JPS6027166B2 - Laser trimming method for resistor - Google Patents

Laser trimming method for resistor

Info

Publication number
JPS6027166B2
JPS6027166B2 JP51003252A JP325276A JPS6027166B2 JP S6027166 B2 JPS6027166 B2 JP S6027166B2 JP 51003252 A JP51003252 A JP 51003252A JP 325276 A JP325276 A JP 325276A JP S6027166 B2 JPS6027166 B2 JP S6027166B2
Authority
JP
Japan
Prior art keywords
resistance value
resistor
laser
trimming
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51003252A
Other languages
Japanese (ja)
Other versions
JPS5287654A (en
Inventor
修身 浅井
博司 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51003252A priority Critical patent/JPS6027166B2/en
Publication of JPS5287654A publication Critical patent/JPS5287654A/en
Publication of JPS6027166B2 publication Critical patent/JPS6027166B2/en
Expired legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

【発明の詳細な説明】 本発明は抵抗体へのレーザトリミング方法に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for laser trimming a resistor.

従来の抵抗体へのし−ザトリミング方法はしーザ光の抵
抗への走査速度としーザ光の抵抗へのレーザ・パルス照
射周波数とをともにトリミングの始めから終わりまでト
リミング中変化させることなく、即ちスポット重なり数
を一定してトリミングを試みていた。
The conventional trimming method for resistors does not change the scanning speed of the laser beam on the resistor and the laser pulse irradiation frequency of the laser beam on the resistor from the beginning to the end of trimming. In other words, trimming was attempted while keeping the number of overlapping spots constant.

そのため抵抗体の調整値の精度を向上させようとすると
トリミングに長時間を要する欠点を有していた。本発明
の目的は上記した従来技術の欠点を軽減して抵抗トリミ
ングの抵抗値調整精度を向上させるように工夫した抵抗
体へのレーザトリミング方法を提供するにある。
Therefore, when attempting to improve the accuracy of the adjusted value of the resistor, there is a drawback that trimming requires a long time. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for laser trimming a resistor that is devised to alleviate the drawbacks of the prior art described above and improve the accuracy of resistance value adjustment in resistor trimming.

即ち本発明は抵抗値調整精度がスポット重なり数によっ
て決まることに着目し、スポット重なり数を変えて抵抗
体をレーザトリミングすることを特徴とするものである
。以下本発明を図に示す実施例にもとづいて具体的に説
明する。
That is, the present invention focuses on the fact that resistance value adjustment accuracy is determined by the number of overlapping spots, and is characterized in that the resistor is laser trimmed by changing the number of overlapping spots. The present invention will be specifically described below based on embodiments shown in the drawings.

第1図にレーザトリミング装置の概略を示す。FIG. 1 shows an outline of the laser trimming device.

1はパルスレーザ光2を発振するレーザ発振器である。1 is a laser oscillator that oscillates pulsed laser light 2;

