JPS60242625A - Transfer unit for ic carrier - Google Patents

Abstract

PURPOSE:To ensure higher operating speeds by a method wherein a support machanism is a small unit separated from a guide and is capable of dispacement in the directions of theta, X, or Y. CONSTITUTION:On the shaft of a turn-table 14, a support mechanism 16 is installed as a work bench supporing carriers 15A, 15B, 15C and others for ICS to be subjected to bonding. After the arrival of the carrier 15C at a prescibed spot on the support mechanism 16, a retracting mechanism retracts slide rails 25, 26 for separation from the support mechanism 16, causing pawls 27, 28, 29 to be raised. A camera 7, using such a detecting technique as pattern recognition, starts into work for the detection of the dimensions DELTAX, DELTAY of the displacement of an IC 22 in the directions of X, Y and the directional deviation DELTAtheta. The detected values are used to determine the real coordinates of the IC 22 on the basis of the pre-stored coordinates of the pad of the IC 22 and the end of a lead. An X-table 10, Y-table 12, turn-table 14 are trimmed accordingly, for the completion of the bonding of the pad and the lead end.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a device for transporting an IC carrier in an IC bonding device.

[Prior Art] In a conventional bonding device, a bonding head supporting a bonding tool so as to be movable vertically is installed on an XY table, and is moved in X and Y directions perpendicular to each other on a base of seven frames. Possibly held. A camera was also placed on the XY table to detect the position and orientation of the IC and to display the image on the ITV.

On the other hand, an IC carrier such as a ceramic package or a lead frame carrying an IC is transferred along a guide path by another transfer mechanism (this transfer direction is the X direction), and the center of the IC is positioned at the reference origin directly below the bonding tool. It is held by a holding mechanism so as to hold it in place. This holding mechanism serves as a workbench for performing bonding work, and is supported on a rotary table so as to rotate around the Z axis in the Z direction perpendicular to the IC element surface.

During the bonding operation, the IC carrier transferred by the transfer mechanism is held by the holding mechanism so that the center of the IC carrier substantially coincides with the reference origin. However, due to an error in mounting the IC onto the carrier using a die bonder or the like in the previous process, the center of the IC does not exactly match the center of the carrier, and the directional force f of the IC is not correct in the X direction (or at right angles thereto). (Y direction) in many cases.

The camera detects the X-direction deviation ΔX, the Y-direction deviation ΔY, and the rotational deviation Δθ, and uses these values to determine the actual values of these based on the pre-stored coordinates of the IC pad and lead end. This is done by calculating the coordinates, driving the XY table and rotary table based on the corrected coordinates, and moving the bonding tool back and forth between the pad and the lead.

Conventionally, this reciprocating movement of the bonding tool is driven by the movement of an XY table provided on the bonding head, and such conventional tools have the following drawbacks.

(1) The bonding head, camera, and wire reel nut are placed on the XY table on the bonding head side, and it is relatively heavy, so a load is placed on the XY table and the coordination of operations is impaired.

(2) Since the rotation center of the rotation mechanism of the holding mechanism and the center of the XY table of the bonding head are separated from each other, the bonding position accuracy decreases due to the influence of thermal expansion between them.

(3) The bonding tool is attached to the tip of an elongated bonding arm, and receives vibrations in the X, Y, and Z directions to generate three-dimensional vibrations, which can result in poor bonding positioning and poor bonding.

(4) The camera is subjected to vibrations in the X and Y directions, which causes errors in detecting the position and direction of the IC through pattern recognition, etc., and also causes blur in ITV images, making observations inaccurate.

This is a drawback.

[Problems to be Solved by the Invention] In order to eliminate such drawbacks, the bonding head is operated only in the Z direction, and the workbench is operated only in the θ direction.
It is conceivable to perform operations in the X and Y directions in addition to the direction, but the work platform and the guide path are continuously connected, and it is possible to perform small X and Y displacements at high speed along with the long guide path. It was extremely difficult to get him to do it.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an IC carrier transfer device that solves the above-mentioned problems of the conventional devices, enables high-speed operation of a bonding head and workbench, and enables high-speed bonding operations.

Means for Solving Problem E] In order to solve the above-mentioned problems, the present invention transports the IC carrier along the entrance-side guide path by a feeding mechanism, places it on the bonding workbench, and after the bonding work I of the bonding apparatus, in which the IC carrier is removed from the workbench and transported along an exit-side guide path by a feeding mechanism.
C. In the carrier transfer device, the bonding workbench is supported so as to be able to be slightly displaced in a horizontal plane, and the front and back ends of the workbench of the inlet and outlet guide paths are provided with grooves directed toward the workbench. A slide rail is provided that is held so as to be able to slide toward and away from the entrance side guideway, and the slide rail overlaps the adjacent guideway in the width direction, and when the sliderail comes into contact with the workbench, the entrance side guideway and the slide The present invention provides an IC carrier transfer device characterized in that a rail, a workbench, a slide rail, and an exit-side guide path are continuously connected.

