JPS59104718A - Production of thin film magnetic head - Google Patents

Abstract

PURPOSE:To stabilize the performance of a thin film magnetic head by providing a process where the film thickness of an organic resin layer is set to obtain a prescribed degree of flatness for a production process of said head where a lower magnetic matter, a gap material, a conductor coil, an organic resin layer, an upper magnetic matter and a protecting layer are formed successively on a substrate. CONSTITUTION:A foundation alumina insulated film 6, a lower magnetic matter 7, a gap material 8 and a conductor coil 9 are formed on a ceramic substrate 5. Then an organic resin layer 10 is formed by coating with spinning and then thermosetting the organic resin. The thickness of this coated film varies by the coil form, the coil space, the viscosity of organic resin, the quantity of resin, etc. Then the thickness is increased until a desired degree of flatness is obtained. The layer 10 is deleted until it is less than the finally desired thickness. Then the organic resin layer 11 is coated again and then thermoset to obtain a desired thickness of film. A photoresist is coated on the layer 11 and then etched after printing of a pattern.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method for manufacturing a thin-film magnetic head, and in particular to a thin-film magnetic head with improved formation process of an organic resin interlayer insulating layer (hereinafter referred to as "organic resin layer"). The method of manufacturing is explained.

[Prior art]

In Figure 1, Motoyama 10 people were kidnapped first? 1 is a diagram illustrating a method for forming an organic resin layer of a thin-film magnetic head; this method forms a coating film with good flatness on a substrate having an uneven surface; FIG. That is, as shown in FIG. 1(a), the substrate 1
An organic resin layer 3 is applied to the substrate on which the conductor wiring 2 is formed, as shown in FIG. 1(b).

The thickness of this organic resin layer 3 is made somewhat thicker than the planned thickness.

Next, as shown in FIG. 1(C), a film 4 with good flatness, such as a positive type photoresist, is formed on the organic resin layer δ,
Heat treated to flatten the surface.

Then, the shape is made as shown in FIG. 1(d). Then, the coating film 4 and the organic resin layer 3 are ion-etched at the same etching rate to obtain a flat surface 3' of the resin layer as shown in FIG.

However, in the above method, if the etching conditions vary, there will be a difference in the etching speed between the coating film 4 and the organic resin layer 3, which will deteriorate the flatness and have other problems that need to be solved, such as a long processing step. Ta.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned circumstances, and its purpose is to solve the above-mentioned problems in the conventional thin-film magnetic head manufacturing method, and to provide a thin-film magnetic head manufacturing method using an organic resin layer as an interlayer insulating layer. It is an object of the present invention to provide a method for manufacturing a thin film magnetic head, which makes it possible to form an upper magnetic body with good flatness by improving the flatness of the surface of the organic resin layer of RAD.

[Summary of the invention]

The gist of the present invention is that a lower magnetic material is placed on a substrate on which an insulating film is formed.
Gap material, conductor coil, organic resin layer.

A method for manufacturing a thin film magnetic head in which an upper magnetic material and a protective layer are sequentially formed includes the step of setting the thickness of the organic resin layer to a thickness that provides a predetermined flatness.

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIGS. 2(a) to 2(e) show the planarization process of a polyimide organic resin layer (hereinafter simply referred to as "organic resin layer"). First, as shown in 21st W (a),
A base alumina insulating film 6, a lower magnetic material 7, a gap material 8, and a conductor coil 9 are formed on a ceramic substrate δ. next,
An organic resin Wj10 is formed as shown in FIG. 2(b). This organic resin layer 10 is formed by applying an organic resin (one pin) and curing it with heat.

The coating film thickness is determined so that the flatness of the insulating film on the conductor coil (hereinafter simply referred to as "coil") is approximately 0.1 μm. For example, if the coil film thickness is 1.5 μm, the coil width is 6 μm, and the coil spacing is 3 μm, the coating film thickness will be as shown in Figure 3, and the organic resin film thickness after thermosetting will be 6 μm.
It must be on the order of μm. Note that this coating film thickness depends on the coil shape.

It varies depending on the oil spacing, organic resin viscosity, resin amount, etc.
Apply thickly until desired flatness is achieved. It's going to happen. Moreover, this application does not necessarily have to be carried out at once, but may be carried out in several parts. .

