JPS60243277A - 銀被覆銅粉の製造方法 - Google Patents

銀被覆銅粉の製造方法

Info

Publication number
JPS60243277A
JPS60243277A JP59096144A JP9614484A JPS60243277A JP S60243277 A JPS60243277 A JP S60243277A JP 59096144 A JP59096144 A JP 59096144A JP 9614484 A JP9614484 A JP 9614484A JP S60243277 A JPS60243277 A JP S60243277A
Authority
JP
Japan
Prior art keywords
silver
copper powder
salt
ammonia
ammonium carbonate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59096144A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0250992B2 (enExample
Inventor
Nobuaki Komasa
向當　宣昭
Kamiyoshi Yugawa
湯川　上営
Takeo Moro
健夫 毛呂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to JP59096144A priority Critical patent/JPS60243277A/ja
Priority to US06/731,402 priority patent/US4652465A/en
Publication of JPS60243277A publication Critical patent/JPS60243277A/ja
Publication of JPH0250992B2 publication Critical patent/JPH0250992B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
JP59096144A 1984-05-14 1984-05-14 銀被覆銅粉の製造方法 Granted JPS60243277A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59096144A JPS60243277A (ja) 1984-05-14 1984-05-14 銀被覆銅粉の製造方法
US06/731,402 US4652465A (en) 1984-05-14 1985-05-07 Process for the production of a silver coated copper powder and conductive coating composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59096144A JPS60243277A (ja) 1984-05-14 1984-05-14 銀被覆銅粉の製造方法

Publications (2)

Publication Number Publication Date
JPS60243277A true JPS60243277A (ja) 1985-12-03
JPH0250992B2 JPH0250992B2 (enExample) 1990-11-06

Family

ID=14157184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59096144A Granted JPS60243277A (ja) 1984-05-14 1984-05-14 銀被覆銅粉の製造方法

Country Status (1)

Country Link
JP (1) JPS60243277A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100438408B1 (ko) * 2001-08-16 2004-07-02 한국과학기술원 금속간의 치환 반응을 이용한 코어-쉘 구조 및 혼합된합금 구조의 금속 나노 입자의 제조 방법과 그 응용
KR100727483B1 (ko) * 2006-04-29 2007-06-13 주식회사 잉크테크 유기 은 착체 화합물을 포함하는 반사막 코팅액 조성물 및이를 이용한 반사막 제조방법
KR100791231B1 (ko) * 2000-12-20 2008-01-03 도와 홀딩스 가부시끼가이샤 은 확산 구리 분말, 이의 제조방법, 및 이를 사용하는 전도성 페이스트 및 프린트 전자회로용 도선
JP2008530001A (ja) * 2005-02-07 2008-08-07 インクテック カンパニー リミテッド 有機銀錯体化合物及びこれを用いた薄膜形成方法
JP2009530270A (ja) * 2006-03-14 2009-08-27 インクテック カンパニー リミテッド 有機銀錯体化合物を含む抗菌性組成物、これを用いた抗菌処理方法、及び抗菌成形品
JP2010500476A (ja) * 2006-08-07 2010-01-07 インクテック カンパニー リミテッド 金属積層板の製造方法
CN102260864A (zh) * 2011-07-20 2011-11-30 淮阴工学院 凹土/铜-核壳结构一维棒状超细铜粉的制备方法
WO2012056952A1 (ja) * 2010-10-26 2012-05-03 コニカミノルタオプト株式会社 フィルムミラー、フィルムミラーの製造方法及び太陽光反射用ミラー
CN103752842A (zh) * 2013-11-11 2014-04-30 南京工业大学 置换与化学沉积复合法制备纳米银包铜粉末

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759283A (en) * 1980-09-25 1982-04-09 Sharp Corp Card reader

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759283A (en) * 1980-09-25 1982-04-09 Sharp Corp Card reader

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100791231B1 (ko) * 2000-12-20 2008-01-03 도와 홀딩스 가부시끼가이샤 은 확산 구리 분말, 이의 제조방법, 및 이를 사용하는 전도성 페이스트 및 프린트 전자회로용 도선
KR100438408B1 (ko) * 2001-08-16 2004-07-02 한국과학기술원 금속간의 치환 반응을 이용한 코어-쉘 구조 및 혼합된합금 구조의 금속 나노 입자의 제조 방법과 그 응용
US8226755B2 (en) 2005-02-07 2012-07-24 Inktec Co., Ltd. Organic silver complexes, their preparation methods and their methods for forming thin layers
US9914743B2 (en) 2005-02-07 2018-03-13 Inktec Co., Ltd. Organic silver complexes, their preparation methods and their methods for forming thin layers
US8679242B2 (en) 2005-02-07 2014-03-25 Inktec Co., Ltd. Organic silver complexes, their preparation methods and their methods for forming thin layers
JP2008530001A (ja) * 2005-02-07 2008-08-07 インクテック カンパニー リミテッド 有機銀錯体化合物及びこれを用いた薄膜形成方法
JP2009530270A (ja) * 2006-03-14 2009-08-27 インクテック カンパニー リミテッド 有機銀錯体化合物を含む抗菌性組成物、これを用いた抗菌処理方法、及び抗菌成形品
US8445578B2 (en) 2006-04-29 2013-05-21 Inktec Co., Ltd. Compositions for forming reflecting layer having organic silver complexes, and method for preparing reflecting layer using same
TWI382029B (zh) * 2006-04-29 2013-01-11 英泰股份有限公司 用於形成具有有機銀複合物之反射層的組成物、以及使用該組成物之反射層的製備方法
JP2009535661A (ja) * 2006-04-29 2009-10-01 インクテック カンパニー リミテッド 有機銀錯体化合物を含む反射膜コーティング液組成物及びこれを用いた反射膜の製造方法
WO2007126276A1 (en) * 2006-04-29 2007-11-08 Inktec Co., Ltd. Compositions for forming reflecting layer having organic silver complexes,and method for preparing reflecting layer using same
KR100727483B1 (ko) * 2006-04-29 2007-06-13 주식회사 잉크테크 유기 은 착체 화합물을 포함하는 반사막 코팅액 조성물 및이를 이용한 반사막 제조방법
JP2010500476A (ja) * 2006-08-07 2010-01-07 インクテック カンパニー リミテッド 金属積層板の製造方法
US8764960B2 (en) 2006-08-07 2014-07-01 Inktec Co., Ltd. Manufacturing methods for metal clad laminates
WO2012056952A1 (ja) * 2010-10-26 2012-05-03 コニカミノルタオプト株式会社 フィルムミラー、フィルムミラーの製造方法及び太陽光反射用ミラー
CN102260864A (zh) * 2011-07-20 2011-11-30 淮阴工学院 凹土/铜-核壳结构一维棒状超细铜粉的制备方法
CN103752842A (zh) * 2013-11-11 2014-04-30 南京工业大学 置换与化学沉积复合法制备纳米银包铜粉末

Also Published As

Publication number Publication date
JPH0250992B2 (enExample) 1990-11-06

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