JPS6342702B2 - - Google Patents
Info
- Publication number
- JPS6342702B2 JPS6342702B2 JP11653784A JP11653784A JPS6342702B2 JP S6342702 B2 JPS6342702 B2 JP S6342702B2 JP 11653784 A JP11653784 A JP 11653784A JP 11653784 A JP11653784 A JP 11653784A JP S6342702 B2 JPS6342702 B2 JP S6342702B2
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- flange
- cathode body
- backing plate
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000003507 refrigerant Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11653784A JPS60262968A (ja) | 1984-06-08 | 1984-06-08 | 超高真空用カソ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11653784A JPS60262968A (ja) | 1984-06-08 | 1984-06-08 | 超高真空用カソ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60262968A JPS60262968A (ja) | 1985-12-26 |
| JPS6342702B2 true JPS6342702B2 (enExample) | 1988-08-25 |
Family
ID=14689575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11653784A Granted JPS60262968A (ja) | 1984-06-08 | 1984-06-08 | 超高真空用カソ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60262968A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2023509A1 (en) * | 1989-08-17 | 1991-02-18 | Yoshiyuki Kisaka | Sputtering target for dc magnetron reactive sputtering, process for forming thin layer by use of the target, and optical disk having a layer formed by the process |
| US5433835B1 (en) * | 1993-11-24 | 1997-05-20 | Applied Materials Inc | Sputtering device and target with cover to hold cooling fluid |
| US6199259B1 (en) | 1993-11-24 | 2001-03-13 | Applied Komatsu Technology, Inc. | Autoclave bonding of sputtering target assembly |
-
1984
- 1984-06-08 JP JP11653784A patent/JPS60262968A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60262968A (ja) | 1985-12-26 |
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