JPS6325502B2 - - Google Patents

Info

Publication number
JPS6325502B2
JPS6325502B2 JP57106150A JP10615082A JPS6325502B2 JP S6325502 B2 JPS6325502 B2 JP S6325502B2 JP 57106150 A JP57106150 A JP 57106150A JP 10615082 A JP10615082 A JP 10615082A JP S6325502 B2 JPS6325502 B2 JP S6325502B2
Authority
JP
Japan
Prior art keywords
aluminum
package
case
alloy
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57106150A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58223350A (ja
Inventor
Tsutomu Iikawa
Takeaki Sakai
Katsuhide Natori
Isao Kawamura
Takeshi Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57106150A priority Critical patent/JPS58223350A/ja
Publication of JPS58223350A publication Critical patent/JPS58223350A/ja
Publication of JPS6325502B2 publication Critical patent/JPS6325502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
JP57106150A 1982-06-22 1982-06-22 アルミニウムパツケ−ジ Granted JPS58223350A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57106150A JPS58223350A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57106150A JPS58223350A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS58223350A JPS58223350A (ja) 1983-12-24
JPS6325502B2 true JPS6325502B2 (enrdf_load_stackoverflow) 1988-05-25

Family

ID=14426304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57106150A Granted JPS58223350A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS58223350A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519184A (en) * 1994-05-20 1996-05-21 Litton Systems, Inc. Reusable laser welded hermetic enclosure and method
JPH10230379A (ja) * 1997-02-20 1998-09-02 Kobe Steel Ltd アルミニウム合金製容器の製造方法
JP4846282B2 (ja) * 2005-06-29 2011-12-28 ミヤチテクノス株式会社 電子部品パッケージ封止方法及び装置
JP5259152B2 (ja) * 2007-09-28 2013-08-07 株式会社東芝 電池セル、バッテリパックおよび電池セル製造方法
DE102013002628B4 (de) * 2013-02-18 2014-09-04 Tesat-Spacecom Gmbh & Co.Kg Gehäuse und Verfahren zum Verbinden zweier Gehäuseteile

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147135A (ja) * 1982-02-26 1983-09-01 Fujitsu Ltd アルミ合金パツケ−ジ

Also Published As

Publication number Publication date
JPS58223350A (ja) 1983-12-24

Similar Documents

Publication Publication Date Title
US8020749B2 (en) Dissimilar metal joining method
US4760240A (en) Process for laser welding of aluminum based elements
WO2012029789A1 (ja) アルミニウム系金属の接合方法
HUE034600T2 (hu) Anyagzáró kötés alumínium és réz között, továbbá eljárás ennek létrehozására
WO2019026614A1 (ja) 異種金属の接合方法およびレーザ溶接装置
JPS6325502B2 (enrdf_load_stackoverflow)
CN114823364B (zh) 一种气密封装方法
Harati et al. Laser welding of aluminum battery tab to variable Al/Cu busbars in Li-ion battery joint
US11173570B2 (en) Metal-joining structure and method for manufacturing metal-joining structure
WO2003095141A2 (fr) Procede de soudage hybride laser-arc en multi-epaisseurs avec attaque sur chants
JPH0344876B2 (enrdf_load_stackoverflow)
JPS6325501B2 (enrdf_load_stackoverflow)
JPH02247094A (ja) アルミニウムパッケージの製法
JPS6031247A (ja) アルミニウム合金パッケ−ジの製法
JPS613694A (ja) アルミニウムパツケ−ジの製法
JPH0929424A (ja) 真空チャンバの接合方法
JP7552290B2 (ja) 接合部材及びその製造方法
JPH0132658B2 (enrdf_load_stackoverflow)
JPH03243276A (ja) アルミ合金の溶接方法
Mai et al. Laser vacuum welding of aluminium, kovar and Ni-Fe alloys for hermetic incapsulation of electronic components
WO2025052805A1 (ja) 接合体及び接合方法
Iikawa et al. Aluminum alloy package for microwave amplifier
JP3248842B2 (ja) 電子部品用パッケージの製造方法
JPH0480986B2 (enrdf_load_stackoverflow)
JP2006116600A (ja) 異材接合方法