L Example 1 Embodiments of the present invention will now be described with reference to the drawings.

In FIGS. 1 and 2, reference numeral 1 denotes a base frame, and a bonding head 3 is fixed via a frame 2. In FIG. Bonding arm 4 is attached to bonding head 3.
The capillary 5 as a bonding tool is connected to I through
It is supported so as to be able to reciprocate up and down in the Z direction of a Z axis 6 (perpendicular in this embodiment) perpendicular to the C element surface. A camera 7 and a lighting lamp 8 are also fixed to the bonding spatula 1'3.

ITV9 is attached to base frame 1.

10 is an X table, which performs reciprocating movement in the X direction 11. Reference numeral 12 denotes a Y table, which reciprocates in the direction of the Y axis 13 relative to the X table 10. 14 is a rotary table, which performs reciprocating rotational motion relative to the Y table 12 around an axis in the Z direction, and the X table 10
, when the Y table 12 is in the neutral position, it rotates outward around the Z axis 6.

On the rotation center axis of the rotary table 14, there are IC carriers 15A and 15B carrying ICs to be bonded.
, +5C, etc., is provided as a workbench. In this example, the carrier 1
An example of a semi-finished product of a DIP type IC package is shown as 5A.

The outline of the transfer mechanism for the carrier 15A etc. will be explained with reference to FIGS. 1 and 3. 17 is a guide path on the entrance side that guides the carrier 15D etc. to the holding mechanism 16, and 18 is a guide path for guiding the carrier 15A etc. to the next one. This is a guideway on the exit side that leads to the process. 19.20
1 is a feed arm that moves the carrier 15A and the like on the guide path 17.18, the details of which will be described later.

The X-axis weight meter is the center line of the movement path of the carrier 15A, etc., the Y-axis 13 is a straight line that is perpendicular to the X-axis weight meter and passes directly under the capillary 5, and the intersection of the X-axis weight meter and the Y-axis 13 is When the IC is mounted on the carrier 15A or the like with accuracy in both position and direction, the center of the IC is the reference origin.

FIG. 4 shows details of the carrier 15C. The IC 22 is installed in the center of the carrier 15C, and a plurality of leads 23 are installed on both sides, and the IC 22 and the capillary 5 are moved relatively back and forth in the X direction, Y direction, and Z direction.
A wire 24 is passed between the pad 22 and the pad 23 to perform bonding.

Details of the transfer mechanism such as the carrier 15A will be explained with reference to FIGS. 5 to 8. In these figures, carriers +5B and +5
Although D should not be represented by a solid line, it is shown by a two-dot chain line to prevent the diagram from becoming complicated.

5 and 6 show the state at the moment when the carrier 15C is placed in a fixed position on the holding mechanism 16, and the center of the carrier 15C coincides with the reference origin 21.

Slide rails 25 and 26 are slidably held in the X direction at the front and rear ends of the holding mechanism 16 of the guide paths 17 and 18, and overlap the guide paths 17 and 18 in the width direction, so that the carrier 15A, etc. When moving, it protrudes as shown in Fig. 5.6 using a known ejection/extraction mechanism (not shown) and abuts on the holding mechanism 16, and serves as a transfer path for the carrier +5A, etc., with the entrance side guide path 17, slide rail 25, and holding mechanism. 16, the slide rail 26 and the exit side guideway are connected continuously.

The feed arm 19.20 has claws 27.28. at equal intervals.
29 are provided. The claws 27, 28, 29 are adapted to move synchronously in the X and Y directions. For example, the claw 28 moves in a rectangular trajectory like ABCD, and the carrier 1 on the guide path 17
5C and place it on the holding mechanism 16. By moving the feed arms 19, 20 synchronously in this manner, the guide paths 17, 18, the carriers 15A on the holding mechanism 16, etc. are intermittently transferred while maintaining equal spacing.

After the carrier 15C to be bonded is placed in a fixed position on the holding mechanism 16, the slide rails 25 and 26 are retracted by the insertion/extraction mechanism as shown in FIG.
6, raise the claws 27, 28, and 29, and then use the camera 7 to detect the IC by pattern recognition or other detection means.
22 positional deviation in the X direction and Y direction △X 5 ΔY
and direction deviation Δθ is detected, and based on the detected value, the actual coordinates are calculated based on the pre-stored coordinates of the pad and lead end of the IC 22, and the X table 10, Y table 12, and rotary table 1
4 to perform open bonding between the pad and the end of the lead.

