JPS60246605A - Coil - Google Patents

Abstract

PURPOSE:To enable to obtain the titled coil having sufficient mechanical strength as well as to contrive miniaturization and light-weightedness of the coil by a method wherein a coil consisting of a conductive substance is formed on a substrate whereon an insulating layer is formed on a non-magnetic thin metal sheet. CONSTITUTION:An insulating layer 5, a conductive layer 6, and an insulating layer 7 are formed successively on the surface of a temporary base stand 4. Then, after a through hole 71 has been formed by removing a part of the insulating layer 7 by performing an etching and the like, a conductive layer 8 such as copper, aluminum and the like is formed by performing a vapor-deposition, sputtering and the like. Subsequently, a spiral conductive layer 81 is formed by performing a selective etching on the conductive layer 8 using a photoetching method and the like. A part of the spiral conductive layer 81 is electrically connected to the metal layer 6 through the intermediary of the through hole 71 on the insulating layer 7. Then, an insulating layer 9 is formed on the surface of the conductive layer 81, namely, on the upper surface and the side face. Through these procedures, an intermediate product 10 having the spiral conductive layer 81 covered by the insulating layer 9 is obtained. Lastly, the temporary base stand 4 and the insulating layer 5 are removed by polishing, etching and the like.

Description

[Detailed description of the invention] [Usage amount/Kano on Cough Haha] This invention relates to a coil body.

[Subject technology]

As shown in FIG. As shown in the figure, a thin film 2' of a 41-it material such as metal is formed on the surface of a 1kl base having a predetermined thickness using a steam bath or the like, and a photoresist film 8 is formed on the surface of this thin film 2'. It is usually manufactured by a so-called photo-etching method in which etching is selectively performed.

[Problem that the invention seeks to solve]

By the way, the above-mentioned beak crushing of the coil body is carried out in order to obtain a predetermined mechanical strength of the entire coil body.・It is a necessary condition to have this, and the actual situation is that the substrate l must be made considerably thick. In other words, it removes the substrate l and damages the substrate l! If this happens, the mechanical strength of the entire coil body will be significantly reduced, making it impossible to put it to practical use.

Therefore, in the above-mentioned coil body, the space occupied by the four plates is extremely large, and the coil body as a whole has the disadvantage that it cannot be made small and lightweight.Therefore, in the present invention, it is possible to have a light mechanical strength and a small size. The problem is how to realize a coil body that can be attached.

(c) Intermediate film for solving problems] This invention solves the above problems by forming a coil made of a conductor on a substrate made of a non-magnetic thin metal sheet with an insulating layer formed thereon. .

〔Example〕

The figures are divided into figures showing a tth embodiment of the present invention.

The coil body shown in this figure has an insulating layer 71 formed on the top surface of a non-magnetic conductive layer (thin metal sheet) 6, and a spiral conductive coil (coil) made of a conductor on a base @61. ) 81 and insulated 1-9 on the top and side surfaces of the conductive ff1si.
It is formed by forming. A through hole 71 is formed in the insulating layer 7 , and the conductive layer 81 is electrically connected to the conductive layer 6 through the through hole 71 .

Further, FIG. 2 is a diagram showing a second embodiment of the present invention.

The coil body shown in this figure is obtained by adding another element to the coil body shown in FIG. 1 to make its surface flat. That is, the coil body shown in FIG. 2 has a thin film 11B made of a conductor or an insulator in a spiral recess formed in the conductor 1181 covered with the insulating layer q of the coil body shown in FIG. An insulating film 14 is formed and its surface is made flat. Conductive 11i81, P! formed on the substrate 61. The upper surface of the coil part I, which is made up of a thin film ILB with a layer 9 and an insulating film 14, is a flat surface.

Further, FIG. 3 is a diagram showing a third embodiment of the present invention.

The coil body shown in this figure has a coil part 1 having substantially the same structure as the above-mentioned coil part I on the upper surface of the coil body shown in FIG. ,1
．． are sequentially laminated, and conductive layer 15 is placed on the upper surface of coil part 3.
It is formed by forming. In this case, each coil portion I,
~1. Through holes 91 are formed in the insulating layers IJ, sJ, 9, respectively.
is formed, and the conductivity of each coil portion I, -1, -81
, 81, 81 are electrically connected in series through each through hole 91, and the coil portion 1. The conductive layer 81Vi is electrically connected to the conductive layer 115 through the through hole 91.

