JPS6027164B2 - Laser trimming method - Google Patents
Laser trimming methodInfo
- Publication number
- JPS6027164B2 JPS6027164B2 JP50037993A JP3799375A JPS6027164B2 JP S6027164 B2 JPS6027164 B2 JP S6027164B2 JP 50037993 A JP50037993 A JP 50037993A JP 3799375 A JP3799375 A JP 3799375A JP S6027164 B2 JPS6027164 B2 JP S6027164B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- resistance value
- laser
- trimming
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Laser Beam Processing (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
本発明はしーザ光を用いて抵抗体の抵抗値を調整するレ
ーザトリミング方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser trimming method for adjusting the resistance value of a resistor using laser light.
従来レーザトリミングによる抵抗体の抵抗値調整は抵抗
体の一部分をレーザ照射によって除去し、抵抗体に溝を
入れたりある部分の抵抗体を切り離すことによって、抵
抗体全体の抵抗値の増加をはかり、該抵抗体の抵抗値を
所定の抵抗値に一致させるような調整手段をとって来た
。Conventionally, adjusting the resistance value of a resistor by laser trimming involves removing a portion of the resistor by laser irradiation, creating a groove in the resistor, or cutting off a certain portion of the resistor to increase the resistance value of the entire resistor. Adjustment means have been used to match the resistance value of the resistor to a predetermined resistance value.
このためしーザ光は一段に高ェネルギピーク値が得やす
くて加工がしやすいパルスが使われている。この方法で
トリミング精度を上げるには、抵抗体パターンの件は別
にして、1つのパルスで除去する抵抗体部分を少なくす
る。For this reason, pulsed laser light is used that provides a higher energy peak value and is easier to process. In order to improve trimming accuracy with this method, apart from the resistor pattern, the number of resistor parts to be removed with one pulse is reduced.
言い換えれば1つのパルスで変化する抵抗値を小さくす
ることである。しかしトリミング精度として約0.05
%以下を要求されると抵抗体除去による抵抗値増分のほ
かに時間遅れを伴った抵抗体の材質変化に基づく抵抗値
増分が問題となってくる。すなわちレーザトリミングの
過程において抵抗体の抵抗値が所定の抵抗値の−0.0
1%以内に入った瞬間にレーザをオフにしても、続いて
抵抗体の材質変化に基づく抵抗値の増加が生じて、最終
的にはトリミングした抵抗体の抵抗値をトリミング精度
0.05%に入れることは難かしい。従来のレーザトリ
ミングではしーザ光によって照射された抵抗体の材質変
化による時間遅れをともなった抵抗値変化は考慮されて
し、なかつた。本発明の目的は上記した従来のレーザト
リミングにおいて考慮されていなかったレーザ光照射に
よる抵抗体の材質変化に基づく抵抗値増加現象に着眼し
、本現象を利用することによって高精度のレーザトリミ
ングを行なおうとするものである。In other words, the purpose is to reduce the resistance value that changes with one pulse. However, the trimming accuracy is about 0.05
% or less, in addition to the increase in resistance due to the removal of the resistor, the increase in resistance due to a change in the material of the resistor with a time delay becomes a problem. In other words, during the laser trimming process, the resistance value of the resistor becomes -0.0 of the predetermined resistance value.
Even if you turn off the laser as soon as it falls within 1%, the resistance value will continue to increase due to changes in the material of the resistor, and eventually the resistance value of the trimmed resistor will be reduced to a trimming accuracy of 0.05%. It is difficult to put it in. Conventional laser trimming does not take into account changes in resistance value that are accompanied by time delays due to changes in the material of the resistor irradiated with laser light. The purpose of the present invention is to focus on the phenomenon of increase in resistance value due to material change of the resistor due to laser beam irradiation, which was not considered in the conventional laser trimming described above, and to perform highly accurate laser trimming by utilizing this phenomenon. This is what we are trying to do.
従来のレーザトリミングではしーザ光を照射した抵抗体
部分は高温度に加熱され、レーザ光オフとなった直後の
抵抗体材質変化に基づく抵抗値変化も短時間に急激にお
こり、トリミング精度が落ちる。本発明ではしーザ光を
抵抗体を除去するのではなく、レーザ光を弱め抵抗体を
低温度に加熱して抵抗体材質の酸化を主体としたイヒ学
変化をゆるやかに促がして高精度のレーザトリミングを
行なおうとするものである。レーザ光は抵抗体のある一
点を集中して照射してもまたある一定領域を走査して照
射してもよい。レーザ光はパルス状または連続波(以下
CW)でも良いが本発明の主旨にそった高精度のトリミ
ングを行なうにはCWが適する。In conventional laser trimming, the part of the resistor that is irradiated with the laser beam is heated to a high temperature, and the resistance value changes rapidly due to changes in the resistor material immediately after the laser beam is turned off, resulting in poor trimming accuracy. drop down. In the present invention, instead of using laser light to remove the resistor, the laser light is weakened and the resistor is heated to a low temperature to gently promote chemical changes, mainly oxidation of the resistor material. This is an attempt to perform accurate laser trimming. The laser beam may be focused on one point on the resistor or may be scanned over a certain area. The laser beam may be pulsed or continuous wave (hereinafter referred to as CW), but CW is suitable for performing highly accurate trimming in accordance with the gist of the present invention.
