法 - Google Patents

アルミニウム合金パッケ−ジの製法

Info

Publication number
JPS6031247A
JPS6031247A JP58139492A JP13949283A JPS6031247A JP S6031247 A JPS6031247 A JP S6031247A JP 58139492 A JP58139492 A JP 58139492A JP 13949283 A JP13949283 A JP 13949283A JP S6031247 A JPS6031247 A JP S6031247A
Authority
JP
Japan
Prior art keywords
brazing material
cover
case
aluminum
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58139492A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0133943B2 (enrdf_load_stackoverflow
Inventor
Tsutomu Iikawa
勤 飯川
Katsuhide Natori
名取　勝英
Isao Kawamura
勲 川村
Takeaki Sakai
酒井　武明
Takeshi Nagai
武 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58139492A priority Critical patent/JPS6031247A/ja
Priority to EP83307418A priority patent/EP0117352A1/en
Publication of JPS6031247A publication Critical patent/JPS6031247A/ja
Priority to US07/012,156 priority patent/US4760240A/en
Publication of JPH0133943B2 publication Critical patent/JPH0133943B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP58139492A 1983-02-24 1983-08-01 アルミニウム合金パッケ−ジの製法 Granted JPS6031247A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58139492A JPS6031247A (ja) 1983-08-01 1983-08-01 アルミニウム合金パッケ−ジの製法
EP83307418A EP0117352A1 (en) 1983-02-24 1983-12-06 A process for welding aluminium-based elements and a welded assembly
US07/012,156 US4760240A (en) 1983-02-24 1987-02-09 Process for laser welding of aluminum based elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58139492A JPS6031247A (ja) 1983-08-01 1983-08-01 アルミニウム合金パッケ−ジの製法

Publications (2)

Publication Number Publication Date
JPS6031247A true JPS6031247A (ja) 1985-02-18
JPH0133943B2 JPH0133943B2 (enrdf_load_stackoverflow) 1989-07-17

Family

ID=15246520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58139492A Granted JPS6031247A (ja) 1983-02-24 1983-08-01 アルミニウム合金パッケ−ジの製法

Country Status (1)

Country Link
JP (1) JPS6031247A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132776A (en) * 1988-10-28 1992-07-21 Sumitomo Electric Industries, Ltd. Member for carrying a semiconductor device
US5519184A (en) * 1994-05-20 1996-05-21 Litton Systems, Inc. Reusable laser welded hermetic enclosure and method
JP2010014554A (ja) * 2008-07-03 2010-01-21 Toyota Motor Corp 溶接溶け込み深さ評価方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161052A (ja) * 1983-02-24 1984-09-11 Fujitsu Ltd アルミ合金パツケ−ジの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161052A (ja) * 1983-02-24 1984-09-11 Fujitsu Ltd アルミ合金パツケ−ジの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132776A (en) * 1988-10-28 1992-07-21 Sumitomo Electric Industries, Ltd. Member for carrying a semiconductor device
US5519184A (en) * 1994-05-20 1996-05-21 Litton Systems, Inc. Reusable laser welded hermetic enclosure and method
JP2010014554A (ja) * 2008-07-03 2010-01-21 Toyota Motor Corp 溶接溶け込み深さ評価方法

Also Published As

Publication number Publication date
JPH0133943B2 (enrdf_load_stackoverflow) 1989-07-17

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