Next, six methods of manufacturing the coil body described in each of the above embodiments will be described.

In order to manufacture the coil body of the first embodiment, first, as shown in Fig.
, an insulating layer 7 is sequentially formed. As the temporary base 4, one made by Keindo can be used, but if silicon is used as the temporary base, the surface of the temporary base can be thermally oxidized.
The insulating layer 51fc having a thickness of 10% can be formed. The conductive layer 6 will ultimately form a support substrate for the coil body, and will also serve as one terminal of the coil body, and is made of a non-magnetic thin metal such as steel or aluminum. Used. Further, as the insulating layer 7, for example, Sto
An insulating film such as w, sts Na, etc. is used.

Then, as shown in FIG. 9 (8), the -m of the insulation 1@7
After forming the through hole 71 by removing it by means such as etching, a conductive layer 8 of steel, aluminum, etc. is formed by a method such as vapor deposition or sputtering. After this, Fig. ψt
As shown in C), the conductive layer 8 is selectively etched by means such as photo engraving to form a spiral conductive layer 71181 similar to that of the book shown in the figure. In this state, one end of the spiral conductive layer 81 is connected to the through hole 71 of the insulating layer 7.
It is electrically connected to the metal layer 6 via.

Next, as shown in FIG. ψ U, an insulating layer 9tl is formed on the surface of the conductive layer 81, that is, on the upper surface and side surfaces.

This insulating layer g may be formed by oxidizing the metal surface of the conductive layer 81 by heat treatment or the like. For example, when the conductive solder layer 9 is made of aluminum, the insulating layer 9 of aluminum oxide A/O can be formed by thermally oxidizing it.

In this way, the spiral conductor 1- is covered with the insulating layer 9.
An intermediate product 10 having 81 is obtained.

Finally, by removing the temporary base plate and the insulating layer 5 by polishing or etching, the coil body shown in FIG. f can be obtained.

In addition, in order to manufacture the coil body of the second embodiment, the intermediate product lO get.

The surface of this intermediate product IO has irregularities formed by the conductor 1-81. On the surface of this intermediate product IO, a thin film 11 is then formed by means such as vapor deposition or sputtering as shown in FIG. 4
! IK. Here 100 intermediate products
Since the surface is uneven as described above, the thin film 11 is also uneven. That is, the thin film 11 is divided into a convex thin film 11A located on the upper surface of the conductive layer 81 and a concave thin film 11B that fills the concave portion between adjacent conductive layers. Note that this thin film 1
As the material 1, metal oxide, polysilicon, various insulators, etc. are used.

Next, a photoresist film 12 is formed on the surface of the thin film 110 as shown in FIG. The photoresist film 12 is left only on the upper surface of the convex thin film 11A. For example, when the material of the photoresist film is photocurable, the photoresist film 12 on the upper surface of the convex thin film 11A is irradiated with light using a photomask,
The photoresist film in this area is hardened by this process.
It is best to dissolve and remove the photoresist film in the non-irradiated areas.

Thereafter, the thin film 11 is slightly etched by a chemical etching method to form an overhang part 1B on the convex thin film 11A as shown in FIG. It is retreated to a position slightly lower than the height of the conductive layer 81, that is, to a level It that is approximately the same as the height of the convex portion of the conductive layer 81. Through this step, the convex thin film 11A and the concave thin film M
It is completely separated from IIB. In addition, in this etching, AI! When using NaOH or KOH thread etching solution, f'L is good.

Next, as shown in FIG. 9 (Il), an insulating film 14 of SiOISiQ, Si-N-, etc. is formed by vapor deposition or sputtering.
is covered with the insulating film (4). Note that the surface of the photoresist film 12 is also covered with the insulation@14, but the convex thin film 1
The side surface of 1A (overhang surface) is not coated.

Here, the thickness of the insulating film 14 is such that the surface position of the insulating film 14 covering the recessed thin film 11B is the same as that of the insulating film 14 covering the upper surface of the conductive layer 1-81.
Set it so that it roughly matches the surface position.

Next, the convex S thin film 11A on the conductor 11481 is dissolved and removed from tllll[ffi with an etching solution. As this etching solution, one that etches only the thin IIIA without etching the insulating film 14 is used. For example, when the insulating film 14 is made of SiO and
ill tiKOH if IA is configured with A/
, or NaOH may be used.