レーザ光のェネルギピーク値は抵抗体のパターン、材質
、トリミング抵抗値、トリミング精度、トリミング時間
等により一定ではないが一般にェネルギピーク値を増せ
ば抵抗体の単位時間当りの抵抗値変化は大きくなり、短
時間に大きな抵抗値変化のトリミングを行なうことがで
きるがトリミング精度は落ちる。第1図に本発明による
レーザトリミングシステムの概略を示す。The energy peak value of the laser beam is not constant depending on the resistor pattern, material, trimming resistance value, trimming accuracy, trimming time, etc., but in general, as the energy peak value increases, the resistance value change per unit time of the resistor increases, and the resistance value changes over a short period of time. It is possible to perform trimming for large resistance value changes, but the trimming accuracy decreases. FIG. 1 schematically shows a laser trimming system according to the present invention.
1はしーザ発振器であり、これより発振されたレーザ光
2はミラー3によって下方に向けられ「 レンズ4によ
って抵抗体5の上に焦点を結ぶ。Reference numeral 1 designates a laser oscillator, and a laser beam 2 oscillated from this is directed downward by a mirror 3 and focused onto a resistor 5 by a lens 4.
抵抗体5の抵抗値は2本のブo‐プ6によって検出され
、その信号は制御回路101こ入る。制御回路1川まし
ーザ発振器1とテーブル制御回路11と相互に関連をも
つ。The resistance value of the resistor 5 is detected by two loops 6, and the signals thereof are input to the control circuit 101. The control circuit 1 is interrelated with the laser oscillator 1 and the table control circuit 11.
テーブル制御回路11はモータ8を介してテーブル7を
駆動する。抵抗体5はテーブル7に固定され共に動く、
9はテーブル7とモータ8をのせている定盤である。今
、抵抗体5をテーブル7に固定し抵抗体5にプローブ6
を接触させ、レーザ発振器4からのレーザ光2をレンズ
4で抵抗体5のトリミング部分に集光し、その抵抗値を
制御回路10で測定しながらテーブル7を駆動する(こ
の場合かならずしもテーブル7を駆動する必要はない)
。抵抗体5の抵抗値が所定の抵抗値に一致したならば制
御回路10よりレーザ発振器1へ信号を送りレーザ光2
を止めると同時に制御回路11を通してテーブル7の送
りを止める。第2図は第1図で示した抵抗体5の一例で
ある。The table control circuit 11 drives the table 7 via the motor 8. The resistor 5 is fixed to the table 7 and moves together.
9 is a surface plate on which the table 7 and the motor 8 are placed. Now, fix the resistor 5 on the table 7 and connect the probe 6 to the resistor 5.
The laser beam 2 from the laser oscillator 4 is focused on the trimmed part of the resistor 5 by the lens 4, and the table 7 is driven while the resistance value is measured by the control circuit 10 (in this case, the table 7 must be (No need to drive)
. When the resistance value of the resistor 5 matches a predetermined resistance value, a signal is sent from the control circuit 10 to the laser oscillator 1 and the laser beam 2 is output.
At the same time, the feeding of the table 7 is stopped through the control circuit 11. FIG. 2 shows an example of the resistor 5 shown in FIG.
5川ま抵抗基板、52は電極、53は抵抗体、54a,
54bはしーザ光のスポットを示す。5 resistance board, 52 electrode, 53 resistor, 54a,
54b indicates a laser light spot.
第1図で示したブローブ6は第2図の電極52に後触さ
れるものである。レーザスポツト54a,54bは54
aの一点に固定していてもよいし「また第2図で示すよ
うに54aから54bの間を走査してもかまわない。以
上の如きレザ−トリミングシステムによりTan2(チ
ッ化タンタル)を用いた薄膜抵抗体(幅50〃)を平均
出力数mWのCWレーザ光で照射したところ、トリミン
グ精度として0.05%以下に制御できることが確認さ
れた。The probe 6 shown in FIG. 1 is followed by the electrode 52 of FIG. The laser spots 54a and 54b are 54
It may be fixed at one point a, or it may be scanned between 54a and 54b as shown in FIG. When a thin film resistor (width 50 mm) was irradiated with a CW laser beam with an average output of several mW, it was confirmed that the trimming accuracy could be controlled to 0.05% or less.
