JPS60258917A - ガス不透過性半導体製造用SiC−Si系均熱管の製造方法 - Google Patents
ガス不透過性半導体製造用SiC−Si系均熱管の製造方法Info
- Publication number
- JPS60258917A JPS60258917A JP60056907A JP5690785A JPS60258917A JP S60258917 A JPS60258917 A JP S60258917A JP 60056907 A JP60056907 A JP 60056907A JP 5690785 A JP5690785 A JP 5690785A JP S60258917 A JPS60258917 A JP S60258917A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- ppm
- tube
- alkali metal
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P95/90—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60056907A JPS60258917A (ja) | 1985-03-20 | 1985-03-20 | ガス不透過性半導体製造用SiC−Si系均熱管の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60056907A JPS60258917A (ja) | 1985-03-20 | 1985-03-20 | ガス不透過性半導体製造用SiC−Si系均熱管の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9823075A Division JPS5222477A (en) | 1975-08-13 | 1975-08-13 | Sic-si type equalizing tube for manufacturing gas impermeable semi conductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60258917A true JPS60258917A (ja) | 1985-12-20 |
| JPS6410930B2 JPS6410930B2 (en:Method) | 1989-02-22 |
Family
ID=13040521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60056907A Granted JPS60258917A (ja) | 1985-03-20 | 1985-03-20 | ガス不透過性半導体製造用SiC−Si系均熱管の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60258917A (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112159232A (zh) * | 2020-09-29 | 2021-01-01 | 南通三责精密陶瓷有限公司 | 一种高纯高致密碳化硅陶瓷及其制造方法 |
-
1985
- 1985-03-20 JP JP60056907A patent/JPS60258917A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112159232A (zh) * | 2020-09-29 | 2021-01-01 | 南通三责精密陶瓷有限公司 | 一种高纯高致密碳化硅陶瓷及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6410930B2 (en:Method) | 1989-02-22 |
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