3はしーザ光2を下方に向けるミラー、4はしーザ光2
を集光するレンズ、5はトリミングする抵抗、6は抵抗
5を送るXYテーブル、7はXYテーブルを駆動する回
路、8は、プローブを介して抵抗5の抵抗値を測定する
抵抗値測定手段と、該抵抗値測定手段によって測定され
た抵抗値と予め設定された目標抵抗値Roまたは(Ro
−Q)(但しQは予め設定された抵抗値)とを比較して
Roまたは(Ro−Q)に到達したか否かを判定する比
較回路とを有し、駆動回路7及び制御回路9へ信号を送
る総合制御部としての機能をもつ抵抗値判定回路、9は
しーザ発振器1のレーザ発振のON−OFF制御をはじ
め励起入力の制御も行なう機能をもつレーザ発振器制御
回路である。レーザトリミングは抵抗5の抵抗値Rxが
、目標抵抗値Roより4・さし、状態から出発する。判
定回路8の内にあるスタートスイッチを押すと駆動回路
7に信号が送られXYテーブル6が動き出す。XYテー
ブル6が定速に到達すると判定回路8はこれを確認した
後制御回路9へ信号を送り発振器1からしーザ光2を発
振させる。レーザ光2はミラー3によって下方へ反射さ
れレンズ4によって集光されて抵抗5を加工する。よっ
て抵抗5の抵抗値Rxは除々に増加して目標抵抗値Ro
に近づく。この時の抵抗値の変化を第2図に示す。抵抗
値は図に示す様にT=1,2,3でレーザパルスが照射
される毎に△Rオームづつディジタル的に増加する。抵
抗値があらかじめ定められた(Ro−Q)を越えた瞬間
、判定回路8は駆動回路7へ信号を送りXYテーブル6
の送り速度を遅くする。パルス照射周波数は一定だから
上記の操作によってスポット重なり数は大きくなる。す
なわち照射パルスあたりの抵抗除去量が減り抵抗値増加
量もAyオーム(〈△Rオーム)と小さくなる。その後
T=6の時点で抵抗5の抵抗値が目標抵抗値R。を越え
た瞬間判定回路8は制御回路9へ信号を送りレーザ光2
の発振を遮断してトリミングを終了する。T=7以後は
パルス照射はない。別法としてパルス照射周波数を制御
する方法を第1図と第3図に示す。
3 is a mirror that directs the laser light 2 downward, 4 is the laser light 2
5 is a resistor for trimming, 6 is an XY table for sending the resistor 5, 7 is a circuit for driving the XY table, 8 is a resistance value measuring means for measuring the resistance value of the resistor 5 via a probe. , the resistance value measured by the resistance value measuring means and the preset target resistance value Ro or (Ro
-Q) (where Q is a preset resistance value) and determines whether Ro or (Ro-Q) has been reached. A resistance value determination circuit functions as a general control section for sending signals, and 9 is a laser oscillator control circuit that functions to control excitation input as well as ON/OFF control of laser oscillation of the laser oscillator 1. Laser trimming starts from a state where the resistance value Rx of the resistor 5 is 4 points less than the target resistance value Ro. When the start switch in the determination circuit 8 is pressed, a signal is sent to the drive circuit 7 and the XY table 6 starts moving. When the XY table 6 reaches a constant speed, the determination circuit 8 confirms this and sends a signal to the control circuit 9 to cause the oscillator 1 to oscillate the laser beam 2. The laser beam 2 is reflected downward by a mirror 3 and condensed by a lens 4 to process a resistor 5. Therefore, the resistance value Rx of the resistor 5 gradually increases to the target resistance value Ro.
approach. FIG. 2 shows the change in resistance value at this time. As shown in the figure, the resistance value digitally increases by ΔR ohm each time a laser pulse is irradiated at T=1, 2, and 3. At the moment when the resistance value exceeds a predetermined value (Ro-Q), the judgment circuit 8 sends a signal to the drive circuit 7 and the XY table 6
Slow down the feed speed. Since the pulse irradiation frequency is constant, the number of spot overlaps increases by the above operation. That is, the amount of resistance removed per irradiation pulse is reduced, and the amount of increase in resistance value is also reduced to Ay ohm (<ΔR ohm). After that, at the time T=6, the resistance value of the resistor 5 becomes the target resistance value R. The moment when the laser beam 2 is exceeded, the judgment circuit 8 sends a signal to the control circuit 9 and the laser beam 2
Cuts off the oscillation and finishes trimming. There is no pulse irradiation after T=7. An alternative method of controlling the pulse irradiation frequency is shown in FIGS. 1 and 3.

