JPS6325501B2 - - Google Patents

Info

Publication number
JPS6325501B2
JPS6325501B2 JP57106149A JP10614982A JPS6325501B2 JP S6325501 B2 JPS6325501 B2 JP S6325501B2 JP 57106149 A JP57106149 A JP 57106149A JP 10614982 A JP10614982 A JP 10614982A JP S6325501 B2 JPS6325501 B2 JP S6325501B2
Authority
JP
Japan
Prior art keywords
aluminum
package
case
casting
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57106149A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58223349A (ja
Inventor
Tsutomu Iikawa
Takeaki Sakai
Katsuhide Natori
Isao Kawamura
Takeshi Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57106149A priority Critical patent/JPS58223349A/ja
Publication of JPS58223349A publication Critical patent/JPS58223349A/ja
Publication of JPS6325501B2 publication Critical patent/JPS6325501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Semiconductor Lasers (AREA)
JP57106149A 1982-06-22 1982-06-22 アルミニウムパツケ−ジ Granted JPS58223349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57106149A JPS58223349A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57106149A JPS58223349A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS58223349A JPS58223349A (ja) 1983-12-24
JPS6325501B2 true JPS6325501B2 (enrdf_load_stackoverflow) 1988-05-25

Family

ID=14426284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57106149A Granted JPS58223349A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS58223349A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519184A (en) * 1994-05-20 1996-05-21 Litton Systems, Inc. Reusable laser welded hermetic enclosure and method
WO2008060012A1 (en) 2006-11-13 2008-05-22 Kmw Inc. Radio frequency filter
JP7086773B2 (ja) * 2018-07-25 2022-06-20 株式会社東芝 溶接方法、溶接物の製造方法、及び溶接物
CN111014955B (zh) * 2019-12-26 2021-08-17 中国科学院电子学研究所 一种适用于硅铝合金盒体气密性激光封焊的方法

Also Published As

Publication number Publication date
JPS58223349A (ja) 1983-12-24

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