レーザ光で抵抗体を除去して抵抗値調整を行なう従来の
レーザトリミングでは0.05%以下のトリミング精度
を出すことはむずかしい。In conventional laser trimming, which adjusts the resistance value by removing the resistor with laser light, it is difficult to achieve trimming accuracy of 0.05% or less.
それは抵抗体を除去するために強力なしーザ光を使用す
るため、抵抗体材質の化学変化がトリミング終了直後に
現われ、この結果抵抗体抵抗値の増加が生じるためであ
る。本発明では上述のようにレーザ光の強さと照射時間
をコントロールすることにより抵抗体材質の化学変化を
制御し「 この化学変化に基づく抵抗値変化を利用して
トリミング精度を向上させたものであり、{110.0
5%以下のトリミング精度が得られること‘2M・出力
のレーザ発振器で十分であること‘3’従来のレーザト
リミング袋贋が流用できること等の利点がある。This is because a strong laser beam is used to remove the resistor, and a chemical change in the resistor material appears immediately after trimming, resulting in an increase in the resistance value of the resistor. In the present invention, as described above, the chemical change in the resistor material is controlled by controlling the intensity and irradiation time of the laser beam, and the trimming accuracy is improved by utilizing the change in resistance value based on this chemical change. , {110.0
It has the following advantages: a trimming accuracy of 5% or less can be obtained; a laser oscillator with a 2M output is sufficient; and three, conventional laser trimming bags can be used.
第1図は本発明によるレーザトリミング法一実施例を示
す構成図、第2図は抵抗体の平面図である。
符号の説明、1:レーザ発振器、2:レーザ光、3:ミ
ラー、4:レンズ、5:抵抗体、6:プローブ、7:テ
ーフル、8:モータ、10:制御回路、11:テーブル
制御回路、52:電極「53:抵抗体、54a,54b
:レーザスポット。
才1函
才2図FIG. 1 is a block diagram showing an embodiment of the laser trimming method according to the present invention, and FIG. 2 is a plan view of a resistor. Explanation of symbols, 1: laser oscillator, 2: laser beam, 3: mirror, 4: lens, 5: resistor, 6: probe, 7: table, 8: motor, 10: control circuit, 11: table control circuit, 52: Electrode 53: Resistor, 54a, 54b
:Laser spot. 1, 2, and 2 figures
Claims (1)
から得られ、且つ抵抗体を除去することなく、該抵抗体
の材質変化を生じせしめうるエネルギーのレーザ光を集
光光学系で集光させて抵抗体に極部的に照射し、上記検
出手段で検出される抵抗値が所定の抵抗値になつたとき
、上記レーザ発振器から得られるレーザ光を停止させて
極部的な抵抗体の材質変化により抵抗値を調整すること
を特徴とするレーザトリミング方法。1 Detecting the resistance value of the resistor with a detection means, and condensing a laser beam obtained from a laser oscillator with energy capable of causing a change in the material of the resistor without removing the resistor using a condensing optical system. When the resistance value detected by the detection means reaches a predetermined resistance value, the laser beam obtained from the laser oscillator is stopped to irradiate the resistor body locally. A laser trimming method characterized by adjusting the resistance value by changing the material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50037993A JPS6027164B2 (en) | 1975-03-31 | 1975-03-31 | Laser trimming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50037993A JPS6027164B2 (en) | 1975-03-31 | 1975-03-31 | Laser trimming method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51113148A JPS51113148A (en) | 1976-10-06 |
JPS6027164B2 true JPS6027164B2 (en) | 1985-06-27 |
Family
ID=12513084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50037993A Expired JPS6027164B2 (en) | 1975-03-31 | 1975-03-31 | Laser trimming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6027164B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5812304A (en) * | 1981-07-16 | 1983-01-24 | 日本電気株式会社 | Method of producing film resistor |
JPS6171601A (en) * | 1984-09-14 | 1986-04-12 | 株式会社井上ジャパックス研究所 | Resistor resistance value regulating and producing apparatus |
JPS63157404A (en) * | 1986-12-20 | 1988-06-30 | 株式会社富士通ゼネラル | Method of trimming thick film resistor array |
JPH04174942A (en) * | 1990-11-08 | 1992-06-23 | Toshiba Corp | Manufacture of voltage-dividing resistor element to be incorporated in electron tube |
JP4645221B2 (en) * | 2005-02-15 | 2011-03-09 | 凸版印刷株式会社 | Manufacturing method of resistance element for built-in component |
-
1975
- 1975-03-31 JP JP50037993A patent/JPS6027164B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS51113148A (en) | 1976-10-06 |
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