JPS60242625A - Ic担持体の移送装置 - Google Patents
Ic担持体の移送装置Info
- Publication number
- JPS60242625A JPS60242625A JP3150285A JP3150285A JPS60242625A JP S60242625 A JPS60242625 A JP S60242625A JP 3150285 A JP3150285 A JP 3150285A JP 3150285 A JP3150285 A JP 3150285A JP S60242625 A JPS60242625 A JP S60242625A
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- bonding
- workbench
- guide path
- side guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000969 carrier Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000003909 pattern recognition Methods 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract 1
- 210000000078 claw Anatomy 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3150285A JPS60242625A (ja) | 1985-02-21 | 1985-02-21 | Ic担持体の移送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3150285A JPS60242625A (ja) | 1985-02-21 | 1985-02-21 | Ic担持体の移送装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59000276A Division JPS60144941A (ja) | 1984-01-06 | 1984-01-06 | ワイヤボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60242625A true JPS60242625A (ja) | 1985-12-02 |
| JPH0251257B2 JPH0251257B2 (enExample) | 1990-11-06 |
Family
ID=12333003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3150285A Granted JPS60242625A (ja) | 1985-02-21 | 1985-02-21 | Ic担持体の移送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60242625A (enExample) |
-
1985
- 1985-02-21 JP JP3150285A patent/JPS60242625A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0251257B2 (enExample) | 1990-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3159266B2 (ja) | 作業装置 | |
| JP2803221B2 (ja) | Ic実装装置及びその方法 | |
| CN1983539B (zh) | 晶粒键合的方法 | |
| US6955284B2 (en) | Device for positioning a tool in relation to a workpiece | |
| US6015079A (en) | Positioning device for controlling the position of a workpiece in a horizontal plane | |
| JP2007173801A (ja) | フリップチップを基板に取り付ける方法 | |
| JPH1154994A (ja) | 電子部品実装装置および電子部品実装方法 | |
| JP2001308148A (ja) | 位置合わせ装置及び位置合わせ方法 | |
| JP3981478B2 (ja) | 電子部品装着装置 | |
| JPH09307297A (ja) | 電子部品装着機用補正装置およびその方法 | |
| JPH09307288A (ja) | 電子部品実装装置 | |
| US7320423B2 (en) | High speed linear and rotary split-axis wire bonder | |
| JP3265143B2 (ja) | 部品搭載方法および装置 | |
| EP0989601B1 (en) | Method of and apparatus for bonding component | |
| JPS60242625A (ja) | Ic担持体の移送装置 | |
| CN206173708U (zh) | 一种具有智能定位功能的服装点位机 | |
| JP2005317806A (ja) | 装着精度測定方法 | |
| JP6963021B2 (ja) | 対基板作業システム | |
| JP2018014384A (ja) | 対基板作業機 | |
| JPS60144941A (ja) | ワイヤボンデイング装置 | |
| CN112447555B (zh) | 电子零件的安装装置 | |
| JPH03217095A (ja) | 電子部品の実装装置及び実装方法 | |
| JP2534912B2 (ja) | ワイヤボンディング装置 | |
| JP2757127B2 (ja) | ワイヤボンダーのボンディング位置補正方法、およびその装置 | |
| JP4077553B2 (ja) | 電子部品装着方法および電子部品装着装置 |