In this way, a coil $l+ with a flat surface as shown in FIG. 9(J) is obtained.

Finally, the temporary base 4 and the insulating layer 5 are removed by polishing or etching to obtain the coil body shown in FIG. 2.

In addition, in order to manufacture the coil body of the third embodiment row, the same steps as the method of manufacturing the coil body of the second embodiment described above, that is, the steps of FIG. 9 (2) to (J) are performed. An intermediate product shown in Figure 9 [J] is obtained.

By repeating the steps shown in FIG. 9(B) to FIG. 9(J), the second layer coil portion h is successively formed.

3rd layer coil section 1. are laminated, and finally a coil portion with a desired number of layers as shown in Fig. ψ is formed. The conductive layers 81 of each layer are connected in series or in parallel. That is, in the step shown in FIG. 9(B), the insulation 1-
Similarly to forming the through hole 71 in the conductive layer 81 of each layer.
A through hole 91 is formed in the insulating layer 9 between, and each conductive layer 81 is electrically connected through the through hole 91 as described above to form a desired number of coil parts I, -I.

After the formation of n, the upper layer I as shown in Fig.
A through hole 91 is also formed in the insulating layer 9 on the surface of #, and a conductive layer 15 made of metal or polysilicon is formed on the upper surface by vapor deposition or the like. This conductor 1115 is electrically connected to the conductive layer 81 of the uppermost layer (1) through the through hole 91, and becomes the other terminal of this coil body.

Finally, the coil body shown in FIG. 3 can be obtained by removing the temporary base 4 and the insulating layer 5 by a method such as polishing or etching.

The coil body of each embodiment described above includes a conductive layer 6 and an insulating layer. constitutes the substrate 61, and this group gi61 acts as something that provides mechanical strength lf to the entire coil body. In this case, the conductor 'ft1iH of each coil body constitutes one terminal of the coil body. Further, the conductive layer 15 of the coil body shown in FIG. 3 constitutes the other terminal. Here, conductor 17#6 of each coil body
V! Because the material is gold, it has sufficient mechanical strength even though it is extremely thin. Therefore, according to the structure of the coil body of et al., sufficient mechanical strength is obtained, while the space occupied by the substrate 61 is reduced, making it possible to reduce the size and weight of the coil body.

-! In particular, according to the structure of the coil body shown in FIG. 3, compared to the structure of the coil body shown in FIGS. When used as a pickup coil for an electromagnetic cartridge or a coil for a small microphone, excellent frequency characteristics can be obtained due to the small inductance.

In addition, in the manufacturing process of each of the above-mentioned coil bodies, an insulating layer 5'f may be left on the lower surface of the conductive layer 6, and in this case, the conductive layer 6 is retained by the insulating layer 5. be able to. Furthermore, if the conductive layer 6 is made too thick, the eddy current loss will increase, so there is a limit to its storage K.
By leaving the insulating layer 5t at a thickness that provides the necessary mechanical strength, it is possible to make a thin film coil of any thickness depending on the application.

〔Effect of the invention〕

In this invention, a coil made of a conductor is formed on a substrate having an insulator 1- formed on a non-magnetic thin metal sheet. Therefore, the coil and the metal sheet can be reliably insulated by the insulating layer. The substrate can provide sufficient mechanical strength and can be made smaller and lighter. Furthermore, since the conductive layer of the substrate is a planar material, there are advantages such as good Ipz thermal properties.

[Brief explanation of drawings]

1 to 3 are longitudinal sectional views of a coil body shown as an embodiment of the present invention, and FIGS. 9(3) to (L) are IJl! of the coil body shown in FIGS. f to 3. A process diagram showing an example of the manufacturing method, Fig. 6 is a plan view of a conventional coil body, Fig. 6 is a sectional view taken along line x-x' of Fig.
It is a congratulatory figure showing the manufacturing method of the coil body shown in a figure. 6... Thin metal sheet (conductive layer), ?・・・・・・
...Insulating layer, 61...Substrate, 81...
Coil (conductive layer). Figure 1 Figure 1 Figure 3 Figure 4 Figure 4

Claims (1)

[Claims] On a substrate with an insulating layer formed on a non-magnetic thin metal sheet,
A coil body characterized by forming a coil made of a conductor.