JPS60242625A - Ic担持体の移送装置 - Google Patents

Ic担持体の移送装置

Info

Publication number
JPS60242625A
JPS60242625A JP3150285A JP3150285A JPS60242625A JP S60242625 A JPS60242625 A JP S60242625A JP 3150285 A JP3150285 A JP 3150285A JP 3150285 A JP3150285 A JP 3150285A JP S60242625 A JPS60242625 A JP S60242625A
Authority
JP
Japan
Prior art keywords
carrier
bonding
workbench
guide path
side guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3150285A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0251257B2 (enExample
Inventor
Hideaki Miyoshi
秀明 三好
Tadashi Takano
忠 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Marine Instr Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP3150285A priority Critical patent/JPS60242625A/ja
Publication of JPS60242625A publication Critical patent/JPS60242625A/ja
Publication of JPH0251257B2 publication Critical patent/JPH0251257B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP3150285A 1985-02-21 1985-02-21 Ic担持体の移送装置 Granted JPS60242625A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3150285A JPS60242625A (ja) 1985-02-21 1985-02-21 Ic担持体の移送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3150285A JPS60242625A (ja) 1985-02-21 1985-02-21 Ic担持体の移送装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59000276A Division JPS60144941A (ja) 1984-01-06 1984-01-06 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60242625A true JPS60242625A (ja) 1985-12-02
JPH0251257B2 JPH0251257B2 (enExample) 1990-11-06

Family

ID=12333003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3150285A Granted JPS60242625A (ja) 1985-02-21 1985-02-21 Ic担持体の移送装置

Country Status (1)

Country Link
JP (1) JPS60242625A (enExample)

Also Published As

Publication number Publication date
JPH0251257B2 (enExample) 1990-11-06

Similar Documents

Publication Publication Date Title
JP3159266B2 (ja) 作業装置
JP2803221B2 (ja) Ic実装装置及びその方法
CN1983539B (zh) 晶粒键合的方法
US6955284B2 (en) Device for positioning a tool in relation to a workpiece
US6015079A (en) Positioning device for controlling the position of a workpiece in a horizontal plane
JP2007173801A (ja) フリップチップを基板に取り付ける方法
JPH1154994A (ja) 電子部品実装装置および電子部品実装方法
JP2001308148A (ja) 位置合わせ装置及び位置合わせ方法
JP3981478B2 (ja) 電子部品装着装置
JPH09307297A (ja) 電子部品装着機用補正装置およびその方法
JPH09307288A (ja) 電子部品実装装置
US7320423B2 (en) High speed linear and rotary split-axis wire bonder
JP3265143B2 (ja) 部品搭載方法および装置
EP0989601B1 (en) Method of and apparatus for bonding component
JPS60242625A (ja) Ic担持体の移送装置
CN206173708U (zh) 一种具有智能定位功能的服装点位机
JP2005317806A (ja) 装着精度測定方法
JP6963021B2 (ja) 対基板作業システム
JP2018014384A (ja) 対基板作業機
JPS60144941A (ja) ワイヤボンデイング装置
CN112447555B (zh) 电子零件的安装装置
JPH03217095A (ja) 電子部品の実装装置及び実装方法
JP2534912B2 (ja) ワイヤボンディング装置
JP2757127B2 (ja) ワイヤボンダーのボンディング位置補正方法、およびその装置
JP4077553B2 (ja) 電子部品装着方法および電子部品装着装置