前半の動作は上記した方法に同じである。第3図にてT
こ1,2,3でレーザパルスが照射される毎に△Rオー
ムづつディジタル的に増加して抵抗値があらかじめ定め
られた(Ro−Q)オームを越えた瞬間判定回路8は制
御回路9へ信号を送りパルス照射周波数を高めると同時
にパルスのピーク値が加工条件に合った適切な値になる
ように励起入力を制御する。XYテーブル6の送り速度
は一定であるから上記の操作によってスポット重なり数
は大きくなり照射パルスあたりの抵抗値増加量は△yオ
ームと小さくなる。この方法ではパルス照射周波数が高
くなるため照射パルスの時間間隔は△Tから△tと短か
くなっており前の方法に比べてトリミング時間はT時間
だけ短か〈なる。第1図に示すレーザトリミング装置は
しーザ光は固定であり抵抗が移動したが、レーザ光自体
がミラー操作で移動し抵抗は固定であるレーザ。トリミ
ング装置の場合においても上記した2方法は同機に適用
可能である。上記した方法の延長としてXYテーブルと
パルス周波数を同時に制御すればトリミング終了時には
XYテーブルの送り速度を遅くしかつパルス周波数も低
くした状態でスポット重なり数を大きくすることができ
、このときは照射パルスの時間間隔を広げ冷却時間を長
くとって熱の蓄積をさげ抵抗材料の温度係数による抵抗
誤差を軽減して抵抗値調整精度を良くすることができる
。第4図に抵抗値調整精度を同じくした場合の従来法と
本発明とのトリミング時間の比較図を示す。Aは従釆法
でBは本発明によるものである。本発明の方がL時間の
トリミング時間の短縮となっている。具体例としてTa
2N薄膜抵抗体トリミングにおいては10舵Qの抵抗体
を0.01%の精度でトリミングするにはスポット重な
り数を35以上にしなければならない。しかし切断特性
から判断すればスポット重なり数は3.5あれば十分で
ある。よって本発明を使えばトリミング時間は約1′1
0に短縮されることになる。第6図はTa2N薄膜抵抗
体をトリミングしたときのスポット重なり数と抵抗値調
整精度の関係である。
The first half of the operation is the same as the method described above. T in Figure 3
In steps 1, 2, and 3, each time a laser pulse is irradiated, the value is digitally increased by △R ohm, and the moment the resistance value exceeds a predetermined (Ro-Q) ohm, the judgment circuit 8 sends it to the control circuit 9. A signal is sent to increase the pulse irradiation frequency, and at the same time, the excitation input is controlled so that the peak value of the pulse becomes an appropriate value that matches the processing conditions. Since the feed speed of the XY table 6 is constant, the number of overlapping spots increases by the above operation, and the amount of increase in resistance value per irradiation pulse becomes small, Δy ohms. In this method, since the pulse irradiation frequency becomes high, the time interval between irradiation pulses is shortened from ΔT to Δt, and the trimming time is shorter by T time than in the previous method. In the laser trimming device shown in FIG. 1, the laser beam is fixed and the resistance moves, but the laser beam itself moves by mirror operation and the resistance is fixed. In the case of a trimming device, the above two methods can also be applied to the same device. As an extension of the method described above, if the XY table and pulse frequency are controlled simultaneously, the number of spot overlaps can be increased while the XY table feed speed is slowed and the pulse frequency is also low at the end of trimming. By widening the time interval and lengthening the cooling time, it is possible to reduce heat accumulation and reduce resistance errors due to the temperature coefficient of the resistor material, thereby improving resistance value adjustment accuracy. FIG. 4 shows a comparison diagram of the trimming time between the conventional method and the present invention when the resistance value adjustment accuracy is the same. A is a conventional method and B is according to the present invention. The trimming time of L time is shorter in the present invention. As a specific example, Ta
In trimming a 2N thin film resistor, the number of overlapping spots must be 35 or more in order to trim a resistor of 10 rudders Q with an accuracy of 0.01%. However, judging from the cutting characteristics, a spot overlap number of 3.5 is sufficient. Therefore, using the present invention, the trimming time is approximately 1'1
It will be shortened to 0. FIG. 6 shows the relationship between the number of spot overlaps and resistance value adjustment accuracy when trimming a Ta2N thin film resistor.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明によるレーザ・トリミング方法を実施す
る装置概略構成図、第2図はXYテーフルの送り速度を
かえた場合の抵抗値変化を示した図、第3図はしーザ・
パルス照射周波数をかえた場合の抵抗値変化を示した図
、第4図はXYテーブルの送り速度をかえたときの本発
明と従来法との抵抗値変化とトリミング時間とを比較し
て示した図、第5図はスポット重なり数と抵抗調整精度
の関係を示した図である。 1・・・…レーザ発振器、2・・・・・・レーザ光、3
…・・・ミフー、4・・・・・・レンズ、5・・・…抵
抗、6・・・・・・XYテーフル、8・・・・・・抵抗
値判定回路。 才‘図才2図 す3函 ナ4図 才5図
Fig. 1 is a schematic configuration diagram of an apparatus for carrying out the laser trimming method according to the present invention, Fig. 2 is a diagram showing the change in resistance value when the feeding speed of the
Figure 4 shows the change in resistance value when the pulse irradiation frequency is changed. Figure 4 shows a comparison of the change in resistance value and trimming time between the present invention and the conventional method when the feed speed of the XY table is changed. FIG. 5 is a diagram showing the relationship between the number of overlapping spots and resistance adjustment accuracy. 1... Laser oscillator, 2... Laser light, 3
...Mihu, 4...Lens, 5...Resistance, 6...XY table, 8...Resistance value judgment circuit. 2 figures, 3 boxes, 4 figures, 5 figures

