JPS60261158A - セラミック端子板の気密接合方法 - Google Patents
セラミック端子板の気密接合方法Info
- Publication number
- JPS60261158A JPS60261158A JP11712984A JP11712984A JPS60261158A JP S60261158 A JPS60261158 A JP S60261158A JP 11712984 A JP11712984 A JP 11712984A JP 11712984 A JP11712984 A JP 11712984A JP S60261158 A JPS60261158 A JP S60261158A
- Authority
- JP
- Japan
- Prior art keywords
- thermal expansion
- terminal plate
- container
- ceramic terminal
- expansion coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11712984A JPS60261158A (ja) | 1984-06-07 | 1984-06-07 | セラミック端子板の気密接合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11712984A JPS60261158A (ja) | 1984-06-07 | 1984-06-07 | セラミック端子板の気密接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60261158A true JPS60261158A (ja) | 1985-12-24 |
JPH0439777B2 JPH0439777B2 (enrdf_load_stackoverflow) | 1992-06-30 |
Family
ID=14704155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11712984A Granted JPS60261158A (ja) | 1984-06-07 | 1984-06-07 | セラミック端子板の気密接合方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60261158A (enrdf_load_stackoverflow) |
-
1984
- 1984-06-07 JP JP11712984A patent/JPS60261158A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0439777B2 (enrdf_load_stackoverflow) | 1992-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |