JPS60243277A - 銀被覆銅粉の製造方法 - Google Patents
銀被覆銅粉の製造方法Info
- Publication number
- JPS60243277A JPS60243277A JP59096144A JP9614484A JPS60243277A JP S60243277 A JPS60243277 A JP S60243277A JP 59096144 A JP59096144 A JP 59096144A JP 9614484 A JP9614484 A JP 9614484A JP S60243277 A JPS60243277 A JP S60243277A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- copper powder
- salt
- ammonia
- ammonium carbonate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 60
- 239000004332 silver Substances 0.000 title claims abstract description 60
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 57
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 33
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- PRKQVKDSMLBJBJ-UHFFFAOYSA-N ammonium carbonate Chemical compound N.N.OC(O)=O PRKQVKDSMLBJBJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims abstract description 15
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000001099 ammonium carbonate Substances 0.000 claims abstract description 10
- 229910001961 silver nitrate Inorganic materials 0.000 claims abstract description 9
- 235000012501 ammonium carbonate Nutrition 0.000 claims abstract description 6
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims abstract description 4
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims abstract description 4
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 claims abstract description 3
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 claims abstract description 3
- 229910001958 silver carbonate Inorganic materials 0.000 claims abstract description 3
- 229910001923 silver oxide Inorganic materials 0.000 claims abstract description 3
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 claims abstract description 3
- 229910000367 silver sulfate Inorganic materials 0.000 claims abstract description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 19
- 239000012266 salt solution Substances 0.000 claims description 12
- 238000006467 substitution reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 14
- 229910021529 ammonia Inorganic materials 0.000 abstract description 10
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 150000003839 salts Chemical class 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- 239000003973 paint Substances 0.000 description 11
- 238000003756 stirring Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 150000003378 silver Chemical class 0.000 description 3
- QZKRHPLGUJDVAR-UHFFFAOYSA-K EDTA trisodium salt Chemical compound [Na+].[Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O QZKRHPLGUJDVAR-UHFFFAOYSA-K 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000012456 homogeneous solution Substances 0.000 description 2
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 2
- 235000019345 sodium thiosulphate Nutrition 0.000 description 2
- 241000894007 species Species 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 241001590997 Moolgarda engeli Species 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 241000219094 Vitaceae Species 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- -1 alkali metal cyanide Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 235000021021 grapes Nutrition 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59096144A JPS60243277A (ja) | 1984-05-14 | 1984-05-14 | 銀被覆銅粉の製造方法 |
| US06/731,402 US4652465A (en) | 1984-05-14 | 1985-05-07 | Process for the production of a silver coated copper powder and conductive coating composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59096144A JPS60243277A (ja) | 1984-05-14 | 1984-05-14 | 銀被覆銅粉の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60243277A true JPS60243277A (ja) | 1985-12-03 |
| JPH0250992B2 JPH0250992B2 (enrdf_load_stackoverflow) | 1990-11-06 |
Family
ID=14157184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59096144A Granted JPS60243277A (ja) | 1984-05-14 | 1984-05-14 | 銀被覆銅粉の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60243277A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100438408B1 (ko) * | 2001-08-16 | 2004-07-02 | 한국과학기술원 | 금속간의 치환 반응을 이용한 코어-쉘 구조 및 혼합된합금 구조의 금속 나노 입자의 제조 방법과 그 응용 |
| KR100727483B1 (ko) * | 2006-04-29 | 2007-06-13 | 주식회사 잉크테크 | 유기 은 착체 화합물을 포함하는 반사막 코팅액 조성물 및이를 이용한 반사막 제조방법 |
| KR100791231B1 (ko) * | 2000-12-20 | 2008-01-03 | 도와 홀딩스 가부시끼가이샤 | 은 확산 구리 분말, 이의 제조방법, 및 이를 사용하는 전도성 페이스트 및 프린트 전자회로용 도선 |
| JP2008530001A (ja) * | 2005-02-07 | 2008-08-07 | インクテック カンパニー リミテッド | 有機銀錯体化合物及びこれを用いた薄膜形成方法 |
| JP2009530270A (ja) * | 2006-03-14 | 2009-08-27 | インクテック カンパニー リミテッド | 有機銀錯体化合物を含む抗菌性組成物、これを用いた抗菌処理方法、及び抗菌成形品 |
| JP2010500476A (ja) * | 2006-08-07 | 2010-01-07 | インクテック カンパニー リミテッド | 金属積層板の製造方法 |
| CN102260864A (zh) * | 2011-07-20 | 2011-11-30 | 淮阴工学院 | 凹土/铜-核壳结构一维棒状超细铜粉的制备方法 |
| WO2012056952A1 (ja) * | 2010-10-26 | 2012-05-03 | コニカミノルタオプト株式会社 | フィルムミラー、フィルムミラーの製造方法及び太陽光反射用ミラー |
| CN103752842A (zh) * | 2013-11-11 | 2014-04-30 | 南京工业大学 | 置换与化学沉积复合法制备纳米银包铜粉末 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759283A (en) * | 1980-09-25 | 1982-04-09 | Sharp Corp | Card reader |
-
1984
- 1984-05-14 JP JP59096144A patent/JPS60243277A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759283A (en) * | 1980-09-25 | 1982-04-09 | Sharp Corp | Card reader |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100791231B1 (ko) * | 2000-12-20 | 2008-01-03 | 도와 홀딩스 가부시끼가이샤 | 은 확산 구리 분말, 이의 제조방법, 및 이를 사용하는 전도성 페이스트 및 프린트 전자회로용 도선 |
| KR100438408B1 (ko) * | 2001-08-16 | 2004-07-02 | 한국과학기술원 | 금속간의 치환 반응을 이용한 코어-쉘 구조 및 혼합된합금 구조의 금속 나노 입자의 제조 방법과 그 응용 |
| US8226755B2 (en) | 2005-02-07 | 2012-07-24 | Inktec Co., Ltd. | Organic silver complexes, their preparation methods and their methods for forming thin layers |
| US9914743B2 (en) | 2005-02-07 | 2018-03-13 | Inktec Co., Ltd. | Organic silver complexes, their preparation methods and their methods for forming thin layers |
| US8679242B2 (en) | 2005-02-07 | 2014-03-25 | Inktec Co., Ltd. | Organic silver complexes, their preparation methods and their methods for forming thin layers |
| JP2008530001A (ja) * | 2005-02-07 | 2008-08-07 | インクテック カンパニー リミテッド | 有機銀錯体化合物及びこれを用いた薄膜形成方法 |
| JP2009530270A (ja) * | 2006-03-14 | 2009-08-27 | インクテック カンパニー リミテッド | 有機銀錯体化合物を含む抗菌性組成物、これを用いた抗菌処理方法、及び抗菌成形品 |
| US8445578B2 (en) | 2006-04-29 | 2013-05-21 | Inktec Co., Ltd. | Compositions for forming reflecting layer having organic silver complexes, and method for preparing reflecting layer using same |
| TWI382029B (zh) * | 2006-04-29 | 2013-01-11 | 英泰股份有限公司 | 用於形成具有有機銀複合物之反射層的組成物、以及使用該組成物之反射層的製備方法 |
| JP2009535661A (ja) * | 2006-04-29 | 2009-10-01 | インクテック カンパニー リミテッド | 有機銀錯体化合物を含む反射膜コーティング液組成物及びこれを用いた反射膜の製造方法 |
| WO2007126276A1 (en) * | 2006-04-29 | 2007-11-08 | Inktec Co., Ltd. | Compositions for forming reflecting layer having organic silver complexes,and method for preparing reflecting layer using same |
| KR100727483B1 (ko) * | 2006-04-29 | 2007-06-13 | 주식회사 잉크테크 | 유기 은 착체 화합물을 포함하는 반사막 코팅액 조성물 및이를 이용한 반사막 제조방법 |
| JP2010500476A (ja) * | 2006-08-07 | 2010-01-07 | インクテック カンパニー リミテッド | 金属積層板の製造方法 |
| US8764960B2 (en) | 2006-08-07 | 2014-07-01 | Inktec Co., Ltd. | Manufacturing methods for metal clad laminates |
| WO2012056952A1 (ja) * | 2010-10-26 | 2012-05-03 | コニカミノルタオプト株式会社 | フィルムミラー、フィルムミラーの製造方法及び太陽光反射用ミラー |
| CN102260864A (zh) * | 2011-07-20 | 2011-11-30 | 淮阴工学院 | 凹土/铜-核壳结构一维棒状超细铜粉的制备方法 |
| CN103752842A (zh) * | 2013-11-11 | 2014-04-30 | 南京工业大学 | 置换与化学沉积复合法制备纳米银包铜粉末 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0250992B2 (enrdf_load_stackoverflow) | 1990-11-06 |
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