In that case, as shown in FIG. 8, the holding arrangement 16 is ΔX1
, △Y1, Δθ1, but the slide rail 2
5.26 is retracted so there is no interference.

When the bonding of one carrier 15C is completed, the holding mechanism 16 is returned to the neutral state shown in Figure #56 by the X table 10, Y table 12, and rotary table 14, and the slide rails 25 and 26 are protruded and brought into contact with the holding mechanism 16. ,
The claws 28 and the like are moved in the order of B→C→D→A, and the next carrier 15D is placed on the holding mechanism 16 to perform seven bonding operations.

In the above embodiment, from the bottom to the top, the X table 10, the Y table 10,
Although they are placed in the order of table 12 and rotary table 14, they are not limited to this order and may be placed in any other order. The rotation center axis of the rotary table 14 does not necessarily have to pass through the reference origin 21, but may pass through the optical axis of the camera 7 or another point.
It can also be an axis of direction.

Since the above embodiment is constructed and operates as described above, it can produce the following excellent effects.

(1) Relatively heavy items such as the bonding head 3, camera 7, and illumination light 8 are fixed, and minimal weight is applied to the X table 10, Y table 12, and rotary table 14, so each table can operate extremely quickly. This improves work speed and accuracy.

(2) Since the rotation center axis of the rotary table 14 and the center of the XY table can be aligned with each other or positioned close to each other, errors caused by thermal expansion can be prevented.

(3) Since the bonding arm 4 is not subjected to vibrations in the X, Y and rotational directions, and only receives minimal vibrations in the Z direction, poor bonding positioning and poor bonding can be prevented.

(4) Since camera 7 receives almost no vibration, IC2
It eliminates detection errors due to positional and directional shifts in camera 7 and ITV9, prevents blurring of the ITV9 image, and facilitates accurate observation.
The TV9 has a longer lifespan because it is not subjected to vibrations.

(5) The holding mechanism 16 is divided into a guide path and can be freely displaced as a small unit in the θ direction, the X direction, and the Y direction, thereby improving the working speed.

The effect is as follows.

In addition to the above-mentioned ceramic package, the carrier 15A can also be applied to a lead frame.

According to the present invention, the load on the XY table is minimized, the workbench is made small, and it can be freely displaced, thereby improving coordination and precision, and making it possible to increase bonding work speed. It is possible to provide a device for transporting the body, which has an extremely large practical effect.

[Brief explanation of the drawing]

The drawings relate to an embodiment of the present invention, and FIG. 1 is a front view, FIG. 2 is a side view thereof, FIG. 3 is a plan view taken along line I-I in FIG. 1, and FIG. 4 is a support body. FIGS. 5 and 6 are a front view and a plan view of the vicinity of the holding mechanism, and FIGS. 7 and 8 are a front view and a plan view of the same portion when the position and direction are corrected. 1-m-base frame, 2-1-7 frames, 3---
Bonding head, 4-m-bonding arm,
5-m-capillary, [3--X axis, ? ----Camera, 8-m-lighting light, 9---ITV, 1O---X table, I+---X axis, +2---Y table, +3
---Y axis, 14-m-rotary table, +5A, l
5B-, I 50. +5D, 15E, 15F---supporting body, 16--holding mechanism, 17.18-m-guiding path, 19.20-11 feeding arm, 21-m-reference origin, 22--IC, 23-m-lead, 24-m-wire, 25.26--slide rail, 27.28.2
9-m-claw. Patent Applicant Kaiyo Denki Co., Ltd. Agent Patent Attorney Tadashi Takagi Yukuma Minoru Yakushi 1) Takatsugu Department Figure 2

Claims (1)

[Scope of Claims] The IC carrier is transferred along the entrance-side guide path by a feeding mechanism and placed on the bonding workbench, and after the bonding operation, the I'C carrier is removed from the workbench and moved to the exit by the feeding mechanism. In a transfer device for an IC carrier of a bonding apparatus configured to transfer on a side guide path, the bonding work table 6 is supported so as to be slightly displaceable in a horizontal plane, and the work table of the entrance side and exit side guide paths A slide rail is provided at the front and rear ends of the workbench so as to be able to slide toward and away from the workbench, and the sliderail overlaps the adjacent guideway in the width direction, and the sliderail is attached to the workbench. 1. A transfer device for an IC carrier, wherein the entrance side guide path, slide rail, workbench, slide rail, and exit side guide path are continuously connected when the IC carrier comes into contact with the IC carrier.