JPS58223350A - アルミニウムパツケ−ジ - Google Patents

アルミニウムパツケ−ジ

Info

Publication number
JPS58223350A
JPS58223350A JP57106150A JP10615082A JPS58223350A JP S58223350 A JPS58223350 A JP S58223350A JP 57106150 A JP57106150 A JP 57106150A JP 10615082 A JP10615082 A JP 10615082A JP S58223350 A JPS58223350 A JP S58223350A
Authority
JP
Japan
Prior art keywords
layer
case
aluminum
cover
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57106150A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325502B2 (enrdf_load_stackoverflow
Inventor
Tsutomu Iikawa
勤 飯川
Takeaki Sakai
酒井　武明
Katsuhide Natori
名取　勝英
Isao Kawamura
勲 川村
Takeshi Nagai
武 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57106150A priority Critical patent/JPS58223350A/ja
Publication of JPS58223350A publication Critical patent/JPS58223350A/ja
Publication of JPS6325502B2 publication Critical patent/JPS6325502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
JP57106150A 1982-06-22 1982-06-22 アルミニウムパツケ−ジ Granted JPS58223350A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57106150A JPS58223350A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57106150A JPS58223350A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS58223350A true JPS58223350A (ja) 1983-12-24
JPS6325502B2 JPS6325502B2 (enrdf_load_stackoverflow) 1988-05-25

Family

ID=14426304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57106150A Granted JPS58223350A (ja) 1982-06-22 1982-06-22 アルミニウムパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS58223350A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519184A (en) * 1994-05-20 1996-05-21 Litton Systems, Inc. Reusable laser welded hermetic enclosure and method
JPH10230379A (ja) * 1997-02-20 1998-09-02 Kobe Steel Ltd アルミニウム合金製容器の製造方法
JP2007012752A (ja) * 2005-06-29 2007-01-18 Miyachi Technos Corp 電子部品パッケージ封止方法及び装置
JP2009087707A (ja) * 2007-09-28 2009-04-23 Toshiba Corp セル端子構造、セル端子間接続構造およびセル端子製造方法。
US20140231060A1 (en) * 2013-02-18 2014-08-21 Tesat-Spacecom Gmbh & Co. Kg Method for closing a housing by means of an optical joining method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147135A (ja) * 1982-02-26 1983-09-01 Fujitsu Ltd アルミ合金パツケ−ジ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147135A (ja) * 1982-02-26 1983-09-01 Fujitsu Ltd アルミ合金パツケ−ジ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519184A (en) * 1994-05-20 1996-05-21 Litton Systems, Inc. Reusable laser welded hermetic enclosure and method
JPH10230379A (ja) * 1997-02-20 1998-09-02 Kobe Steel Ltd アルミニウム合金製容器の製造方法
JP2007012752A (ja) * 2005-06-29 2007-01-18 Miyachi Technos Corp 電子部品パッケージ封止方法及び装置
JP2009087707A (ja) * 2007-09-28 2009-04-23 Toshiba Corp セル端子構造、セル端子間接続構造およびセル端子製造方法。
US20140231060A1 (en) * 2013-02-18 2014-08-21 Tesat-Spacecom Gmbh & Co. Kg Method for closing a housing by means of an optical joining method
US9089917B2 (en) * 2013-02-18 2015-07-28 Tesat-Spacecom Gmbh & Co. Kg Method for closing a housing by means of an optical joining method

Also Published As

Publication number Publication date
JPS6325502B2 (enrdf_load_stackoverflow) 1988-05-25

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