JPS60252620A - 積層板用樹脂組成物 - Google Patents
積層板用樹脂組成物Info
- Publication number
- JPS60252620A JPS60252620A JP10814884A JP10814884A JPS60252620A JP S60252620 A JPS60252620 A JP S60252620A JP 10814884 A JP10814884 A JP 10814884A JP 10814884 A JP10814884 A JP 10814884A JP S60252620 A JPS60252620 A JP S60252620A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminate
- epoxy
- ethyl
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10814884A JPS60252620A (ja) | 1984-05-28 | 1984-05-28 | 積層板用樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10814884A JPS60252620A (ja) | 1984-05-28 | 1984-05-28 | 積層板用樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60252620A true JPS60252620A (ja) | 1985-12-13 |
JPH0377815B2 JPH0377815B2 (enrdf_load_html_response) | 1991-12-11 |
Family
ID=14477158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10814884A Granted JPS60252620A (ja) | 1984-05-28 | 1984-05-28 | 積層板用樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60252620A (enrdf_load_html_response) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008075427A1 (ja) * | 2006-12-21 | 2008-06-26 | Nippon Soda Co., Ltd. | 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂 |
JP2013213168A (ja) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | プリプレグ用エポキシ樹脂組成物 |
US8623942B2 (en) | 2009-03-11 | 2014-01-07 | Nippon Soda Co., Ltd. | Epoxy resin composition, curing agent, and curing accelerator |
US8653160B2 (en) | 2007-09-21 | 2014-02-18 | Nippon Soda Co., Ltd. | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
-
1984
- 1984-05-28 JP JP10814884A patent/JPS60252620A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008075427A1 (ja) * | 2006-12-21 | 2008-06-26 | Nippon Soda Co., Ltd. | 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂 |
US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
US8653160B2 (en) | 2007-09-21 | 2014-02-18 | Nippon Soda Co., Ltd. | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
US8623942B2 (en) | 2009-03-11 | 2014-01-07 | Nippon Soda Co., Ltd. | Epoxy resin composition, curing agent, and curing accelerator |
JP2013213168A (ja) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | プリプレグ用エポキシ樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
JPH0377815B2 (enrdf_load_html_response) | 1991-12-11 |