JPS60262968A - 超高真空用カソ−ド - Google Patents

超高真空用カソ−ド

Info

Publication number
JPS60262968A
JPS60262968A JP11653784A JP11653784A JPS60262968A JP S60262968 A JPS60262968 A JP S60262968A JP 11653784 A JP11653784 A JP 11653784A JP 11653784 A JP11653784 A JP 11653784A JP S60262968 A JPS60262968 A JP S60262968A
Authority
JP
Japan
Prior art keywords
cathode
flange
cathode body
high vacuum
packing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11653784A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342702B2 (enExample
Inventor
Tetsuo Kodama
児玉　哲郎
Haruo Sugiyama
春男 杉山
Masahiro Ohama
大濱　雅弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Nihon Shinku Gijutsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Nihon Shinku Gijutsu KK filed Critical Ulvac Inc
Priority to JP11653784A priority Critical patent/JPS60262968A/ja
Publication of JPS60262968A publication Critical patent/JPS60262968A/ja
Publication of JPS6342702B2 publication Critical patent/JPS6342702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP11653784A 1984-06-08 1984-06-08 超高真空用カソ−ド Granted JPS60262968A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11653784A JPS60262968A (ja) 1984-06-08 1984-06-08 超高真空用カソ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11653784A JPS60262968A (ja) 1984-06-08 1984-06-08 超高真空用カソ−ド

Publications (2)

Publication Number Publication Date
JPS60262968A true JPS60262968A (ja) 1985-12-26
JPS6342702B2 JPS6342702B2 (enExample) 1988-08-25

Family

ID=14689575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11653784A Granted JPS60262968A (ja) 1984-06-08 1984-06-08 超高真空用カソ−ド

Country Status (1)

Country Link
JP (1) JPS60262968A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0413354A1 (en) * 1989-08-17 1991-02-20 Mitsubishi Kasei Corporation Sputtering target for DC magnetron reactive sputtering, process for forming thin layer by use of the target, and optical disk having a layer formed by the process
US5433835A (en) * 1993-11-24 1995-07-18 Applied Materials, Inc. Sputtering device and target with cover to hold cooling fluid
US6199259B1 (en) 1993-11-24 2001-03-13 Applied Komatsu Technology, Inc. Autoclave bonding of sputtering target assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0413354A1 (en) * 1989-08-17 1991-02-20 Mitsubishi Kasei Corporation Sputtering target for DC magnetron reactive sputtering, process for forming thin layer by use of the target, and optical disk having a layer formed by the process
US5433835A (en) * 1993-11-24 1995-07-18 Applied Materials, Inc. Sputtering device and target with cover to hold cooling fluid
US6199259B1 (en) 1993-11-24 2001-03-13 Applied Komatsu Technology, Inc. Autoclave bonding of sputtering target assembly

Also Published As

Publication number Publication date
JPS6342702B2 (enExample) 1988-08-25

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