Next, as shown in FIG. 2(0), the organic resin layer 10 is removed until it becomes thinner than the final required thickness. The reason why the film is made thinner than the final required thickness is that recoating is performed to obtain a stable taper angle during chemical etching in a later process. This organic resin layer removal is carried out by ion milling, but it is desirable to carry out the removal in a state in which oxygen is added to the commonly used argon gas.

FIG. 4 shows the relationship between the amount of oxygen added and the etching rate. In the case of 100% oxygen, an etching rate approximately 10 times higher than that in the case of 100% argon gas can be obtained.

After making the organic resin Wi 10 thinner than the final required film thickness by oxygen ion milling, the ion-irradiated surface was subjected to plasma asher treatment to remove the organic resin ion damage layer, and the resulting film was thinned as shown in Figure 2 ((1)). Apply the organic resin 11 again and heat cure it to obtain the required film thickness.If oxygen ion milling is used.

Compared to the case of using argon ion milling, the surface damage is smaller and the plasma asher treatment can be completed in a shorter time. I won't let you do anything. Note that by adding the organic resin layer 11,
The surface condition improves, and the adhesion of the photoresist applied in the next step improves.

Next, a photoresist is applied onto the organic resin layer 11, and after pattern baking, etching is performed. This etching may be dry etching or wet etching. At the end of this step, a structure as shown in FIG. 2 (,) is obtained. In addition to the structure of ζ, a coil, an organic resin layer, an upper magnetic material, and a holding lI! By forming a film or the like, a thin film magnetic head as shown in FIG. 5 can be obtained.
1) As mentioned above, when forming an organic resin layer, the coating thickness necessary to obtain the desired flatness is determined by the coil shape.

It is a function of coil spacing, organic resin viscosity, etc., and it is preferable to understand the relationship shown in FIG. 3 in advance when determining the coating film thickness. In addition, this application.

As mentioned above, the film thickness does not necessarily have to be obtained by one coating. Also, oxygen ion mi.

It goes without saying that the mixing ratio of oxygen in the ring may be selected as appropriate.

〔Effect of the invention〕

As described above, according to the present invention, a lower magnetic material, a gap material, and a coil are formed on a substrate having an insulating film.

The method for manufacturing a thin film magnetic head in which an organic resin layer, an upper magnetic material, and a protective layer are sequentially formed includes a step of adjusting the thickness of the organic resin layer to a thickness that provides a predetermined flatness. The upper magnetic body provided on the organic resin layer can be made to have good flatness, and a remarkable effect is achieved in that a thin film magnetic head with stable performance can be manufactured.
15 Furthermore, if the thick organic resin layer is removed by oxygen ion milling, the etching rate can be increased and at the same time surface damage can be reduced.

[Brief explanation of the drawing]

3 is a graph showing an example of the relationship between organic resin film thickness and flatness. FIG. 1 is a graph showing the effect of oxygen addition in ion milling. FIG. 5 is a graph showing the effect of oxygen addition in ion milling. 5: Ceramic substrate, 6: Alumina insulating film, 7: Lower magnetic material, 8: Gap material, 9: Coil, 10.11: Organic resin layer, 12i Upper magnetic material, 13: Protection film. Patent applicant: Computer Basic Technology Research Association Tsutsu 1
Figure 2 Figure 3 Polyimide organic resin film thickness (ltm) Φ Figure 021n Ar (%) Figure 5

Claims (1)

[Claims] (1) In a method for manufacturing a thin film magnetic head, in which a lower magnetic material, a gap material, a conductive fill, an organic resin interlayer insulating layer, the above-mentioned magnetic material and a protective layer are successively formed on a substrate having an insulating film, between the organic resin Rj. 1. A method for manufacturing a thin-film magnetic head, which comprises the step of adjusting the thickness of an insulating layer to a thickness that provides a predetermined flatness. e) In the step of forming an R layer with an interleaved organic resin layer, the organic resin film having a predetermined flatness is etched using oxygen ion etching until it becomes thinner than the required film thickness, and then the processed surface altered layer is removed. 2. The method of manufacturing a thin-film magnetic head according to claim 1, further comprising the steps of: obtaining a required film thickness by applying an organic resin and thermally curing the thin-film magnetic head;