JPS60261158A - セラミック端子板の気密接合方法 - Google Patents

セラミック端子板の気密接合方法

Info

Publication number
JPS60261158A
JPS60261158A JP11712984A JP11712984A JPS60261158A JP S60261158 A JPS60261158 A JP S60261158A JP 11712984 A JP11712984 A JP 11712984A JP 11712984 A JP11712984 A JP 11712984A JP S60261158 A JPS60261158 A JP S60261158A
Authority
JP
Japan
Prior art keywords
thermal expansion
terminal plate
container
ceramic terminal
expansion coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11712984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439777B2 (enrdf_load_stackoverflow
Inventor
Katsuhide Natori
名取 勝英
Kyoichiro Kono
河野 恭一郎
Tsutomu Iikawa
勤 飯川
Shigeki Okamoto
岡本 茂樹
Takeaki Sakai
酒井 武明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11712984A priority Critical patent/JPS60261158A/ja
Publication of JPS60261158A publication Critical patent/JPS60261158A/ja
Publication of JPH0439777B2 publication Critical patent/JPH0439777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP11712984A 1984-06-07 1984-06-07 セラミック端子板の気密接合方法 Granted JPS60261158A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11712984A JPS60261158A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11712984A JPS60261158A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Publications (2)

Publication Number Publication Date
JPS60261158A true JPS60261158A (ja) 1985-12-24
JPH0439777B2 JPH0439777B2 (enrdf_load_stackoverflow) 1992-06-30

Family

ID=14704155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11712984A Granted JPS60261158A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Country Status (1)

Country Link
JP (1) JPS60261158A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0439777B2 (enrdf_load_stackoverflow) 1992-06-30

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees