JPS60254034A - パタ−ン形成方法 - Google Patents
パタ−ン形成方法Info
- Publication number
- JPS60254034A JPS60254034A JP59108508A JP10850884A JPS60254034A JP S60254034 A JPS60254034 A JP S60254034A JP 59108508 A JP59108508 A JP 59108508A JP 10850884 A JP10850884 A JP 10850884A JP S60254034 A JPS60254034 A JP S60254034A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- intermediate layer
- resist film
- polydialkoxysiloxane
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59108508A JPS60254034A (ja) | 1984-05-30 | 1984-05-30 | パタ−ン形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59108508A JPS60254034A (ja) | 1984-05-30 | 1984-05-30 | パタ−ン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60254034A true JPS60254034A (ja) | 1985-12-14 |
| JPH0444741B2 JPH0444741B2 (enExample) | 1992-07-22 |
Family
ID=14486554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59108508A Granted JPS60254034A (ja) | 1984-05-30 | 1984-05-30 | パタ−ン形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60254034A (enExample) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262151A (ja) * | 1984-06-11 | 1985-12-25 | Nippon Telegr & Teleph Corp <Ntt> | 三層レジスト用中間層材料及びその利用方法 |
| JPS60262150A (ja) * | 1984-06-11 | 1985-12-25 | Nippon Telegr & Teleph Corp <Ntt> | 三層レジスト用中間層材料及びそれを用いた三層レジストパタン形成方法 |
| JPS6377050A (ja) * | 1986-09-20 | 1988-04-07 | Nippon Telegr & Teleph Corp <Ntt> | 三層レジスト用中間層材料およびパタ−ン形成方法 |
| US5290899A (en) * | 1988-09-22 | 1994-03-01 | Tosoh Corporation | Photosensitive material having a silicon-containing polymer |
| FR2792323A1 (fr) * | 1999-04-19 | 2000-10-20 | Centre Nat Etd Spatiales | Composition de revetement transparent non mouillable et articles revetus obtenus |
| US6743885B2 (en) | 2001-07-31 | 2004-06-01 | Sumitomo Chemical Company, Limited | Resin composition for intermediate layer of three-layer resist |
| WO2004092437A3 (en) * | 2003-04-10 | 2005-06-02 | Microphase Coatings Inc | Thermal barrier composition |
| US6914114B2 (en) | 2000-07-17 | 2005-07-05 | Honeywell International Inc. | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
| US7060635B2 (en) | 2002-06-28 | 2006-06-13 | Fujitsu Limited | Method of manufacturing semiconductor device and method of forming pattern |
| US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
| US8992806B2 (en) | 2003-11-18 | 2015-03-31 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
-
1984
- 1984-05-30 JP JP59108508A patent/JPS60254034A/ja active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262150A (ja) * | 1984-06-11 | 1985-12-25 | Nippon Telegr & Teleph Corp <Ntt> | 三層レジスト用中間層材料及びそれを用いた三層レジストパタン形成方法 |
| JPS60262151A (ja) * | 1984-06-11 | 1985-12-25 | Nippon Telegr & Teleph Corp <Ntt> | 三層レジスト用中間層材料及びその利用方法 |
| JPS6377050A (ja) * | 1986-09-20 | 1988-04-07 | Nippon Telegr & Teleph Corp <Ntt> | 三層レジスト用中間層材料およびパタ−ン形成方法 |
| US5290899A (en) * | 1988-09-22 | 1994-03-01 | Tosoh Corporation | Photosensitive material having a silicon-containing polymer |
| FR2792323A1 (fr) * | 1999-04-19 | 2000-10-20 | Centre Nat Etd Spatiales | Composition de revetement transparent non mouillable et articles revetus obtenus |
| EP1046689A1 (fr) * | 1999-04-19 | 2000-10-25 | Centre National D'etudes Spatiales | Composition de revêtement transparent non-mouilable et articles revêtus obtenus |
| US6914114B2 (en) | 2000-07-17 | 2005-07-05 | Honeywell International Inc. | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
| US6743885B2 (en) | 2001-07-31 | 2004-06-01 | Sumitomo Chemical Company, Limited | Resin composition for intermediate layer of three-layer resist |
| US7060635B2 (en) | 2002-06-28 | 2006-06-13 | Fujitsu Limited | Method of manufacturing semiconductor device and method of forming pattern |
| WO2004092437A3 (en) * | 2003-04-10 | 2005-06-02 | Microphase Coatings Inc | Thermal barrier composition |
| US7687150B2 (en) * | 2003-04-10 | 2010-03-30 | Microphase Coatings, Inc. | Thermal barrier composition |
| US8992806B2 (en) | 2003-11-18 | 2015-03-31 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
| US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0444741B2 (enExample) | 1992-07-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3985597A (en) | Process for forming passivated metal interconnection system with a planar surface | |
| US4731155A (en) | Process for forming a lithographic mask | |
| US4328262A (en) | Method of manufacturing semiconductor devices having photoresist film as a permanent layer | |
| US4539222A (en) | Process for forming metal patterns wherein metal is deposited on a thermally depolymerizable polymer and selectively removed | |
| JPS60254034A (ja) | パタ−ン形成方法 | |
| JPH0148655B2 (enExample) | ||
| JPH0669119A (ja) | 感光性ポリイミド・パターンの線幅保持方法 | |
| US4568601A (en) | Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures | |
| US4883744A (en) | Forming a polymide pattern on a substrate | |
| JP2675766B2 (ja) | フォトレジスト塗布方法及びその装置 | |
| JPS60153124A (ja) | 塗膜形成方法 | |
| JPS60161621A (ja) | 半導体装置の製造方法 | |
| JPH04338630A (ja) | 半導体装置の製造方法 | |
| JPS6346576B2 (enExample) | ||
| JPS6011458B2 (ja) | 半導体装置の製造方法 | |
| JPS61248529A (ja) | 樹脂層の製造方法 | |
| JPS6273250A (ja) | パタ−ン形成用材料およびパタ−ン形成方法 | |
| JPH0449258B2 (enExample) | ||
| JPS60247947A (ja) | 半導体装置の製造方法 | |
| JPS6366049B2 (enExample) | ||
| JPH0638407B2 (ja) | 平坦化方法 | |
| JPS6167918A (ja) | リフトオフ方法 | |
| JPS61242099A (ja) | 高密度多層配線板の製造方法 | |
| JPH0391233A (ja) | パターン形成方法 | |
| JPS5917540B2 (ja) | 半導体装置の配線形成方法 |