Claims (1)

【特許請求の範囲】 1 走査手段で抵抗体とレーザ光とを相対的に走査させ
ながらレーザ発振器から所定の周波数でもつてパルスレ
ーザ光を発振させ、上記走査手段で走査される走査速度
または上記レーザ発振器で発振されるパルスレーザ光の
発振周波数を変化させる制御手段を調整してレーザ光の
スポツトの重なりを少くした状態で抵抗体へのレーザト
リミングを開始し、判定手段でもつて抵抗測定手段で測
定された抵抗値Rxが所定の値(R_0−α)(但しR
_0は目標抵抗値である。 αは予め設定された抵抗値である。)に到達したことが
判定された後は上記制御手段を調整してレーザ光の重な
りを多くした状態でレーザトリミングを行い、判定手段
でもつて抵抗測定手段で測定された抵抗値Rxが上記目
標抵抗値R_0に到達したことが判定されたとき上記レ
ーザ発振器のパルスレーザ光の発振を停止させて抵抗体
の抵抗値を目標抵抗値に調整することを特徴とする抵抗
体へのレーザトリミング方法。
[Claims] 1. A laser oscillator oscillates a pulsed laser beam at a predetermined frequency while relatively scanning a resistor and a laser beam using a scanning means, and the scanning speed at which the scanning means scans or the laser beam is scanned by the scanning means. The control means for changing the oscillation frequency of the pulsed laser light oscillated by the oscillator is adjusted to reduce the overlap of the laser light spots, and then laser trimming of the resistor is started, and the determination means also measures the resistance with the resistance measuring means. The resistance value Rx is a predetermined value (R_0-α) (however, R
_0 is the target resistance value. α is a preset resistance value. ), the control means is adjusted to increase the overlap of laser beams and laser trimming is performed, and the determination means also determines that the resistance value Rx measured by the resistance measuring means is equal to the target resistance. A method for laser trimming a resistor, characterized in that when it is determined that the value R_0 has been reached, oscillation of the pulsed laser beam of the laser oscillator is stopped to adjust the resistance value of the resistor to a target resistance value.
JP51003252A 1976-01-16 1976-01-16 Laser trimming method for resistor Expired JPS6027166B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51003252A JPS6027166B2 (en) 1976-01-16 1976-01-16 Laser trimming method for resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51003252A JPS6027166B2 (en) 1976-01-16 1976-01-16 Laser trimming method for resistor

Publications (2)

Publication Number Publication Date
JPS5287654A JPS5287654A (en) 1977-07-21
JPS6027166B2 true JPS6027166B2 (en) 1985-06-27

Family

ID=11552264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51003252A Expired JPS6027166B2 (en) 1976-01-16 1976-01-16 Laser trimming method for resistor

Country Status (1)

Country Link
JP (1) JPS6027166B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159712U (en) * 1982-04-21 1983-10-25 株式会社日立製作所 trimming device
JP5458785B2 (en) * 2009-10-09 2014-04-02 パナソニック株式会社 Method for manufacturing circuit protection element

Also Published As

Publication number Publication date
JPS5287654A (en) 1977-07-21

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